EP20K1000CF672I7 - APEX 20KC FPGA, 1M Gates, 672-BGA | Altera
料号： EP20K1000CF672I7 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 50 | $210 | $10,500.00 |
| 100 | $185 | $18,500.00 |
| 500 | $160 | $80,000.00 |
EP20K1000CF672I7 概述
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (LEs), embedded memory, and routing interconnects that can be re-programmed in the field. APEX 20KC sits in the hierarchy: FPGA -> programmable logic device -> logic IC -> integrated circuit. Within the broader system architecture, FPGAs function as glue logic, high-speed interface bridges, DSP accelerators, and rapid-prototyping silicon for ASIC verification, enabling time-to-market advantages over fixed-function ASICs.
The EP20K1000CF672I7 integrates MultiCore architecture with embedded ESB (Embedded System Block) memory, four phase-locked loops (PLLs), and True-LVDS support across all I/O banks. The part is offered in the industrial temperature grade (-40 °C to +85 °C, indicated by the "I7" speed/temperature code) and supports in-system programmability via IEEE 1149.1 (JTAG) and the Altera passive serial configuration scheme, making it well-suited for production programming and field updates.
Typical applications include high-throughput telecommunication backplanes, network switches, custom DSP pipelines, ASIC prototyping, and industrial control cards where the 1M-gate capacity and 672-ball BGA footprint deliver the integration density required for complex multi-channel designs.
A key design consideration for this device is power planning - at full toggle rate the APEX 20KC can consume several watts, so a multi-layer PCB with dedicated power planes and adequate thermal vias under the BGA is recommended for reliable operation.
This page consolidates distributor pricing, drop-in package-equivalent alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： EP20K1000CF672I7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP20K1000CF672I7 （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, Process Technology, Configuration Interface.
快速对比工具——选择替代料号进行并排对比：
EP20K1000CF672C7
✅ 直接替换✓ 有现货
$158 / 个
查看数据手册 →EP20K1000CF672C8
✅ 直接替换✓ 有现货
$245.09 / 个
查看数据手册 →EP20K1000CF672C9ES
✅ 直接替换✓ 有现货
$385 / 个
查看数据手册 →EP20K1000CF672C7ES
✅ 直接替换✓ 有现货
$89.5 / 个
查看数据手册 →EP20K1000CF672C7GZ
✅ 直接替换✓ 有现货
$162.4 / 个
查看数据手册 →EP20K1000CF672I7 最大额定值与电气特性
| Family | APEX 20KC |
| Logic Elements / Cells | 38,400 |
| System Gates | 1,000,000 |
| Maximum Operating Frequency | 375.94 MHz |
| Propagation Delay | 1.4 ns |
| Process Technology | 0.15 µm CMOS |
| Nominal Supply Voltage | 1.8 V |
| Supply Voltage Range | 1.71 V to 1.89 V |
| 封装 | 672-ball FC-FBGA (PBGA672) |
| Ball Pitch | 1.0 mm |
| User I/O Pins | 508 |
| Dedicated Inputs | 4 |
| Embedded Memory Blocks (ESBs) | Yes (MultiCore) |
| PLLs | 4 |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial |
| 工作温度 | -40 °C to +85 °C (Industrial) |
| Speed Grade | 7 |
EP20K1000CF672I7 672-ball fc-fbga (pbga672) 引脚配置指南
EP20K1000CF672I7（672-ball fc-fbga (pbga672) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP20K1000CF672I7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP20K1000CF672I7 适用于 6 应用s: Telecommunication Backplane Aggregation, ASIC Prototyping and Emulation, Custom DSP and Signal Processing Pipelines, Industrial Control and Data Acquisition, Network Switch and Router Line Cards, Legacy Storage and RAID Controller Designs.
Telecommunication Backplane Aggregation
The EP20K1000CF672I7's 1M system gates and 508 user I/O pins make it a strong fit for telecom backplane aggregation designs that need parallel multi-channel processing. In this role it sits between line-side serializers and a network processor, performing serial-to-parallel conversion, channel bonding, and protocol-aware buffering using the device's embedded system blocks (ESBs). The 1.8 V core keeps power manageable in densely populated line cards while the 1.0 mm-pitch 672-ball BGA delivers enough I/O for 32-bit parallel buses and LVDS interconnect. Engineers value the APEX 20KC family for its MultiCore interconnect that simplifies wide datapath routing, and the device's 375.94 MHz internal frequency provides comfortable margin for high-speed state-machine and packet-header inspection tasks at 10 Gbps aggregate rates.
推荐
ASIC Prototyping and Emulation
The EP20K1000CF672I7 is widely used as an ASIC prototyping vehicle because its 1M system gates accommodate large RTL partitions for design teams validating pre-silicon logic. Multiple APEX 20KC parts can be linked via their LVDS-capable I/O to emulate ASIC-to-ASIC interfaces, while the 672-ball BGA keeps board area compact for multi-FPGA emulator boards. The industrial temperature grade (-40 °C to +85 °C) and JTAG-based in-system programmability allow rapid iteration cycles and bring-up in lab environments that simulate harsh operating conditions. Engineers rely on the Altera Quartus II toolchain for APEX 20KC to map ASIC gate-level netlists and verify timing closure before committing to mask sets.
推荐
Custom DSP and Signal Processing Pipelines
With 38,400 logic elements and several hundreds of kbits of embedded memory, the EP20K1000CF672I7 supports custom DSP pipelines that exceed the capacity of off-the-shelf DSP processors while preserving parallel hardware acceleration. The MultiCore architecture's ESBs provide distributed RAM for filter coefficients and delay lines, and the four PLLs enable multiple clock domains required for multi-rate signal processing. At 1.4 ns propagation delay and 375.94 MHz internal frequency, the part can implement FIR/IIR filters, FFT engines, and adaptive beamforming algorithms used in base stations and radar signal chains. The 508 user I/O supports wide sample buses and parallel ADC/DAC interfaces typically seen in such designs.
推荐
Industrial Control and Data Acquisition
Industrial control cards benefit from the EP20K1000CF672I7's combination of high logic density, 508 user I/O, and the -40 °C to +85 °C industrial temperature rating. The device can host multiple real-time control loops, motion-control state machines, and high-speed data-acquisition front ends on a single chip, replacing several discrete microcontrollers and DSPs. Its JTAG and passive-serial configuration support field updates over industrial networks, allowing remote firmware refresh in installed equipment. The 1.8 V core regulator budget is straightforward for industrial 24 V systems when paired with a step-down converter, and the 672-ball BGA delivers dense I/O for parallel ADC front ends and isolated digital I/O banks.
推荐
Network Switch and Router Line Cards
Line cards for enterprise and carrier-grade network switches leverage the EP20K1000CF672I7 to implement multi-gigabit packet classification, traffic shaping, and queuing functions. The 508 user I/O and four PLLs enable multiple SERDES-side parallel interfaces to network processors and PHY devices, while the embedded ESBs hold deep packet buffers and lookup tables without external SRAM. Industrial temperature operation is suitable for temperature-controlled but space-constrained central-office racks, and the BGA package supports the dense routing required for backplane connectors running SPI-4.2, GMII, or proprietary LVDS interfaces. Designers appreciate the deterministic 1.4 ns propagation delay when budgeting timing across multiple pipeline stages.
推荐
Legacy Storage and RAID Controller Designs
Legacy storage controllers and RAID accelerator cards have historically used the EP20K1000CF672I7 for XOR compute engines, parity generation, and SAS/SATA protocol bridging. The 1M gates provide capacity for RAID-6 dual-parity engines, command queuing logic, and host-side PCIe/PCI-X bridge glue logic when paired with an external PHY. The embedded memory is sufficient for sector buffers and command descriptor rings, while the 508 user I/O supports multiple SATA channels and flash interfaces. Although newer Cyclone and Stratix devices offer better power efficiency, the APEX 20KC remains in many long-lifecycle enterprise storage designs where reuse of validated firmware and tooling outweighs silicon upgrades.
推荐
推荐产品汇总
工程参考数据： EP20K1000CF672I7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP20K1000CF672C7 | EP20K1000CF672C8 | EP20K1000CF672C9ES | EP20K1000CF672C7ES | EP20K1000CF672C7GZ |
|---|---|---|---|---|---|---|
| Package | 672-ball FC-FBGA (PBGA672) | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Speed Grade | 7 (industrial) | 7 (commercial) | 8 (commercial) | 9 (commercial ES) | 7 (commercial ES) | 7 (commercial GZ) |
| Operating Temperature | -40 °C to +85 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| User I/O | 508 | 508 | 508 | 508 | 508 | 508 |
| Internal Frequency | 375.94 MHz | 375.94 MHz | Lower (speed 8) | Lower (speed 9) | 375.94 MHz | 375.94 MHz |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Industrial temperature grade at same speed as commercial speed-grade 7 （对比 EP20K1000CF672C7)
- Maximum 375.94 MHz internal frequency in the 672-ball package （对比 EP20K1000CF672C9ES)
- APEX 20KC architecture with MultiCore interconnect （对比 EPF10K130EFI484-2 (FLEX 10KE))
设计说明
Estimated: at full utilisation with ~50 % toggle rate and 1.8 V core, the EP20K1000CF672I7 can dissipate several watts and the 672-ball FC-FBGA requires substantial copper thermal management. Place a continuous 4-layer ground/power plane directly under the BGA and add a via-array thermal pad (0.3 mm drilled, 1.0 mm pitch) connecting the BGA die pad to the bottom copper flood, populated with solder to reduce θJA. In enclosed industrial enclosures, verify junction temperature in worst-case ambient using the manufacturer's thermal model before locking the mechanical design.
Use microvia-in-pad escape for the outermost 2-3 rows of the 672-ball FC-FBGA on a 1.0 mm pitch. Maintain a 50 Ω controlled-impedance single-ended and 100 Ω differential impedance on LVDS pairs routed through the outer BGA rows; this requires an 8-layer stack-up with at least one inner solid reference plane per routing layer. Avoid placing bypass capacitors more than 1 mm from the BGA perimeter to keep VCC rail loop inductance below 1 nH for switching noise suppression.
Do not confuse the APEX 20KC (1.8 V core) with APEX 20K (2.5 V core) - the EP20K1000CF672I7 operates strictly at 1.71-1.89 V, and using 2.5 V will damage the device. Similarly, when migrating to APEX 20KE parts in the same 672-ball BGA, double-check that the chosen configuration bitstream is compiled for the 20KE architecture (different bitstream header) before programming. Always terminate JTAG (TCK, TMS, TDI, TDO) according to IEEE 1149.1 with 10 kΩ pull-ups to VCCIO for reliable in-system programming.
Route configuration signals (nCE, nCONFIG, nSTATUS, CONF_DONE, DCLK) away from high-speed LVDS I/O to avoid coupling noise into the passive-serial configuration chain. Keep all 1.8 V VCC balls powered even when the device is in reset, because logic supplies to I/O cells must remain stable to prevent inrush during reconfiguration. For multi-FPGA boards, isolate each part's JTAG chain with a unique device ID and series 100 Ω termination on TCK/TMS to prevent ringing across long programming cables.
合规信息
Compliance data not directly supplied in verified web data; the original APEX 20KC family was released before RoHS mandates and many date codes are non-RoHS, while later ES variants may be RoHS/lead-free. Verify with manufacturer lot code before production use.
