EP20K1000CF672C9ES - 1M Gate APEX 20KC FPGA 508 I/O | Intel
MPN: EP20K1000CF672C9ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462.5 | $4,625.00 |
| 100 | $437 | $43,700.00 |
| 500 | $410 | $205,000.00 |
| 1,000 | $385 | $385,000.00 |
Drop-in alternatives for EP20K1000CF672C9ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
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View Datasheet →EP20K1000CF672C9ES Maximum Ratings & Electrical Characteristics
| Series | APEX 20KC |
| Number of Logic Elements/Cells | 38,400 |
| System Gates | 1,000,000 |
| Number of LABs/CLBs | 3,840 |
| Total RAM Bits | 327,680 |
| Number of User I/O | 508 |
| Core Supply Voltage | 1.71 V to 1.89 V |
| Process Technology | 0.15 µm |
| Internal Performance Grade | 250 MHz |
| Operating Temperature (TJ) | 0 °C to 85 °C |
| Package | 672-FBGA (27 x 27 mm) |
| Mounting Type | Surface Mount |
| Supplier Device Package | 672-FBGA |
EP20K1000CF672C9ES 672-fbga Pin Configuration Guide
Complete pinout information for EP20K1000CF672C9ES (672-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K1000CF672C9ES.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K1000CF672C9ES is suitable for 6 applications: Telecom Line-Card Processing, High-Speed Serial Protocol Bridging, Industrial Machine Vision Pipelines, Test and Measurement Instrumentation, Legacy FPGA Board Repair and Sustaining, DSP Front-End Data Acquisition.
Telecom Line-Card Processing
The EP20K1000CF672C9ES fits telecom line-card processing because its 38,400 logic elements and 508 user I/Os implement wide parallel backplane buses, ATM/SONET framers, and HDLC controllers on a single die. The 327,680 bits of embedded RAM buffer cells and packet descriptors without external SRAM, while 250 MHz performance grade supports OC-48 (2.5 Gbps) class throughput when paired with external SERDES. Compared with newer Cyclone families, the APEX 20KC delivers equivalent gate density at mature 0.15 µm, which many legacy central-office designs still specify. Designers should pair the FPGA with 1.8 V core and 2.5 V/3.3 V I/O bank supplies, using per-bank VCCIO to interface ECL/CMOS line-interface units. The 672-FBGA package requires JEDEC-compliant reflow and four-layer-plus stack-ups to maintain signal integrity on 508 I/Os.
Recommended
High-Speed Serial Protocol Bridging
The EP20K1000CF672C9ES is well suited to high-speed serial protocol bridging between SPI, I2C, UART, proprietary LVDS, and parallel buses where off-the-shelf ASSPs are unavailable. Its 38,400 logic elements implement state machines, FIFO controllers, and CRC engines in parallel, while 327 kbit of embedded RAM stages packets without external memory. The 250 MHz grade supports 200+ MHz internal operation with pipelined datapaths. Compared with CPLDs, the APEX 20KC handles multi-channel bridging without exhausting logic, and 508 I/Os allow direct fanout to backplane connectors. Engineers should use Quartus II's LogicLock to floorplan critical paths and reserve dedicated clock pins for serializer/deserializer logic. Power planning must address the 1.8 V core (linear LDO from 2.5 V) and per-bank VCCIO for mixed-voltage peripherals.
Recommended
Industrial Machine Vision Pipelines
The EP20K1000CF672C9ES supports industrial machine vision pipelines where image sensors stream parallel pixel data at 40-80 MHz. The device's 38,400 logic elements implement Bayer demosaicing, color-space conversion, edge detection, and histogram accumulation in real time, while 327 kbit embedded RAM holds line buffers without external SRAM. With 508 user I/Os, designers can interface Camera Link, LVDS, and parallel CMOS sensors directly. The 250 MHz performance grade sustains 1080p60 throughput when pipelined, and the 0 °C to 85 °C junction range covers factory-floor environments. Compared with DSPs, the APEX 20KC achieves higher pixel throughput per watt on custom kernels. Use 1.8 V core LDO with bulk decoupling, expose JTAG for factory programming, and verify reflow profile meets JEDEC J-STD-020 for the 672-FBGA.
Recommended
Test and Measurement Instrumentation
The EP20K1000CF672C9ES is used in test-and-measurement instrumentation such as logic analyzers, protocol exercisers, and ATE pin-electronics cards. Its 508 I/Os drive and receive high-channel-count test points, while 38,400 logic elements implement pattern generators, comparator trees, and timing engines in a single device. The 327,680-bit RAM stores captured waveform segments for post-processing, eliminating external SRAM. The 250 MHz grade supports 200 MHz state-based stimulus, which covers most digital bus standards. Compared with microcontrollers, the FPGA delivers deterministic timing and parallel I/O updates. The 672-FBGA footprint simplifies routing on multi-layer test-head boards. Designers should use Quartus II's TimeQuest to constrain setup/hold across 508 I/Os and provision JTAG boundary-scan for board-level test.
Recommended
Legacy FPGA Board Repair and Sustaining
The EP20K1000CF672C9ES remains valuable for legacy FPGA board repair and sustaining engineering where existing designs depend on the APEX 20KC silicon and 672-FBGA footprint. Its 1,000,000 system gates and 38,400 logic elements replicate the original design's logic density exactly, and the 672-ball FBGA is pin-compatible with C7/C8 speed-grade variants, allowing same-footprint replacements. Engineers performing board repair can substitute the faster C7/C8 parts to gain timing margin without redesign. The 0 °C to 85 °C junction range matches the original industrial spec. Compared with migrating to newer families, sustaining on APEX 20KC avoids costly PCB rework and qualification cycles. Procure through last-time-buy agreements and validate bitstream compatibility in Quartus II legacy toolchain before deploying.
Recommended
DSP Front-End Data Acquisition
The EP20K1000CF672C9ES supports DSP front-end data acquisition by implementing FIR filters, FFT pre-processors, and decimation chains ahead of external DSP or DAC. Its 38,400 logic elements and embedded multipliers handle 18-bit x 18-bit MAC operations in parallel, while 327,680 bits of RAM stage coefficients and overlap-save buffers. The 508 I/Os accept parallel ADC data at sample rates up to 200 MHz when pipelined. Compared with dedicated DSP processors, the APEX 20KC achieves higher throughput on custom kernels and avoids software overhead. Designers should use Quartus II DSP Builder or hand-coded RTL for filter implementations, and constrain clock-domain crossings carefully between the 250 MHz logic and the ADC sample clock. The 672-FBGA package requires 6+ layer PCB stack-up for signal integrity.
Recommended
Recommended Products Summary
Engineering reference data for EP20K1000CF672C9ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K1000CF672C7ES | EP20K1000CF672C8ES | EP20K1000CF672C7 | EP20K1000CF672C7GZ | EP20K1000CF672C8N | EP20K1000CF672C8 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (27x27) | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same | 672-FBGA (27x27) - same |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Speed Grade | C9 (9 ns) | C7 (faster) | C8 (faster) | C7 (faster) | C7 (faster) | C8 (faster) | C8 (faster) |
| User I/O | 508 | 508 | 508 | 508 | 508 | 508 | 508 |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Total RAM Bits | 327,680 | 327,680 | 327,680 | 327,680 | 327,680 | 327,680 | 327,680 |
| Shipping Media | Tray (ES) | Tray (ES) | Tray (ES) | Tray/Tape | Green/RoHS | Lead-free (N) | Tray/Tape |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- ES suffix denotes engineering-sample shipping media (vs EP20K1000CF672C7ES)
- C9 speed grade is the slowest tier in the APEX 20KC 672-FBGA family (vs EP20K1000CF672C7ES)
- Lead-free N media variant available (vs EP20K1000CF672C8N)
Design Notes
The EP20K1000CF672C9ES draws significant core current from the 1.8 V VCCINT rail under full utilization. Estimated: at 250 MHz with 80% logic utilization, typical core current reaches 2-3 A, requiring a low-dropout regulator with at least 4 A headroom. Use bulk decoupling (4 x 100 µF tantalum + 16 x 0.1 µF ceramic) directly under the BGA, and route a power plane on an inner PCB layer for VCCINT. Per-bank VCCIO supplies (2.5 V or 3.3 V) must be independently decoupled to prevent I/O switching noise from coupling into the core supply.
The 672-FBGA package has a 1.0 mm ball pitch, requiring microvia (laser-drilled) or via-in-pad PCB technology to fan out 508 user I/Os plus power and ground. Estimated: a 6-layer stack-up with two signal layers and two dedicated power planes is the practical minimum. Trace impedance should target 50 Ω single-ended and 100 Ω differential for LVDS pairs. Follow JEDEC J-STD-020 reflow profiles and MSL3 handling (or better) to avoid package warpage; large BGAs are sensitive to moisture-induced delamination during assembly.
Estimated: at full 250 MHz operation with high toggle rates, junction-to-ambient thermal resistance (theta_JA) for the 27 x 27 mm FBGA on a 6-layer JEDEC board is approximately 15-18 °C/W. With 2.5 W dissipation, junction temperature rises 38-45 °C above ambient, well within the 85 °C TJ limit. Designers pushing 4 W or more should add thermal vias under the exposed die pad and consider forced-air cooling. Always validate thermal performance with the manufacturer's PowerPlay Early Power Estimator before committing to a PCB stack-up.
Common pitfalls when designing with the EP20K1000CF672C9ES include: (1) using a Quartus Prime version that has dropped APEX 20KC support — pin Quartus II 13.0 or earlier; (2) ignoring per-bank VCCIO mixing rules, which causes input buffer latch-up; (3) omitting JTAG chain termination on boards with multiple FPGAs, leading to configuration failures; (4) relying on asynchronous reset logic, which fails metastability testing on high-speed paths. Always generate the bitstream with the 'Verify' option enabled and run TimeQuest timing analysis across all 508 I/Os before tape-out.
Compliance Information
Compliance status not explicitly stated in the verified web data. The 'ES' suffix on this part indicates engineering-sample shipping media; the 'N' suffix variants (e.g., EP20K1000CF672C8N) typically denote lead-free finishes per Intel/Altera naming convention, but this should be confirmed against the lot-specific Certificate of Conformance. AEC-Q100 is not applicable to commercial-grade FPGAs in this family.
