EP20K100CF324C7ES - 100K APEX-20K FPGA 4160 LEs 246 I/O | Intel
料号： EP20K100CF324C7ES ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64 | $6,400.00 |
| 250 | $58.5 | $14,625.00 |
| 500 | $52.75 | $26,375.00 |
EP20K100CF324C7ES 概述
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. FPGAs sit within the programmable logic taxonomy: CPLD < FPGA (small, low-density, non-volatile) → FPGA (volatile SRAM-based, high-density, rich I/O) → SoC FPGA (integrated hard-core processors). The APEX-20K family sits at the high-density, embedded-memory-rich end of this hierarchy and was one of the first families to combine look-up table (LUT) logic with embedded system blocks (ESBs) that double as dual-port RAM, ROM, or content-addressable memory. This hypernym chain — FPGA → programmable logic → programmable logic device (PLD) → digital ASIC alternative — helps map the part to the broader silicon taxonomy.
Key features include 16 embedded system blocks (ESBs) for distributed memory, four phase-locked loops (PLLs) for clock management, and support for LVTTL, LVCMOS, PCI, SSTL, and GTL+ I/O standards. The FineLine BGA-324 (19x19 mm) package supports high-density board layouts while exposing 246 I/O for high-bandwidth interfaces. The C7 speed grade is the slowest in the APEX-20K family, prioritizing low quiescent current and cost over raw clock frequency.
The device uses a LUT-based logic fabric with embedded array blocks (EABs/ESBs) providing distributed synchronous RAM. Its MultiCore architecture connects the logic array, memory, and I/O elements via a continuous, predictable routing structure that simplifies timing closure. The 2.5V core, 5V-tolerant I/O cells, and dedicated clock networks let the part serve as a glue-less interface between microprocessors, memory buses, and high-speed parallel peripherals in mid-density systems.
Typical applications include PCI bus bridges, custom peripheral controllers for industrial backplanes, telecom line-card glue logic, and DSP co-processing front-ends. The device is also commonly seen in legacy POS terminals, printers, and high-channel-count data acquisition front-ends where 246 I/O are valuable and a soft-core CPU can be synthesized in fabric.
When designing with this part, verify I/O bank voltage compatibility before assigning mixed-voltage signals to the same bank. The SRAM-based configuration requires a configuration device (EPC) or microprocessor boot stream at every power-up, since in-design state is volatile. Long lead times are common because the APEX-20K family is now in obsolescence planning — order quantities, lifecycle status, and last-time-buy dates should be confirmed with the supply chain before committing to a new design.
直接替换替代料： EP20K100CF324C7ES ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP20K100CF324C7ES （相同外形与封装尺寸） ——差异在于 Operating Temperature, Speed Grade, Family, Process Technology, Series.
快速对比工具——选择替代料号进行并排对比：
EP20K100CF324C7
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$27.8 / 个
查看数据手册 →EP20K100CF324C7ES 最大额定值与电气特性
| Family | APEX-20K |
| Logic Elements / Cells | 4160 |
| Total System Gates | 263000 |
| Number of I/O | 246 |
| Number of Logic Elements/Cells | 4160 |
| Total RAM Bits | 53248 |
| Number of Embedded System Blocks (ESBs) | 16 |
| Number of PLLs | 4 |
| Voltage - Supply | 2.375 V to 2.625 V |
| 工作温度 | 0C to +85C |
| Speed Grade | C7 |
| 安装类型 | Surface Mount |
| 封装 / 外壳 | 324-FBGA (19x19 mm) |
| Supplier Device Package | 324-FBGA (19x19) |
| Process Technology | 0.22 micrometer CMOS |
| RoHS 状态 | unknown |
EP20K100CF324C7ES 324-fbga (19x19) 引脚配置指南
EP20K100CF324C7ES（324-fbga (19x19) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP20K100CF324C7ES.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP20K100CF324C7ES 适用于 6 应用s: PCI Bus Bridge and Interface Controller, Custom Peripheral Controller for Industrial Backplanes, Telecom Line-Card Glue Logic, DSP Co-Processing Front-End, Legacy POS Terminal and Printer Controller, High-Channel Data Acquisition Front-End.
PCI Bus Bridge and Interface Controller
The EP20K100CF324C7ES is well-suited for PCI 2.2/3.0 bridge applications thanks to its 246 user I/O count, 3.3V PCI-compatible I/O standard support, and 4,160 logic elements. The APEX-20K LUT fabric and embedded system blocks allow a single chip to implement a target or master PCI core plus custom peripheral glue logic. With 4 PLLs available, the device can derive 33 MHz PCI clocks internally while still exposing an asynchronous local bus for the host CPU. Compared with discrete TTL bridge designs, the FPGA reduces board area and BOM cost while allowing in-system reconfiguration when bridge revision updates are required.
推荐
Custom Peripheral Controller for Industrial Backplanes
Industrial backplanes need glue logic to interface legacy parallel buses (VME, ISA, PC/104) to modern processors. The EP20K100CF324C7ES delivers 246 I/O and 53,248 bits of embedded RAM, which is enough to build parallel bus arbiters, address decoders, FIFOs, and interrupt controllers in a single device. The 2.5V core and I/O banks programmable to 3.3V or 5V TTL simplify interfacing to mixed-voltage backplane signals. The C7 speed grade keeps power dissipation manageable in sealed industrial enclosures without active cooling, while Quartus II allows in-field firmware updates for new peripherals.
推荐
Telecom Line-Card Glue Logic
Telecom line cards rely on FPGAs to bridge framers, serializers, and network processors to TDM/Ethernet backplanes. The EP20K100CF324C7ES provides 4,160 LEs and 246 I/O sufficient for HDLC controllers, framer interfaces, and clock-data recovery glue logic. Its 4 PLLs allow hitless reference switching between primary and secondary timing sources, a key telecom requirement. The C7 speed grade is fast enough for 155 MHz Utopia or POS-PHY interfaces while keeping power low enough for sealed line-card slots.
推荐
DSP Co-Processing Front-End
The EP20K100CF324C7ES works as a co-processor front-end that conditions and routes data to a downstream DSP. With 16 embedded system blocks, the device can hold FIFO queues, coefficient tables, and bit-reversal buffers without consuming logic resources. The 4 PLLs allow the FPGA to derive different sample-rate clocks from a single reference, eliminating external clock-generator ICs. Its 246 I/O pins accommodate parallel ADC/DAC buses, while the LUT-based fabric can implement FIR filters, decimators, and address generators in a single chip.
推荐
Legacy POS Terminal and Printer Controller
POS terminals and industrial printers combine display drivers, keyboard scanners, motor controllers, and serial port glue in a single chassis. The EP20K100CF324C7ES with 246 I/O and embedded RAM can host all these peripherals while exposing a single fast interface to the main CPU. The C7 speed grade keeps the BOM cost low for cost-sensitive commercial designs. Because the part is widely supported by MAX+PLUS II and Quartus II, long-lifecycle commercial OEMs can continue maintenance releases without retraining engineering staff.
推荐
High-Channel Data Acquisition Front-End
Multi-channel data acquisition systems need to sample and buffer many analog signals simultaneously. The EP20K100CF324C7ES exposes 246 I/O suitable for parallel LVCMOS ADC interfaces and provides 53,248 bits of embedded RAM that can be configured as dual-port FIFOs between the ADC bus and a downstream DMA controller. Four PLLs allow per-channel sample-rate generation, and the LUT fabric can host on-chip FIR decimation filters. Designers migrating from discrete TTL logic save board area and gain the ability to update the FIR coefficients in-system for different measurement campaigns.
推荐
推荐产品汇总
工程参考数据： EP20K100CF324C7ES ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP20K100CF324C7 |
|---|---|---|
| Package | 324-FBGA (19x19) | 324-FBGA (19x19) - same |
| Brand | Intel | Intel - same |
| Logic Elements | 4160 | 4160 |
| System Gates | 263000 | 263000 |
| Number of I/O | 246 | 246 |
| Embedded RAM Bits | 53248 | 53248 |
| Speed Grade | C7 | C7 |
| Core Voltage | 2.375V to 2.625V | 2.375V to 2.625V |
关键差异点
- Highest I/O count in the APEX-20K family at this speed grade （对比 EP20K100CF144C8)
- Embedded system blocks (ESBs) provide distributed dual-port memory （对比 EP20K100FC324-2X)
- Integrated PLLs reduce external clock-generator BOM cost （对比 Discrete PLLs + EPF10K30A)
设计说明
The EP20K100CF324C7ES core operates from a 2.375V to 2.625V supply with separate VCCIO rails per I/O bank. Decouple each VCC and VCCIO pin with a 0.1uF X7R ceramic capacitor placed as close as physically possible to the package ball, plus a bulk 10uF tantalum per bank. Estimated: a typical APEX-20K design with 60% utilization draws 0.8A to 1.2A from the 2.5V rail, so budget 1.5A headroom on the regulator. Use a low-noise LDO such as the TPS7A4701 family if analog performance matters.
The 324-FBGA package has a 1.0mm ball pitch, so escape routing must use 4 mil traces and 0.4mm via pads to break out the inner balls. Plan a 6-layer stackup with two inner solid ground planes under the BGA; via-in-pad is recommended for inner-row balls. Estimated: a single fanout of the 19x19 grid needs approximately 1.0 cm of board area, plus 1.0 mm clearance to adjacent components for rework. Match the high-speed signals and place series termination resistors within 3 mm of the FPGA balls.
Configuration is volatile — without a serial configuration device (EPC2/EPC4/EPC8/EPC16) the FPGA does not boot on power-up. The CONF_DONE pin must be monitored during boot, and JTAG signals must be brought to a header for in-system programming. Estimated: configuration time for a fully loaded EP20K100 is 60-150 ms via passive serial mode. Do not enable multi-device JTAG chains without isolating TMS and TCK with bus drivers, otherwise contention during configuration can corrupt the bitstream.
Estimate: an APEX-20K device at 60% utilization, 100 MHz internal clock, and 50% I/O toggling dissipates approximately 1.0W to 1.5W. The 324-FBGA package has a theta_JA around 15 C/W with a 6-layer board and sufficient copper pour, so junction temperature stays below 100C without an explicit heatsink. Add thermal vias under the central BGA balls to spread heat into inner ground planes if the device sits in a sealed enclosure with no airflow.
Mixing 3.3V PCI and 5V TTL signals on the same I/O bank is not allowed — each bank shares one VCCIO rail. Drive clocks through dedicated CLK pins and PLL inputs to keep skew below 200 ps. Estimated: long (>5 cm) LVTTL traces above 50 MHz require source-series termination (33 ohm) to control ringing. Use HyperLynx or Quartus II signal integrity analysis for backplane interfaces.
合规信息
RoHS/REACH compliance not stated in distributor listings. APEX-20K family uses lead-bearing BGA balls in some variants; request manufacturer's material declaration before assuming lead-free compliance. AEC-Q100 not applicable — part targets commercial/industrial, not automotive.
