EP2AGZ300FH29I4G vs EP2AGZ300FH29C4N 对比

详细并排对比 EP2AGZ300FH29I4G 出自 Intel 和 EP2AGZ300FH29C4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP2AGZ300FH29I4G EP2AGZ300FH29C4N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $1,350.00 $1,395.00
Family Arria II GZ (AGZ) Arria II GZ
Logic Elements (LE) 300,000 (approx., per family member) 298,000
Number of I/O 281 —
Package Type 780-ball Flip-Chip BGA (FineLine) —
Package Code FH29 (29x29 mm) —
工作温度范围 -40C to +100C (industrial, I-grade) —
Speed Grade I4 C4
Process Node 40 nm TSMC 40 nm
Supply Voltage (Core) 0.9 V (typical) —
Configuration Method JTAG / Passive Serial / Fast Passive Parallel —
Transceivers Embedded multi-gigabit transceivers (per family) Up to 28 (up to 6.375 Gbps)
DSP Blocks Yes (variable-precision, per family) [DATA_NEEDED: exact DSP block count for EP2AGZ300]
Block RAM Embedded M9K / M144K blocks —
RoHS 状态 Compliant Compliant
安装类型 Surface Mount (BGA) Surface Mount (BGA)
MSL 等级 [DATA_NEEDED: MSL rating] —
Lead-Free Yes (per RoHS) —
Logic Array Blocks (LABs) — 11,920
Adaptive Logic Modules (ALMs) — 119,200
Embedded Memory (bits) — 18,854,912
User I/O Pins — 281
Core Voltage — 0.9 V
封装 — 780-ball FC-HFBGA (FH29)
Temperature Grade — Industrial (N suffix)

数据手册与资源

浏览全部产品 创建 BOM 获取报价