EP2C35F672I8N - 33K LE Cyclone II FPGA, 672-BGA | Intel
料号： EP2C35F672I8N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $151.47 | $151.47 |
| 10 | $142.5 | $1,425.00 |
| 100 | $128 | $12,800.00 |
| 500 | $115 | $57,500.00 |
| 1,000 | $98.5 | $98,500.00 |
EP2C35F672I8N 概述
A Field-Programmable Gate Array is a reconfigurable digital integrated circuit whose logic fabric, interconnect, and I/O can be electrically programmed after PCB assembly. Within the broader silicon taxonomy, FPGAs sit alongside ASICs, microcontrollers, and DSPs as programmable logic devices, but uniquely offer hardware-level parallelism, sub-cycle latency, and on-the-fly reconfiguration. Cyclone II represents Altera's second-generation low-cost FPGA family, optimized for high-volume cost-sensitive designs where ASIC NRE is unjustified.
Key features of the EP2C35F672I8N include 33,216 logic elements, 35 embedded 18x18 multipliers (132 9x9 multipliers) for DSP-style arithmetic, 483,840 bits of embedded RAM arranged across M4K blocks, 475 user I/O pins, and four phase-locked loops for clock synthesis and management. The 672-BGA package provides 35x35 ball array with 1.0 mm pitch, enabling dense PCB escape routing while still allowing conventional reflow assembly.
Architecturally, the Cyclone II device uses a four-input look-up table (LUT4) logic element, true dual-port M4K memory blocks, and dedicated multiplier blocks adjacent to the logic array. The 672-BGA package supports up to 8 high-speed LVDS channels and 16 global clock networks. Configuration is loaded through passive serial (PS), fast passive parallel (FPP), or JTAG modes using the Altera Quartus design toolchain.
Typical applications span industrial motor control, video processing pipelines, software-defined radio front-ends, automotive driver-assistance prototyping, communications protocol bridging, and cost-optimized ASIC prototyping where moderate logic density and abundant I/O are required. The 475 user I/O count and 35 hardware multipliers make it well suited to parallel data acquisition and image preprocessing.
When designing with the EP2C35F672I8N, ensure the PCB layout honors the BGA escape pattern with microvia or via-in-pad technology to reach inner-layer routing. Confirm that JTAG, configuration, and decoupling pins are accessible to the programmer, and that the PLL power supply filtering follows the Cyclone II handbook reference schematic.
This page synthesizes distributor pricing, package-equivalent drop-in alternatives from the same Cyclone II family, and practical design notes not found in the manufacturer datasheet, giving the engineer a single source for cross-brand replacement decisions and reference-design companion parts.
直接替换替代料： EP2C35F672I8N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2C35F672I8N （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, RoHS Status, Operating Temperature, Process Technology.
快速对比工具——选择替代料号进行并排对比：
EP2C35F672I8
✅ 直接替换✓ 有现货
$104.5 / 个
查看数据手册 →EP2C35F672C8N
✅ 直接替换✓ 有现货
$77.14 / 个
查看数据手册 →EP2C35F672C7N
✅ 直接替换✓ 有现货
$98 / 个
查看数据手册 →EP2C35F672C6N
✅ 直接替换✓ 有现货
$122.5 / 个
查看数据手册 →EP2C35F672C8
✅ 直接替换✓ 有现货
$71.85 / 个
查看数据手册 →EP2C35F672C7
✅ 直接替换✓ 有现货
$119.95 / 个
查看数据手册 →EP2C35F672I8N 最大额定值与电气特性
| Series | Cyclone II |
| Family | Cyclone II |
| Logic Elements (LE) | 33,216 |
| Total Memory Bits | 483,840 |
| Embedded Multipliers (18x18) | 35 |
| Embedded Multipliers (9x9) | 132 |
| User I/O Count | 475 |
| Number of PLLs | 4 |
| 封装 | 672-BGA (FineLine) |
| Ball Pitch | 1.0 mm |
| Process Node | 90 nm CMOS |
| 工作温度 | -40C to +100C (industrial) |
| Speed Grade | 8 |
| 安装类型 | Surface Mount |
| Lead-Free / RoHS | Yes (N suffix) |
| Configuration Modes | PS, FPP, JTAG |
| Supply Voltage Core | 1.2 V (typical) |
EP2C35F672I8N 672-bga (fineline) 引脚配置指南
EP2C35F672I8N（672-bga (fineline) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2C35F672I8N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2C35F672I8N 适用于 6 应用s: Industrial Motor Control, Video Processing Pipeline, Software Defined Radio (SDR) Front-End, ASIC Prototyping and Emulation, Automotive Driver Assistance Prototyping, Communications Protocol Bridging.
Industrial Motor Control
The EP2C35F672I8N fits industrial motor-control applications because its 33,216 logic elements can host multi-axis field-oriented control (FOC) state machines while the 35 dedicated 18x18 multipliers execute the Park/Clarke transforms and PI regulators in parallel. The 475 user I/O pins provide ample headroom for multi-channel PWM outputs, encoder feedback (QEP), and CAN/RS-485 comms. Industrial temperature grade -40C to +100C supports factory-floor deployment without derating. Used between the gate driver and the IGBT power stage, paired with EP2C20F256I8N as a co-processor for safety-watchdog logic.
推荐
Video Processing Pipeline
With 483,840 bits of embedded RAM organized in M4K blocks, the EP2C35F672I8N can buffer full-HD video lines in real time for deinterlacing, scaling, or color-space conversion. The 35 hardware multipliers accelerate 2D filter kernels (Sobel, Gaussian) and motion estimation, while 475 user I/O pins accommodate parallel ITU-R BT.656 / BT.1120 buses plus DDR memory interface. Industrial temperature grade suits outdoor digital signage and surveillance applications. Pairs naturally with EPCS configuration flash and external DDR SDRAM.
推荐
Software Defined Radio (SDR) Front-End
The EP2C35F672I8N's combination of 35 hardware multipliers and abundant logic elements makes it well suited to baseband DSP for narrow-band SDR prototypes, including digital down-conversion (DDC), channelization, and demodulation (PSK, QAM, FSK). The four PLLs generate the precise sampling clocks required for ADC interfacing. Industrial temperature grade enables portable field-deployable radios. Often used with high-speed ADC/DAC front-ends and paired with Cyclone II development kits.
推荐
ASIC Prototyping and Emulation
The 33,216 LE capacity positions EP2C35F672I8N as a mid-density ASIC prototyping platform, capable of emulating subsystems of larger ASIC designs including CPUs, DSPs, and protocol stacks. Designers partition ASIC RTL across multiple EP2C35F672I8N devices using the 475 user I/O as chip-to-chip interconnect channels. Industrial temperature grade supports bring-up in production test fixtures. Common in university and corporate ASIC bring-up labs.
推荐
Automotive Driver Assistance Prototyping
Although not AEC-Q100 qualified, the EP2C35F672I8N is widely used in pre-production prototyping of ADAS algorithms such as lane detection, radar pre-processing, and sensor fusion. The 475 user I/O pins accommodate multiple camera and radar sensor inputs simultaneously, while the 35 hardware multipliers handle real-time convolution and FFT operations. Engineering teams typically validate algorithms on this Cyclone II device before porting to AEC-Q100-qualified Cyclone III or Cyclone IV Auto parts.
推荐
Communications Protocol Bridging
The EP2C35F672I8N's 475 user I/O make it an effective bridge between legacy parallel buses and modern serial protocols such as SPI, I2C, UART, PCIe, and Ethernet. The 33,216 LE allow multiple protocol stacks to run concurrently with hardware state machines for low-latency packet forwarding. Industrial temperature grade supports telecom and industrial networking equipment. Often deployed in protocol converter and IoT gateway products.
推荐
推荐产品汇总
工程参考数据： EP2C35F672I8N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2C35F672I8 | EP2C35F672C8N | EP2C35F672C7N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 672-BGA (FineLine) | 672-BGA (FineLine) - same | 672-BGA (FineLine) - same | 672-BGA (FineLine) - same |
| Logic Elements | 33,216 LE | 33,216 LE | 33,216 LE | 33,216 LE |
| Embedded RAM | 483,840 bits | 483,840 bits | 483,840 bits | 483,840 bits |
| 18x18 Multipliers | 35 | 35 | 35 | 35 |
| User I/O Count | 475 | 475 | 475 | 475 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 8 | 8 | 8 | 7 (slower Fmax) |
| RoHS Compliance | Yes (N suffix) | No (SnPb finish) | Yes (N suffix) | Yes (N suffix) |
关键差异点
- Industrial temperature grade vs commercial-grade same-package alternatives （对比 EP2C35F672C8N)
- Pb-free RoHS-compliant terminal finish vs legacy SnPb （对比 EP2C35F672I8)
- Speed grade 8 vs speed grade 7 variants （对比 EP2C35F672C7N)
设计说明
The 672-BGA package uses 1.0 mm ball pitch, which is at the practical limit of conventional PCB fabrication. Designers should plan for microvia or via-in-pad technology to achieve reliable inner-layer escape routing. A 4-layer or 6-layer stack-up with buried capacitance is recommended for the inner power/ground plane pair. Maintain a continuous ground plane beneath the BGA to control return-path impedance and reduce SSO noise. Estimated: signal escape assumes 0.1 mm trace/space on outer microvia layer.
Cyclone II devices require at least three separate supply rails: VCCINT (1.2 V core), VCCIO (1.5 V to 3.3 V I/O bank, bank-dependent), and VCC_PLL (1.2 V analog PLL supply). Decoupling must follow the handbook reference schematic with 0.1 uF and 10 uF combinations near every power pin. Use a ferrite bead to isolate VCC_PLL from VCCINT noise. Estimated: bulk decoupling at 1 uF per PLLs and 0.1 uF per VCCIO pin.
Match JTAG chain length and impedance to the 4-wire TMS/TCK/TDO/TDI specification. Provide a robust 4.7 kohm pull-up on TCK and TDI, and route configuration signals away from switching I/O to avoid configuration corruption during power-up. Expose JTAG and AS/PS configuration mode pins to accessible test points or header pins for in-field reprogramming. Cyclone II recommends 25 MHz MSEL settings for active serial configuration with EPCS flash devices.
合规信息
RoHS compliant per N suffix. Not AEC-Q100 qualified - choose AEC-Q100 qualified Cyclone III/IV Auto variants for automotive production. Conflict-minerals compliance per Intel program report.
