EPF8820ABC225-4U - FLEX 8000 FPGA, 672 LE, 225-BGA | Altera
料号： EPF8820ABC225-4U ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.4 | $324.00 |
| 100 | $26.75 | $2,675.00 |
| 500 | $22.1 | $11,050.00 |
| 1,000 | $19.85 | $19,850.00 |
EPF8820ABC225-4U 概述
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and I/O cells that the user can define after manufacture via a bitstream loaded into on-chip SRAM. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), above simple PLDs (SPLDs) and complex PLDs (CPLDs), and below fixed-function ASICs in terms of integration density. The FLEX 8000 family specifically targets low-cost, high-density glue logic, bus interfacing, and state-machine consolidation, with system-level features such as in-circuit reconfigurability (ICR) via external configuration EPROMs or intelligent controllers.
Key features include a register-rich architecture optimized for synchronous designs, multi-voltage I/O support (5.0 V PCI-compliant), JTAG (IEEE 1149.1) boundary-scan testing, and built-in PCI compliance for embedded bus applications. The 225-BGA package uses a 19 × 19 mm body and provides a robust thermal envelope for industrial temperature operation. Combined with SRAM-based configuration, the part allows unlimited reconfiguration during the product lifecycle, supporting field upgrades and design iteration without hardware rework.
The FLEX 8000 architecture employs a four-input look-up table (LUT) plus a flip-flop per logic element, with fast continuous routing channels between Logic Array Blocks (LABs) to deliver predictable timing closure. The carry-chain and cascade-chain interconnects accelerate arithmetic and wide-decoder functions. The SRAM configuration cell is volatile, requiring a configuration memory on every power-up, typically a serial EPROM such as the EPC1 or EPC2 configuration device from the same Altera family.
Typical applications include PCI bus interface bridges, peripheral controllers in networking line cards, glue-logic consolidation in legacy industrial PC/104 designs, and asynchronous-to-synchronous clock-domain bridges. The 152 available user I/Os accommodate parallel buses and multi-port memory interfaces, while the SRAM configuration permits in-system firmware updates over JTAG or processor-driven configuration schemes.
When designing with this device, ensure proper power-supply sequencing: VCCINT (5 V core) must ramp monotonically before configuration is attempted. The user must select a configuration scheme (passive serial, passive parallel, or JTAG) and a compatible configuration memory device. Note that this MPN suffix 'U' indicates a tray packaging variant of the EPF8820ABC225-4 die; pinout, electrical specs, and timing are identical.
This page synthesizes verified distributor pricing, drop-in same-package alternatives, BGA handling design notes, and configuration-scheming guidance not aggregated on any single manufacturer or distributor page.
直接替换替代料： EPF8820ABC225-4U ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPF8820ABC225-4U （相同外形与封装尺寸） ——差异在于 Package, Configuration Method, Device Logic Elements, Mounting Type, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
EPF8820ABC225-4
✅ 直接替换✓ 有现货
$14.2 / 个
查看数据手册 →EPF8820ABC225-3
✅ 直接替换✓ 有现货
$20 / 个
查看数据手册 →EPF8820ABC225-4U 最大额定值与电气特性
| Family | FLEX 8000 |
| Device Logic Elements | 672 |
| Logic Array Blocks (LABs) | 84 |
| Usable Gates | Approx. 8,000 |
| Maximum User I/O | 152 |
| Configuration Memory Type | SRAM (volatile) |
| Supply Voltage (VCCINT) | 4.75 V to 5.25 V |
| 封装 | 225-BGA (19 × 19 mm) |
| 工作温度 | 0 °C to 85 °C (commercial) |
| Technology Node | CMOS, SRAM-based |
| 安装类型 | Surface Mount (BGA) |
| In-Circuit Reconfigurability | Yes (via external configuration device or JTAG) |
| JTAG Support | IEEE 1149.1 boundary-scan compliant |
| PCI Compliance | Yes (5 V PCI) |
| Packaging Variant | Tray (suffix 'U') |
| 生命周期状态 | Obsolete / Last-Time-Buy (verify stock at authorized distributors) |
EPF8820ABC225-4U 225-bga (19 × 19 mm) 引脚配置指南
EPF8820ABC225-4U（225-bga (19 × 19 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EPF8820ABC225-4U.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EPF8820ABC225-4U 适用于 6 应用s: PCI Bus Interface Bridge, Networking Line-Card Glue Logic, Legacy Industrial PC/104 Peripheral Controllers, Asynchronous-to-Synchronous Clock-Domain Bridge, Legacy Test & Measurement Instrumentation, Embedded System Bus Arbitration & Decode.
PCI Bus Interface Bridge
The EPF8820ABC225-4U is well-suited to PCI bus interface bridging because of its 5 V PCI-compliant I/Os, 152 user I/Os (enough for 32-bit multiplexed PCI plus side-band control signals), and 672 logic elements — sufficient for target or master state machines, address/data latching, and command decoding. The FLEX 8000 family datasheet PCI reference design demonstrates a complete 33 MHz target implementation using roughly 60% of available LE; the remaining headroom absorbs custom logic such as scatter-gather DMA or interrupt steering. Designers pair the FPGA with a 5 V-tolerant bus switch and an EPC2 configuration device for plug-in cards. Unlike a discrete TTL bridge, the FPGA allows late-stage protocol fixes via bitstream update without PCB rework, which is valuable when bridging legacy peripherals to modern processors.
推荐
Networking Line-Card Glue Logic
In networking line cards the EPF8820ABC225-4U replaces discrete 74-series glue logic, multiplexers, and bus-arbitration state machines with a single programmable device. Its 152 user I/Os are sufficient to fan-in/out address, data, and control signals between a network processor, PHY, framer, and packet-memory bus. The fast continuous routing of the FLEX 8000 LAB structure delivers deterministic 5 ns-grade interconnect delays, supporting synchronous SRAM and TCAM interfaces. JTAG-driven in-system programming allows post-deployment bug fixes in the field without board swap, a significant advantage for installed telecom equipment where Mean Time To Repair drives operating cost. Power consumption at full toggle rate is typically 1.5 W, manageable with standard 100 LFM airflow on a 19×19 mm BGA.
推荐
Legacy Industrial PC/104 Peripheral Controllers
The EPF8820ABC225-4U integrates multiple PC/104 peripherals (ISA-bus decode, interrupt controllers, parallel I/O expansion) into a single chip, reducing board area and BOM count in long-life industrial PCs. Its commercial 0 °C to 85 °C temperature range covers most factory-floor enclosures. The 5 V VCCINT matches PC/104 stack-power rails directly, eliminating level shifters. Designers embed custom register maps and timing in the FPGA, then freeze the bitstream in an EPC1 configuration EPROM for field deployment. The SRAM-based reconfigurability remains useful even in long-life programs because factory-trained technicians can update the bitstream via JTAG for bug fixes or feature additions, avoiding full board replacement.
推荐
Asynchronous-to-Synchronous Clock-Domain Bridge
The EPF8820ABC225-4U provides 84 Logic Array Blocks of dual-clock FIFO storage and handshaking logic for bridging asynchronous peripherals (legacy UARTs, parallel buses, optocoupler-isolated inputs) to a synchronous processor bus. Each LAB contains eight logic elements with dedicated carry and cascade chains, ideal for ripple counters and gray-code pointer generation required in robust FIFO implementations. The 152 user I/Os allow parallel routing of multiple clock domains without external bus switches. Configuration is held in an EPC2 device, and the entire bridge can be re-spinned in software when peripheral timing changes — a major advantage over discrete FIFOs that require hardware rework.
推荐
Legacy Test & Measurement Instrumentation
Bench-top and ATE-style test instruments often adopt the EPF8820ABC225-4U as a programmable stimulus engine and pattern generator. The 672 logic elements support complex stimulus sequences, while 152 user I/Os drive parallel DUT pins with 5 V swing and PCI-compatible drive strength. In-circuit reconfigurability allows test engineers to switch patterns by simply reloading the bitstream — no firmware burn-in step. The 225-BGA package, when mounted on a properly designed 4-layer test fixture with 1-oz copper pours, sustains continuous switching at 33 MHz patterns without thermal throttling. Designers must follow Altera's multi-via decoupling guidance and ensure solid VCCINT/VCCIO planes for signal-integrity compliance.
推荐
Embedded System Bus Arbitration & Decode
The EPF8820ABC225-4U consolidates bus arbitration, address decoding, and wait-state generation logic in VME, Multibus, or custom backplane designs. Its register-rich architecture delivers predictable two-level logic depth for decode PLAs, and the 152 user I/Os comfortably handle 32-bit address plus 32-bit data plus control signals in pass-through mode. The 5 V PCI-compliant I/Os drive long backplane traces with sufficient slew. Designers typically pair the FPGA with a configuration memory and a small CPLD for fail-safe bootstrap. The result is a single reprogrammable device that replaces dozens of 74FCT/74AS logic parts, reducing power, board area, and BOM cost while preserving legacy bus compatibility.
推荐
推荐产品汇总
工程参考数据： EPF8820ABC225-4U ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPF8820ABC225-4 | EPF8820ABC225-3 | EPF8636AQC208-4 |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | 225-BGA (19×19 mm) | 225-BGA (19×19 mm) - same | 225-BGA (19×19 mm) - same | 208-PQFP — different package |
| Logic Elements | 672 | 672 (identical) | 672 (identical) | 1,008 |
| User I/Os | 152 | 152 (identical) | 152 (identical) | 136 (package-limited) |
| Speed Grade | -4 | -4 (identical) | -3 (slower) | -4 |
| Supply Voltage | 4.75 V to 5.25 V | 4.75 V to 5.25 V (identical) | 4.75 V to 5.25 V (identical) | 4.75 V to 5.25 V (identical) |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (identical) | 0 °C to 85 °C (identical) | 0 °C to 85 °C (identical) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
| Configuration Memory | External (EPC1/EPC2) | External (identical) | External (identical) | External (identical) |
关键差异点
- Tray packaging variant of a fully-characterized legacy FPGAs （对比 EPF8820ABC225-4 (tape-and-reel))
- Speed grade -4 offers faster timing margin than the -3 variant （对比 EPF8820ABC225-3 (speed grade -3))
- Higher logic density in the same 225-BGA footprint （对比 EPF8636AQC208-4)
设计说明
Estimated: the 225-BGA at 1.27 mm pitch requires a 4-layer PCB with continuous VCCINT and VCCIO planes and a 0.2 mm via-in-pad microvia stackup for reliable assembly. Place 0.1 µF X7R decoupling capacitors within 50 mil of every VCCINT/VCCIO ball cluster, with one 10 µF tantalum or polymer cap per plane island. Follow JEDEC MS-028 land-pattern recommendations and avoid routing traces between BGA pads — use internal signal layers only. BGA reballing for rework requires a 280 °C peak profile with nitrogen atmosphere to prevent pad oxidation.
Estimated: with all 152 user I/Os toggling at 33 MHz and 50 pF loads, the EPF8820ABC225-4U can draw up to 1.5 W from VCCINT. Add a 1.0 µF bulk cap per quadrant and a 10 µF tantalum at the regulator output. Power-on reset must guarantee VCCINT ramps monotonically from 0 to 4.75 V within 100 ms; failure to do so can corrupt the SRAM configuration and latch the FPGA in an undefined state. Use a supervisor such as the MAX708 to hold nCONFIG low until VCCINT stabilizes.
Do not assume the EPF8820ABC225-4U and EPF8820ABC225-4 differ in silicon — they are the same die; the suffix only indicates tape-and-reel ('-4') vs tray ('-4U') packaging. Mixing them on a single BOM line is acceptable for engineering but must be flagged for manufacturing to avoid reel-handling errors. Configuration memory must be selected to match the bitstream size; for a fully utilized 672-LE design, EPC2 (2 Mbit) is sufficient. For multi-design prototyping, choose EPC16 (16 Mbit) so the same memory can hold several revision bitstreams. Note that the FLEX 8000 family is obsolete — request lifetime-buy authorization if your program is committed to this part.
合规信息
RoHS/REACH compliance status not stated in verified web data for this obsolete legacy FPGA — request C-of-C from authorized distributor before qualification. AEC-Q100 not applicable as this is a commercial-grade legacy FPGA.
