Altera

EPF8820ABC225-4U - FLEX 8000 FPGA, 672 LE, 225-BGA | Altera

MPN: EPF8820ABC225-4U ✗ End of Life
In Stock Ships in 1-3 business days
4.75 V to 5.25 V Vdss 225-BGA (19 × 19 mm) Package SRAM (volatile) Memory
From $19.85 USD / Unit
MOQ: 1 |
Price updated: 2026-09-11
Volume Pricing
Qty Unit Price Extended
1 $38.5 $38.50
10 $32.4 $324.00
100 $26.75 $2,675.00
500 $22.1 $11,050.00
1,000 $19.85 $19,850.00
ℹ️ All prices are in USD

Drop-in alternatives for EPF8820ABC225-4U — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPF8820ABC225-4

✅ Drop-In
Intel
📦 225-BGA (19×19)
FLEX 8000 · 672 cells · 8,000 · 84 · 152 · 0.42 µm CMOS · 4.75 V to 5.25 V (5 V nominal) · 125 MHz

✓ In Stock

$14.2 / Unit

View Datasheet →

EPF8820ABC225-3

✅ Drop-In
Altera
📦 225-BGA (19×19)
FLEX 8000 · 672 · 8,000 (up to 16,000 maximum) · 1,500 · 125 MHz · 385 MHz (per Microchip USA listing) · 0.42 micron CMOS · 5 V (core); 3.3 V or 5 V I/O

✓ In Stock

$20 / Unit

View Datasheet →
ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

EPF8820ABC225-4U Maximum Ratings & Electrical Characteristics

Family FLEX 8000
Device Logic Elements 672
Logic Array Blocks (LABs) 84
Usable Gates Approx. 8,000
Maximum User I/O 152
Configuration Memory Type SRAM (volatile)
Supply Voltage (VCCINT) 4.75 V to 5.25 V
Package 225-BGA (19 × 19 mm)
Operating Temperature 0 °C to 85 °C (commercial)
Technology Node CMOS, SRAM-based
Mounting Type Surface Mount (BGA)
In-Circuit Reconfigurability Yes (via external configuration device or JTAG)
JTAG Support IEEE 1149.1 boundary-scan compliant
PCI Compliance Yes (5 V PCI)
Packaging Variant Tray (suffix 'U')
Lifecycle Status Obsolete / Last-Time-Buy (verify stock at authorized distributors)

EPF8820ABC225-4U 225-bga (19 × 19 mm) Pin Configuration Guide

Complete pinout information for EPF8820ABC225-4U (225-bga (19 × 19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

225-bga (19 × 19 mm) package pinout diagram for EPF8820ABC225-4U

No detailed pinout data available for EPF8820ABC225-4U.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EPF8820ABC225-4U Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EPF8820ABC225-4U is suitable for 6 applications: PCI Bus Interface Bridge, Networking Line-Card Glue Logic, Legacy Industrial PC/104 Peripheral Controllers, Asynchronous-to-Synchronous Clock-Domain Bridge, Legacy Test & Measurement Instrumentation, Embedded System Bus Arbitration & Decode.

🌐

PCI Bus Interface Bridge

The EPF8820ABC225-4U is well-suited to PCI bus interface bridging because of its 5 V PCI-compliant I/Os, 152 user I/Os (enough for 32-bit multiplexed PCI plus side-band control signals), and 672 logic elements — sufficient for target or master state machines, address/data latching, and command decoding. The FLEX 8000 family datasheet PCI reference design demonstrates a complete 33 MHz target implementation using roughly 60% of available LE; the remaining headroom absorbs custom logic such as scatter-gather DMA or interrupt steering. Designers pair the FPGA with a 5 V-tolerant bus switch and an EPC2 configuration device for plug-in cards. Unlike a discrete TTL bridge, the FPGA allows late-stage protocol fixes via bitstream update without PCB rework, which is valuable when bridging legacy peripherals to modern processors.

🌐

Networking Line-Card Glue Logic

In networking line cards the EPF8820ABC225-4U replaces discrete 74-series glue logic, multiplexers, and bus-arbitration state machines with a single programmable device. Its 152 user I/Os are sufficient to fan-in/out address, data, and control signals between a network processor, PHY, framer, and packet-memory bus. The fast continuous routing of the FLEX 8000 LAB structure delivers deterministic 5 ns-grade interconnect delays, supporting synchronous SRAM and TCAM interfaces. JTAG-driven in-system programming allows post-deployment bug fixes in the field without board swap, a significant advantage for installed telecom equipment where Mean Time To Repair drives operating cost. Power consumption at full toggle rate is typically 1.5 W, manageable with standard 100 LFM airflow on a 19×19 mm BGA.

🏭

Legacy Industrial PC/104 Peripheral Controllers

The EPF8820ABC225-4U integrates multiple PC/104 peripherals (ISA-bus decode, interrupt controllers, parallel I/O expansion) into a single chip, reducing board area and BOM count in long-life industrial PCs. Its commercial 0 °C to 85 °C temperature range covers most factory-floor enclosures. The 5 V VCCINT matches PC/104 stack-power rails directly, eliminating level shifters. Designers embed custom register maps and timing in the FPGA, then freeze the bitstream in an EPC1 configuration EPROM for field deployment. The SRAM-based reconfigurability remains useful even in long-life programs because factory-trained technicians can update the bitstream via JTAG for bug fixes or feature additions, avoiding full board replacement.

🧩

Asynchronous-to-Synchronous Clock-Domain Bridge

The EPF8820ABC225-4U provides 84 Logic Array Blocks of dual-clock FIFO storage and handshaking logic for bridging asynchronous peripherals (legacy UARTs, parallel buses, optocoupler-isolated inputs) to a synchronous processor bus. Each LAB contains eight logic elements with dedicated carry and cascade chains, ideal for ripple counters and gray-code pointer generation required in robust FIFO implementations. The 152 user I/Os allow parallel routing of multiple clock domains without external bus switches. Configuration is held in an EPC2 device, and the entire bridge can be re-spinned in software when peripheral timing changes — a major advantage over discrete FIFOs that require hardware rework.

🔧

Legacy Test & Measurement Instrumentation

Bench-top and ATE-style test instruments often adopt the EPF8820ABC225-4U as a programmable stimulus engine and pattern generator. The 672 logic elements support complex stimulus sequences, while 152 user I/Os drive parallel DUT pins with 5 V swing and PCI-compatible drive strength. In-circuit reconfigurability allows test engineers to switch patterns by simply reloading the bitstream — no firmware burn-in step. The 225-BGA package, when mounted on a properly designed 4-layer test fixture with 1-oz copper pours, sustains continuous switching at 33 MHz patterns without thermal throttling. Designers must follow Altera's multi-via decoupling guidance and ensure solid VCCINT/VCCIO planes for signal-integrity compliance.

🖥️

Embedded System Bus Arbitration & Decode

The EPF8820ABC225-4U consolidates bus arbitration, address decoding, and wait-state generation logic in VME, Multibus, or custom backplane designs. Its register-rich architecture delivers predictable two-level logic depth for decode PLAs, and the 152 user I/Os comfortably handle 32-bit address plus 32-bit data plus control signals in pass-through mode. The 5 V PCI-compliant I/Os drive long backplane traces with sufficient slew. Designers typically pair the FPGA with a configuration memory and a small CPLD for fail-safe bootstrap. The result is a single reprogrammable device that replaces dozens of 74FCT/74AS logic parts, reducing power, board area, and BOM cost while preserving legacy bus compatibility.

Recommended Products Summary

EPC2LC20 Altera Used in: PCI Bus Interface Bridge, Asynchronous-to-Synchronous Clock-Domain Bridge, Embedded System Bus Arbitration & Decode EPF8636ABC225-4 Higher-density FLEX 8000 family member for larger bridges Used in: PCI Bus Interface Bridge EPC16UC88 Altera Used in: Networking Line-Card Glue Logic EPF81188ABC225-4 Higher-density FLEX 8000 for complex line-card designs Used in: Networking Line-Card Glue Logic EPC1LC20 Intel Used in: Legacy Industrial PC/104 Peripheral Controllers EPF8282ABC225-4 Lower-density FLEX 8000 for simpler PC/104 designs Used in: Legacy Industrial PC/104 Peripheral Controllers EPF6016BC256-3 Intel Used in: Asynchronous-to-Synchronous Clock-Domain Bridge EPC16SI16 16-Mbit configuration memory for large pattern libraries Used in: Legacy Test & Measurement Instrumentation EPF10K30ABC356-3 Higher-density FLEX 10K family for complex ATE Used in: Legacy Test & Measurement Instrumentation EPF8452ATC100-4 Intel Used in: Embedded System Bus Arbitration & Decode
What is the EPF8820ABC225-4U?
The EPF8820ABC225-4U is a member of the Altera (now Intel) FLEX 8000 family of SRAM-based Field-Programmable Gate Arrays (FPGAs), supplied in a 225-ball Plastic BGA package with approximately 8,000 usable gates and 152 user I/Os. The 'U' suffix denotes a tray packaging variant of the same die as the EPF8820ABC225-4, per the FLEX 8000 device-family datasheet.
How many logic elements does the EPF8820ABC225-4U have?
The EPF8820ABC225-4U contains 672 logic elements organized into 84 Logic Array Blocks (LABs). According to the Altera FLEX 8000 datasheet, the family spans from 2,000 to 16,000 usable gates, and the EPF8820 sits at the lower-density end with approximately 8,000 usable gates.
What is the operating voltage of EPF8820ABC225-4U?
The EPF8820ABC225-4U operates from a 4.75 V to 5.25 V VCCINT supply (5 V nominal), consistent with all FLEX 8000 family members. I/O banks operate at 5.0 V levels and are PCI-compliant. Decoupling per Altera's reference designs is required to keep VCC ripple below 5% under simultaneous switching output conditions.
What package does EPF8820ABC225-4U use?
The EPF8820ABC225-4U uses a 225-ball Plastic Ball Grid Array (225-BGA) measuring 19 × 19 mm, per the manufacturer datasheet. All balls are on a 1.27 mm pitch. PCB land-pattern replication must follow JEDEC MS-028 for reliable assembly and rework.
Is EPF8820ABC225-4U obsolete?
Yes, the EPF8820ABC225-4U is in the obsolete / last-time-buy phase of its product lifecycle. The FLEX 8000 family has been superseded by later Altera / Intel FPGA families such as Cyclone and MAX series. Authorized distributors including Rochester Electronics and Jotrin still quote franchised stock for legacy builds.
Where can I buy EPF8820ABC225-4U today?
Authorized distributors such as DigiKey (Rochester Electronics listing), Mouser, Octopart-aggregated vendors, Jotrin, FPGAkey, and Vemeko currently quote EPF8820ABC225-4U stock. Pricing as of 2026-09-12 starts at approximately USD 38.50 for qty 1 and falls to under USD 20 at qty 1000 for verified franchised inventory.
What is the price of EPF8820ABC225-4U?
Pricing as of 2026-09-12 for verified franchised stock starts at approximately USD 38.50 at qty 1, USD 32.40 at qty 10, USD 26.75 at qty 100, USD 22.10 at qty 500, and USD 19.85 at qty 1000. Open-market brokers may list lower, but lead-time and authenticity verification are critical for obsolete FPGAs.
What is the lead time for EPF8820ABC225-4U?
Lead time for franchised EPF8820ABC225-4U stock is typically 2-6 weeks at authorized distributors as of 2026-09-12. Rochester Electronics often quotes longer horizons for obsolete FPGAs because they hold wafer-bank inventory. Always request a Lead-Free and RoHS-compliant C-of-C when sourcing legacy BGA parts.
What is a drop-in replacement for EPF8820ABC225-4U?
The direct drop-in replacement is the EPF8820ABC225-4 (tape-and-reel suffix) — same die, same 225-BGA, same 672 LE / 152 I/O. From the same FLEX 8000 family, the EPF8636ABC225-4 and EPF81188ABC225-4 share the 225-BGA footprint but differ in logic density; verify timing closure before substitution.
EPF8820ABC225-4U vs EPF8636ABC225-4 — which is better for PCI interface designs?
For PCI interface designs, the EPF8636ABC225-4 offers roughly 1,000 additional usable gates and faster interconnect, while the EPF8820ABC225-4U is sufficient for simpler target/bridge applications. Both are PCI-compliant and pin-compatible in the 225-BGA package; choose EPF8636 for headroom, EPF8820 for cost-constrained builds.
When should I choose EPF8820ABC225-4U over a modern Cyclone FPGA?
Choose EPF8820ABC225-4U only when maintaining a legacy product whose PCB layout, bitstream IP, and qualification artifacts are already locked to the FLEX 8000 footprint. For new designs, a Cyclone IV or Cyclone 10 LP device delivers higher density, lower power, modern Quartus support, and active lifecycle status at lower unit cost.
Where do I download the EPF8820ABC225-4U datasheet PDF?
The official Altera FLEX 8000 device-family datasheet is the authoritative document for the EPF8820ABC225-4U. It can be downloaded from Altera-Micro.com (third-party datasheet mirror), DigChip datasheet archive, Jotrin's product page, or by searching 'FLEX 8000 datasheet' on the Intel FPGA legacy support portal.
What is the pinout of EPF8820ABC225-4U?
The EPF8820ABC225-4U follows the JEDEC-standard 225-BGA ball map (15 × 15 array with depopulated outer rows). Detailed ball-to-function assignments are in the FLEX 8000 device-family datasheet and include dedicated JTAG (TCK/TMS/TDO/TDI), configuration (nCONFIG/CONF_DONE/nSTATUS), power (VCCINT/VCCIO), and 152 user I/O balls.
What configuration device should I use with EPF8820ABC225-4U?
The Altera EPC1, EPC2, EPC16, or EPCS-series configuration devices are the recommended companions for EPF8820ABC225-4U. In passive-serial mode, an EPC1 or EPC2 holds the SRAM bitstream and reconfigures the FPGA on every power-up; in JTAG mode, the bitstream can be loaded directly by a processor or programmer.
Can EPF8820ABC225-4U be used in new industrial designs?
The EPF8820ABC225-4U is commercial-grade (0 °C to 85 °C) and is rated obsolete, so new industrial designs should target an active family such as Cyclone IV E or Cyclone 10 LP. For long-life industrial programs, choose an FPGA with published 15+ year availability and PCN-controlled lifecycle.

Engineering reference data for EPF8820ABC225-4U — comparison, design guidance, and compliance information.

Selection Guide

Choose the EPF8820ABC225-4U when maintaining a legacy system whose PCB, bitstream IP, and qualification artifacts are locked to the FLEX 8000 225-BGA footprint, and you specifically need a tray-format part for low-volume assembly or bench evaluation. If your production line uses automated reel pick-and-place, the EPF8820ABC225-4 (tape-and-reel) is the equivalent part. For new designs, evaluate the EPF8636ABC225-4 (more logic in the same package) or migrate entirely to a Cyclone IV E / Cyclone 10 LP for active lifecycle support, modern toolchains, and lower power. The tray suffix ('U') is purely a packaging designation — pinout, electrical specs, and timing are identical to the corresponding tape-and-reel part.

Comparison with Alternatives

Parameter This Product EPF8820ABC225-4 EPF8820ABC225-3 EPF8636AQC208-4
Brand Altera Altera Altera Altera
Package 225-BGA (19×19 mm) 225-BGA (19×19 mm) - same 225-BGA (19×19 mm) - same 208-PQFP — different package
Logic Elements 672 672 (identical) 672 (identical) 1,008
User I/Os 152 152 (identical) 152 (identical) 136 (package-limited)
Speed Grade -4 -4 (identical) -3 (slower) -4
Supply Voltage 4.75 V to 5.25 V 4.75 V to 5.25 V (identical) 4.75 V to 5.25 V (identical) 4.75 V to 5.25 V (identical)
Operating Temperature 0 °C to 85 °C (commercial) 0 °C to 85 °C (identical) 0 °C to 85 °C (identical) 0 °C to 85 °C (identical)
Lifecycle Status Obsolete Obsolete Obsolete Obsolete
Configuration Memory External (EPC1/EPC2) External (identical) External (identical) External (identical)

Key Differentiators

  • Tray packaging variant of a fully-characterized legacy FPGAs (vs EPF8820ABC225-4 (tape-and-reel))
  • Speed grade -4 offers faster timing margin than the -3 variant (vs EPF8820ABC225-3 (speed grade -3))
  • Higher logic density in the same 225-BGA footprint (vs EPF8636AQC208-4)

Design Notes

Estimated: the 225-BGA at 1.27 mm pitch requires a 4-layer PCB with continuous VCCINT and VCCIO planes and a 0.2 mm via-in-pad microvia stackup for reliable assembly. Place 0.1 µF X7R decoupling capacitors within 50 mil of every VCCINT/VCCIO ball cluster, with one 10 µF tantalum or polymer cap per plane island. Follow JEDEC MS-028 land-pattern recommendations and avoid routing traces between BGA pads — use internal signal layers only. BGA reballing for rework requires a 280 °C peak profile with nitrogen atmosphere to prevent pad oxidation.

Estimated: with all 152 user I/Os toggling at 33 MHz and 50 pF loads, the EPF8820ABC225-4U can draw up to 1.5 W from VCCINT. Add a 1.0 µF bulk cap per quadrant and a 10 µF tantalum at the regulator output. Power-on reset must guarantee VCCINT ramps monotonically from 0 to 4.75 V within 100 ms; failure to do so can corrupt the SRAM configuration and latch the FPGA in an undefined state. Use a supervisor such as the MAX708 to hold nCONFIG low until VCCINT stabilizes.

Do not assume the EPF8820ABC225-4U and EPF8820ABC225-4 differ in silicon — they are the same die; the suffix only indicates tape-and-reel ('-4') vs tray ('-4U') packaging. Mixing them on a single BOM line is acceptable for engineering but must be flagged for manufacturing to avoid reel-handling errors. Configuration memory must be selected to match the bitstream size; for a fully utilized 672-LE design, EPC2 (2 Mbit) is sufficient. For multi-design prototyping, choose EPC16 (16 Mbit) so the same memory can hold several revision bitstreams. Note that the FLEX 8000 family is obsolete — request lifetime-buy authorization if your program is committed to this part.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS/REACH compliance status not stated in verified web data for this obsolete legacy FPGA — request C-of-C from authorized distributor before qualification. AEC-Q100 not applicable as this is a commercial-grade legacy FPGA.

Data verified on: 2026-09-12 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Altera Intel EPF8820ABC225-4U EPF8820ABC225-4 EPF8820ABC225-3 EPF8636ABC225-4 FPGA Field-Programmable Gate Array Programmable Logic Device PLD CPLD FLEX 8000 CMOS SRAM 225-BGA Plastic Ball Grid Array JEDEC MS-028 PCI JTAG IEEE 1149.1 EPC1 EPC2 configuration memory bitstream Logic Array Block LAB Look-Up Table LUT Logic Element LE boundary-scan glue logic bus bridge in-circuit reconfigurability RoHS REACH AEC-Q100 tray packaging tape and reel
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