EPF8820ARC208-4 - FLEX 8000 FPGA, 8K Gates, 672 Cells, 208-RQFP | Altera
料号： EPF8820ARC208-4 ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $49.5 | $49.50 |
| 10 | $42.8 | $428.00 |
| 100 | $36.5 | $3,650.00 |
| 500 | $30.2 | $15,100.00 |
| 1,000 | $25.4 | $25,400.00 |
EPF8820ARC208-4 概述
Background: A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines high gate density with reconfigurable interconnect and logic. Within the broader taxonomy, the EPF8820ARC208-4 belongs to the FLEX 8000 family (PLD -> CPLD/FPGA -> SRAM-based FPGA -> FLEX 8000). FPGAs differ from CPLDs in architecture by offering distributed logic-element arrays with SRAM-based configuration memory, enabling higher density and more flexible routing at the cost of requiring external configuration memory on power-up.
Key differentiating features include 152 maximum user I/O pins, 672 logic cells (registers), an approximate 16,000-gate device density ceiling, 5 V tolerant I/O, and the -4 speed grade designation. The -4 speed grade implies a particular toggle-rate/performance tier within the FLEX 8000 family, with other grades (-3, -2) offering different fMAX/per-pin performance. The 208-RQFP package with exposed pad aids thermal dissipation for high-utilization designs.
Architecturally, the FLEX 8000 family uses a continuous SRAM-based configuration memory (each logic element and routing switch is loaded from a serial/parallel configuration bitstream at power-up). This is the same fundamental approach used by modern SRAM FPGAs and explains why the family supports in-circuit reconfigurability - the device can be reloaded while resident on a board, unlike antifuse or one-time-programmable devices.
Typical applications include legacy telecom line cards, industrial glue logic replacement, prototyping platforms for ASIC emulation, and 5 V-tolerant bus-interface bridging. The wide 5 V supply tolerance and 152 I/O make the EPF8820ARC208-4 well suited to mixed 3.3 V / 5 V system integration where modern 1.8 V-only FPGAs cannot directly interface legacy logic.
When designing with the EPF8820ARC208-4, designers should account for the external configuration device requirement (the part is SRAM-based and does not retain configuration without an EPC/EPCS serial configuration memory or parallel PROM). Engineers also planning a modern redesign should note that this family is mature/last-time-buy, and that newer Cyclone or MAX families from Intel/Altera are pin-compatible upgrades for many footprints.
直接替换替代料： EPF8820ARC208-4 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPF8820ARC208-4 （相同外形与封装尺寸） ——差异在于 Package, Configuration Method, Speed Grade, Process Technology, In-Circuit Reconfigurability.
快速对比工具——选择替代料号进行并排对比：
EPF8820ARC208-3
✅ 直接替换✓ 有现货
$62 / 个
查看数据手册 →EPF8820ARC208-2
✅ 直接替换✓ 有现货
$17.95 / 个
查看数据手册 →EPF8820ARC208-3N
✅ 直接替换✓ 有现货
$85 / 个
查看数据手册 →EPF8820ARC208-2N
✅ 直接替换✓ 有现货
$20.55 / 个
查看数据手册 →EPF8820ARC208-3-NW
✅ 直接替换✓ 有现货
$110 / 个
查看数据手册 →EPF8820ARC208-2A
✅ 直接替换✓ 有现货
$14.1 / 个
查看数据手册 →EPF8820ARC208-4 最大额定值与电气特性
| Device Family | FLEX 8000 |
| Series | FLEX 8000 |
| Usable Gates | 8,000 (up to 16,000 with utilization) |
| Logic Elements (Cells) | 672 |
| Number of Registers | 1,500 |
| Maximum User I/O | 152 |
| Supply Voltage (VCCINT/Logic Core) | 5 V nominal (4.75 V - 5.25 V) |
| 封装 / 外壳 | 208-BFQFP (RQFP) Exposed Pad |
| Package Dimensions | 28 mm x 28 mm |
| Supplier Device Package | 208-RQFP (28x28) |
| 安装类型 | Surface Mount |
| Speed Grade | -4 |
| Process Technology | CMOS, 0.5 um (5 V SRAM-based) |
| Configuration Memory | SRAM (volatile - external configuration device required) |
| In-Circuit Reconfigurability | Yes (ICR via external configuration devices) |
EPF8820ARC208-4 208-rqfp (28x28) 引脚配置指南
EPF8820ARC208-4（208-rqfp (28x28) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EPF8820ARC208-4.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EPF8820ARC208-4 适用于 6 应用s: Legacy Telecom Line-Card Glue Logic, Industrial Control and PLC Logic Integration, ASIC Emulation and Prototyping Platform, Legacy 5 V Bus-Interface Bridging, Test and Measurement Instrumentation Front-End, Medical Imaging and Diagnostic Equipment (Legacy).
Legacy Telecom Line-Card Glue Logic
The EPF8820ARC208-4 is well suited for legacy telecom line cards where 5 V-tolerant I/O is required to interface with classic bus interfaces such as TTL, HCT, or 5 V CMOS ASICs that modern 1.8 V-only FPGAs cannot directly drive. Its 152 user I/O pins support the wide parallel data buses and per-channel control signal fan-out typical of T1/E1 aggregation cards and channel-bank backplanes. The 672 logic cells / 8,000 usable gates are sufficient to integrate protocol conversion, framing, and supervisory glue logic between line interface units and the host processor. Designers benefit from in-circuit reconfigurability - field updates to the line-card firmware can be pushed without de-soldering the device.
推荐
Industrial Control and PLC Logic Integration
In industrial PLCs and process-control cards, the EPF8820ARC208-4's 5 V supply tolerance, 152 I/O, and SRAM reconfigurability make it a flexible platform for encoder decoding, PWM generation, and high-speed counter logic that cannot be efficiently implemented in microcontrollers alone. The -4 speed grade provides deterministic timing suitable for pulse-train output and quadrature decoding up to typical industrial encoder frequencies. Surface-mount 208-RQFP packaging supports automated assembly common in industrial volume manufacturing.
推荐
ASIC Emulation and Prototyping Platform
Designers using the EPF8820ARC208-4 as an ASIC emulator benefit from 8,000 usable gates and 1,500 registers - sufficient to model moderate-complexity ASICs for functional verification before tape-out. The 152 I/O pins accommodate the wide test-bench signal fan-out common in ASIC prototyping, and the FLEX 8000 family's in-circuit reconfigurability allows rapid design-iteration cycles during RTL bring-up. The 208-RQFP package's exposed pad aids thermal dissipation during continuous-emulation runs at high toggle rates.
推荐
Legacy 5 V Bus-Interface Bridging
The EPF8820ARC208-4 can serve as a bus bridge between legacy 5 V peripherals and modern 3.3 V processors, providing level-translation glue logic and protocol conversion in a single chip. Its 5 V-tolerant I/Os can directly interface with classic 5 V peripherals (TTL, HCT, FCT logic families), while modern FPGA families cannot. The 672 logic cells and 152 I/O are well matched to typical 16/32-bit bus widths plus chip-select, interrupt, and DMA handshaking signal overhead.
推荐
Test and Measurement Instrumentation Front-End
In test-and-measurement instruments such as logic analyzers, protocol testers, or ATE pin-electronics cards, the EPF8820ARC208-4's 152 I/O and reconfigurable architecture support pattern-generation, capture-control, and timing/sequencing logic that benefits from FPGA flexibility. The 5 V supply tolerance simplifies interfacing with classic 5 V probe buffers and pin-driver ASICs. The exposed-pad 208-RQFP package supports continuous-instrument-operation thermal loads.
推荐
Medical Imaging and Diagnostic Equipment (Legacy)
Legacy medical imaging platforms (ultrasound front-ends, patient-monitor controllers) often used the EPF8820ARC208-4 for timing-critical DSP glue logic, beam-former control, and display-interface generation. The 672 logic cells support small to mid-size datapath controllers, while the 152 I/O accommodate parallel ADC/DAC and display bus interfaces. Engineers maintaining installed-base medical equipment value the long-term availability through authorized aftermarket sources such as Rochester Electronics when original OEM production has ended.
推荐
推荐产品汇总
工程参考数据： EPF8820ARC208-4 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPF8820ARC208-3 | EPF8820ARC208-2 | EPF8820ARC208-3N | EPF8820ARC208-2N | EPF8820ARC208-3-NW |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 208-RQFP (28x28 mm) Exposed Pad | 208-RQFP (28x28 mm) - same | 208-RQFP (28x28 mm) - same | 208-RQFP (28x28 mm) - same | 208-RQFP (28x28 mm) - same | 208-RQFP (28x28 mm) - same |
| Device Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 |
| Speed Grade | -4 | -3 (faster FMAX) | -2 (faster FMAX) | -3 (lead-free) | -2 (lead-free) | -3 (lead-free NW) |
| Logic Cells / Elements | 672 | 672 (identical die) | 672 (identical die) | 672 (identical die) | 672 (identical die) | 672 (identical die) |
| Usable Gates | 8,000 (up to 16,000) | 8,000 (identical die) | 8,000 (identical die) | 8,000 (identical die) | 8,000 (identical die) | 8,000 (identical die) |
| Maximum User I/O | 152 | 152 | 152 | 152 | 152 | 152 |
| Supply Voltage | 4.75 V - 5.25 V (5 V nominal) | 4.75 V - 5.25 V | 4.75 V - 5.25 V | 4.75 V - 5.25 V | 4.75 V - 5.25 V | 4.75 V - 5.25 V |
| Configuration Memory | SRAM (volatile, external PROM required) | SRAM (same) | SRAM (same) | SRAM (same) | SRAM (same) | SRAM (same) |
| Lifecycle Status | Last-time-buy (mature) | Last-time-buy (mature) | Last-time-buy (mature) | Last-time-buy (mature) | Last-time-buy (mature) | Last-time-buy (mature) |
关键差异点
- Mid-density FLEX 8000 with 152 user I/O in 208-RQFP （对比 EPF8282ARC100-4)
- Exposed-pad thermal package vs PQFP variant （对比 EPF8820AQC208-4)
- Mature last-time-buy lifecycle vs active alternatives （对比 Cyclone series (modern Intel FPGAs))
设计说明
The FLEX 8000 family uses SRAM-based configuration memory that is volatile - the EPF8820ARC208-4 will not retain its design at power-down. Designers MUST include an external configuration device (such as Altera EPC2LC20 or compatible serial/parallel PROM) on the board. Forgetting the configuration PROM is the most common FLEX 8000 bring-up failure. The configuration interface pins (DCLK, nCONFIG, nSTATUS, CONF_DONE, DATA0) must be pulled and terminated per the datasheet for reliable configuration at power-up and during in-circuit reconfiguration events.
The 208-RQFP (28x28 mm) package has 0.5 mm lead pitch and exposed thermal pad on the bottom of the package - the PCB MUST include a properly-sized thermal land pattern soldered to a copper pour to dissipate heat. The 0.5 mm pitch requires careful PCB manufacturing (laser-cut solder paste stencil recommended) and reflow profile compliance with J-STD-020 moisture sensitivity. Power and ground pins should be decoupled locally with 0.1 uF and 10 uF capacitors placed as close to the IC as the layout allows, per standard high-pin-count FPGA decoupling practice.
The exposed thermal pad on the 208-RQFP must be soldered to a continuous ground-plane copper pour with multiple thermal vias to the inner ground plane for effective heat dissipation. Insufficient thermal vias or a fragmented thermal land will cause the junction temperature to rise above the commercial-grade 0 C to +70 C limit under continuous high-utilization workloads (such as ASIC emulation). When laying out the 152 user I/O, group related signal banks together and route differential pairs with matched length to preserve timing margins in the -4 speed grade.
合规信息
RoHS / lead-free status not explicitly provided in the verified web data; the -3N / -2N / -3-NW / -2A suffix variants typically denote lead-free / RoHS-compliant re-releases per Altera (Intel PSG) legacy conventions, but this should be verified from the lot-specific documentation at order time. Not AEC-Q100 qualified - this family is intended for industrial / commercial telecom and ASIC emulation, not automotive grade.
