EPM3256AFC256-10 - 256-Macro CPLD MAX 3000A | Intel / Altera | FBGA-256
料号： EPM3256AFC256-10 ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $30.73 | $30.73 |
| 10 | $28.5 | $285.00 |
| 100 | $25.2 | $2,520.00 |
| 500 | $22.8 | $11,400.00 |
| 1,000 | $19.95 | $19,950.00 |
EPM3256AFC256-10 概述
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-like macrocell arrays on a single chip with a programmable interconnect matrix. CPLDs sit between discrete logic gates (74HC series) and FPGAs in the programmable logic hierarchy: they offer deterministic, fast (single-clock-cycle) propagation delays, in-system programmability via JTAG, and instant-on configuration from on-chip EEPROM, making them ideal for glue-logic, bus interfacing, and state-machine replacement.
Key features of the EPM3256AFC256-10 include 5,000 usable gates, 16 logic array blocks (LABs) of 16 macrocells each, a global ClockTree with three global clock pins, and 3.3-V in-system programmability (ISP) through the IEEE Std. 1149.1 JTAG interface. The -10 speed grade provides a 10 ns tPD and an internal fCNT of up to 95.2 MHz, suitable for PCI Local Bus Specification Revision 2.2-compliant designs in the -4, -5, -6, -7, and -10 grades.
The device is built on a 0.30 µm CMOS EEPROM process and supports multi-voltage I/O operation, allowing 5.0 V devices to drive 3.3 V devices with proper pull-up configuration. Its non-volatile EEPROM cells mean the device configures in microseconds without an external boot PROM, supporting instant-on behavior critical for power-supply sequencing and safety-critical applications.
Typical applications include PCI bus interface glue logic, industrial control boards, address decoding and bus arbitration in embedded systems, peripheral expansion bridges, and LED display multiplexing. Its 161 I/Os make it a flexible replacement for multiple discrete 74-series logic packages, reducing board area and BOM count.
When designing with the EPM3256AFC256-10, pay close attention to FBGA-256 PCB layout: a 1.0 mm pitch BGA requires laser-via or microvia PCB technology and four to six PCB layers for signal escape. Decoupling requires 0.1 µF and 10 µF capacitors placed within 5 mm of each supply pin, with a continuous ground plane beneath the package for thermal dissipation.
This page synthesizes distributor pricing, FBGA-256 drop-in alternatives, and practical PCB layout notes not consolidated in the legacy Altera MAX 3000A datasheet.
直接替换替代料： EPM3256AFC256-10 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPM3256AFC256-10 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Propagation Delay (tPD), In-System Programmability, Speed Grade.
快速对比工具——选择替代料号进行并排对比：
EPM3256AFC256-7
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$12.1 / 个
查看数据手册 →EPM3256ATC256-10
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EPM3256AFC256-10 最大额定值与电气特性
| Family | MAX 3000A |
| Logic Family | CMOS (EEPROM-based) |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macro Cells | 256 |
| Usable Gates | 5,000 |
| Logic Array Blocks (LABs) | 16 (16 macrocells each) |
| Maximum User I/Os | 161 |
| Propagation Delay (tPD) | 10 ns |
| Internal Counter Frequency (fCNT) | 95.2 MHz |
| Supply Voltage (VCCINT) | 3.3 V |
| I/O Voltage Tolerance | 5.0 V tolerant |
| In-System Programmability | Yes (3.3 V ISP via JTAG IEEE 1149.1) |
| 工作温度 | 0°C to +70°C (Commercial) |
| 封装 | 256-ball FBGA (Fine-Line BGA) |
| 安装类型 | Surface Mount |
EPM3256AFC256-10 256-ball fbga (fine-line bga) 引脚配置指南
EPM3256AFC256-10（256-ball fbga (fine-line bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EPM3256AFC256-10.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EPM3256AFC256-10 适用于 6 应用s: PCI Bus Interface Glue Logic, Industrial Control Board Logic Consolidation, Address Decoding & Bus Arbitration in Embedded Systems, Peripheral Expansion Bridge for Legacy Microcontrollers, LED Display Multiplexing Driver, Power Supply Sequencing & Monitoring.
PCI Bus Interface Glue Logic
The EPM3256AFC256-10 is well-suited as a PCI Local Bus v2.2 interface bridge in legacy embedded systems. Its 10 ns tPD and 95.2 MHz internal counter frequency meet the PCI 33 MHz bus timing requirements across all loads, allowing engineers to consolidate address decoding, bus arbitration, command/byte-enable translation, and interrupt steering into a single non-volatile device. The 161 user I/Os comfortably accommodate 32-bit address plus 32-bit data multiplexers, four-cycle bursts, and parity generation. ISP via JTAG permits late-stage firmware updates during PCI conformance testing without removing the board.
推荐
Industrial Control Board Logic Consolidation
Factory automation controllers and PLCs frequently need to replace 8-15 discrete 74HC/74FCT logic packages with a single programmable part. The EPM3256AFC256-10's 256 macrocells and 161 I/Os can absorb optocoupler-to-MCU isolation logic, encoder quadrature decoders, PWM generators, and emergency-stop latches in one chip, cutting PCB area by 50-70% and BOM cost by 30-40%. The 3.3 V core with 5 V tolerant I/Os interfaces directly to legacy 5V industrial sensors and 24V opto-isolated inputs. Commercial 0-70°C temperature range covers most factory-floor enclosures.
推荐
Address Decoding & Bus Arbitration in Embedded Systems
The EPM3256AFC256-10's deterministic 10 ns tPD makes it an ideal companion to microprocessors, DSPs, and microcontrollers that require chip-select generation, wait-state insertion, and DMA arbitration across multiple peripherals. The MAX 3000A product-term architecture delivers glitch-free outputs independent of routing, eliminating the metastability concerns common in FPGA-based glue logic. With 161 I/Os, the part can simultaneously address SDRAM, flash, UARTs, timers, and GPIO expanders in a 32-bit embedded design. Non-volatile EEPROM configuration means instant boot-up without SPI flash boot devices.
推荐
Peripheral Expansion Bridge for Legacy Microcontrollers
Older 8051, PIC, and ARM7 microcontrollers with limited address buses benefit from the EPM3256AFC256-10 acting as an external peripheral bridge. The CPLD can decode multiplexed address/data buses, generate chip-select strobes for external SRAM, flash, and peripherals, and provide parallel-to-serial conversion for SPI/I2C peripherals lacking on-chip controllers. Its 161 I/Os handle 8-bit data buses plus extensive control signal multiplexing. ISP via JTAG lets field engineers update bridging firmware as new peripheral ICs are added.
推荐
LED Display Multiplexing Driver
Large LED matrix displays, stadium scoreboards, and traffic information panels require scan-row and column-driver coordination at refresh rates above 100 Hz to avoid flicker. The EPM3256AFC256-10 can multiplex 16 rows and 32 columns while simultaneously generating PWM dimming waveforms and handling display memory I/O. With 161 user I/Os and a 95.2 MHz internal counter, the device supports up to 16-bit PWM grayscale at 1 kHz refresh. Its 3.3 V core simplifies interface to modern LED driver ICs, while 5V tolerant I/Os bridge to legacy constant-current sink drivers.
推荐
Power Supply Sequencing & Monitoring
Multi-rail embedded systems (FPGA + DDR + analog + I/O) require carefully ordered power-up and power-down to prevent latch-up and bus contention. The EPM3256AFC256-10 can sequence up to 16 voltage rails with programmable delays, monitor PG (power-good) signals, and drive discrete MOSFETs or ENA pins. Its deterministic 10 ns tPD is far faster than MCU-based sequencers, preventing inrush current spikes during simultaneous rail activation. The 161 user I/Os handle feedback from each rail's PG plus fault outputs to the system reset controller.
推荐
推荐产品汇总
工程参考数据： EPM3256AFC256-10 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPM3256AFC256-7 | EPM3256ATC256-10 |
|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | FBGA-256 | FBGA-256 - same | FBGA-256 - same |
| Macro Cells | 256 | 256 | 256 |
| Usable Gates | 5,000 | 5,000 | 5,000 |
| Propagation Delay (tPD) | 10 ns | 7 ns (faster) | 10 ns |
| Maximum User I/Os | 161 | 161 | 161 |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0°C to +70°C (Commercial) | 0°C to +70°C (Commercial) | 0°C to +70°C (Commercial) |
关键差异点
- Highest-density MAX 3000A variant with 161 I/Os （对比 EPM3256AQI208-10N)
- Commercial-grade temperature range with PCI-compliant timing （对比 EPM3256AQI208-10N (industrial))
- True FBGA-256 pin-compatible drop-in for legacy board revs （对比 MAX V 5M256ZE64 (EQFP-144))
设计说明
The FBGA-256 package uses 1.0 mm ball pitch and requires microvia PCB technology. Allocate a minimum 4-layer stackup with continuous ground plane beneath the package for thermal spreading and controlled impedance. Decoupling requires 0.1 µF X7R ceramic capacitors placed within 5 mm of each VCCINT/VCCIO ball pair, plus 10 µF bulk capacitors on each supply rail at the board edge. Estimate: at full 161 I/O toggle at 10 MHz with 30 pF loads, dynamic current draws can reach 500 mA.
Estimated: At full I/O utilization with all 161 outputs driving 30 pF loads at maximum toggle rate, internal power dissipation can reach 0.8 W. With a typical FBGA-256 θJA of 28°C/W (4-layer JEDEC test board), junction temperature rise above ambient is approximately 22°C. For enclosed industrial enclosures with limited airflow, derate to 75% I/O utilization to maintain junction below 100°C for long-term reliability.
Critical: Never hot-swap or remove JTAG cable during in-system programming - interrupted ISP cycles can corrupt the EEPROM configuration cell and brick the device. Always export the final .pof file and verify checksum after each JTAG write. Do not exceed 3.6 V on VCCINT during power-up transients - the MAX 3000A core does not include internal ESD clamps rated above 4 kV HBM. Add a 3.3 V TVS diode on each supply rail for surge protection in industrial environments.
The 5 V tolerant I/O pins on the EPM3256AFC256-10 do NOT generate 5 V output levels - they only accept 5 V input signals when VCCIO is at 3.3 V. For mixed-voltage systems where the CPLD must drive 5 V receivers, configure VCCIO bank to 3.3 V with external 5 V pull-up resistors on each output line. This adds current draw (typically 1-3 mA per output) and reduces edge rates, so budget propagation delay accordingly.
Recommended: route JTAG signals (TCK, TMS, TDI, TDO, TRST) as a dedicated test bus with a 4-pin header on the PCB edge. Keep JTAG traces under 100 mm total length and route them over a continuous ground plane to avoid noise coupling that can disrupt programming. Include a 10 kΩ pull-up on TCK and a 10 kΩ pull-down on TMS to keep JTAG in a known state during power-up. JTAG chain ordering matters when multiple devices share the bus - place the CPLD closest to the TDO pin of the connector.
合规信息
RoHS/REACH compliance status not explicitly stated in distributor data. MAX 3000A family pre-dates strict RoHS enforcement - many date codes are lead-containing; verify per lot CoC. The CPLD is a commercial-grade part and is not AEC-Q100 qualified for automotive use.
