EPM3512AFC256-22 - MAX 3000A CPLD, 512 Macrocells, BGA-256 | Intel
料号： EPM3512AFC256-22 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.75 | $2,175.00 |
| 500 | $18.4 | $9,200.00 |
| 1,000 | $16.1 | $16,100.00 |
EPM3512AFC256-22 概述
A CPLD is a non-volatile programmable logic device that sits in the broader hierarchy between discrete logic gates (74xx) and large FPGAs. CPLDs are characterized by instant-on (no external boot PROM), predictable routing delays, and high-drive I/O capable of directly driving buses. The MAX 3000A family in particular implements multiple Logic Array Blocks (LABs) interconnected by a programmable switch matrix (PIA), with on-chip EEPROM configuration cells that retain bitstream without external memory. The 512-macrocell density places the EPM3512 in the upper end of the MAX 3000A family, suitable for medium-complexity bus bridges and peripheral controllers.
Key features of the EPM3512AFC256-22 include 512 macrocells across 16 Logic Array Blocks, programmable I/O standards (2.5V, 3.3V, or 5.0V VCCIO), IEEE Std. 1532-compliant in-system programmability (ISP), and JTAG boundary-scan test support. The FC256 package (FineLine BGA, 256 balls, 1.0 mm pitch) maximizes board density while the A-grade denotes the commercial/industrial process with 5.0V tolerant I/O. The device operates from a 3.3V VCCINT supply and supports hot-socketing for live insertion.
Typical applications include bus decoding and address mapping in embedded processor boards, peripheral glue logic between microcontrollers and ASICs, board-level signal conditioning and voltage translation, and replacement of multiple 74-series TTL packages with one programmable device. The instant-on EEPROM-based architecture makes the MAX 3000A family especially valuable in safety-critical or industrial systems where a long FPGA configuration time would be unacceptable.
When designing with the EPM3512AFC256-22, ensure that your I/O bank VCCIO is wired correctly for 2.5V, 3.3V, or 5.0V interfaces, and use the Altera/Intel Quartus design suite for synthesis and fitting. For a lower-density drop-in option in the same package, consider the EPM3256AFC256 family (256 macrocells), or for higher density, the EPM3512AFC256 variants with faster speed grades (-15, -10).
直接替换替代料： EPM3512AFC256-22 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPM3512AFC256-22 （相同外形与封装尺寸） ——差异在于 Package, Logic Array Blocks (LABs), In-System Programmability, Usable Gates, Configuration Memory.
快速对比工具——选择替代料号进行并排对比：
EPM3512AFC256-10N
✅ 直接替换✓ 有现货
$43.22 / 个
查看数据手册 →EPM3512AFC256-10
✅ 直接替换✓ 有现货
$17.5 / 个
查看数据手册 →EPM3512AFC256-21
✅ 直接替换✓ 有现货
$18.75 / 个
查看数据手册 →EPM3512AFC256-20
✅ 直接替换✓ 有现货
$9.75 / 个
查看数据手册 →EPM3256AFC256-10
✅ 直接替换✓ 有现货
$19.95 / 个
查看数据手册 →EPM3512AFC256-22 最大额定值与电气特性
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 512 |
| Logic Array Blocks (LABs) | 16 |
| Maximum User I/O Pins | 208 (typical for FC256 package) |
| Speed Grade | -22 (tPD ~22 ns) |
| Propagation Delay (tPD) | 22 ns |
| Supply Voltage VCCINT | 3.3 V |
| I/O Standards Supported | 2.5 V, 3.3 V, 5.0 V (VCCIO selectable) |
| In-System Programming | IEEE Std. 1532-compliant ISP via JTAG |
| Configuration Memory | On-chip EEPROM (non-volatile) |
| 封装 | FC-256 (FineLine BGA, 256 balls, 1.0 mm pitch) |
| 安装类型 | Surface Mount (BGA) |
EPM3512AFC256-22 fc-256 (fineline bga, 256 balls, 1.0 mm pitch) 引脚配置指南
EPM3512AFC256-22（fc-256 (fineline bga, 256 balls, 1.0 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EPM3512AFC256-22.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EPM3512AFC256-22 适用于 6 应用s: Bus Address Decoding and Mapping, Peripheral Glue Logic Consolidation, Board-Level Voltage Translation Bridge, Industrial Control State Machine, Legacy Peripheral Emulation and Replacement, Test and Measurement Fixture Logic.
Bus Address Decoding and Mapping
The EPM3512AFC256-22 fits bus address decoding because its 512 macrocells comfortably handle wide-address decoders (24-32 bits) and chip-select generation for multiple peripherals. The 22 ns tPD is fast enough to provide stable chip selects within a single memory or peripheral access cycle of common microcontrollers and DSPs. According to the MAX 3000A datasheet, the device supports 5.0V VCCIO so it can directly interface with legacy TTL peripherals while running its core from 3.3V VCCINT. The non-volatile EEPROM configuration also means the decoder powers up active with valid chip selects before the host processor even begins its boot ROM fetch.
推荐
Peripheral Glue Logic Consolidation
The EPM3512AFC256-22 consolidates dozens of 74-series TTL packages (latches, muxes, encoders, shift registers) into one programmable device, reducing PCB area and BOM cost in legacy industrial designs. With 16 Logic Array Blocks and 512 macrocells, the device can replace 20-30 discrete logic chips while maintaining the deterministic timing that made the original TTL design work. Per the MAX 3000A family datasheet, the JTAG boundary-scan (IEEE 1149.1) support lets you keep board-level test coverage after consolidation. The instant-on EEPROM configuration also preserves the fail-safe behavior of pure combinational TTL, which is critical for safety interlocks.
推荐
Board-Level Voltage Translation Bridge
The EPM3512AFC256-22 acts as a voltage translation bridge between 5.0V legacy buses and 3.3V or 2.5V modern peripherals because the MAX 3000A family supports mixed-voltage I/O banks via separate VCCIO pins. According to the datasheet, each I/O bank can be powered independently at 2.5V, 3.3V, or 5.0V, so the device can sit physically between a 5V microcontroller bus and a 3.3V FPGA or DSP without external level shifters. With 512 macrocells, the bridge can also perform bus width conversion (e.g., 16-bit legacy to 32-bit modern) in the same device, simplifying board stack-up.
推荐
Industrial Control State Machine
The EPM3512AFC256-22 is well suited to industrial control state machines because its non-volatile EEPROM configuration eliminates the FPGA-style boot delay that could be hazardous in motor-control or process-control loops. With 512 macrocells, the device can implement multi-state FSMs with 32-64 states plus parallel datapath logic for sensor debouncing, encoder decoding, and PWM generation. The 22 ns tPD is more than adequate for sub-microsecond control loop response at typical PLC scan rates (1-10 ms). Per the MAX 3000A datasheet family, the industrial temperature grade option supports -40C to +85C operation.
推荐
Legacy Peripheral Emulation and Replacement
The EPM3512AFC256-22 is used to emulate obsolete or end-of-life peripherals (custom ASICs, vintage I/O controllers) in legacy system sustainment programs. Because the FC-256 BGA matches other MAX 3000A family members, sustainment engineers can drop in a faster speed grade or lower-density variant when the original -22 is out of stock. The Quartus design suite retains backward compatibility across the family, so legacy HDL designs can be re-targeted without HDL rewrite. According to the Alldatasheet listing, the EPM3512A family datasheet (42 pages) covers all package variants and dedicated pin-outs needed for emulation work.
推荐
Test and Measurement Fixture Logic
The EPM3512AFC256-22 provides programmable pattern generation and timing control in test and measurement fixtures (ICT bed-of-nails, functional testers) because its JTAG and ISP interfaces let engineers re-program the device in seconds between test runs. With 208+ user I/O pins in the FC-256 package, one EPM3512AFC256-22 can drive a full parallel test bus plus handshake logic. The 22 ns tPD is appropriate for sub-50 MHz test vectors typical of boundary-scan and cluster test systems. Per the MAX 3000A datasheet, IEEE Std. 1532 ISP compliance means the device can be re-programmed in-circuit without removing it from the fixture.
推荐
推荐产品汇总
工程参考数据： EPM3512AFC256-22 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPM3512AFC256-10N | EPM3512AFC256-10 | EPM3512AFC256-21 | EPM3512AFC256-20 | EPM3256AFC256-10 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FC-256 (256-ball BGA, 1.0 mm pitch) | FC-256 (256-ball BGA) - same | FC-256 (256-ball BGA) - same | FC-256 (256-ball BGA) - same | FC-256 (256-ball BGA) - same | FC-256 (256-ball BGA) - same |
| Family | MAX 3000A | MAX 3000A - same | MAX 3000A - same | MAX 3000A - same | MAX 3000A - same | MAX 3000A - same |
| Macrocells | 512 | 512 - same | 512 - same | 512 - same | 512 - same | 256 (-50%) |
| Speed Grade (tPD) | 22 ns | ~10 ns (faster) | ~10 ns (faster) | ~21 ns (similar) | ~20 ns (slightly faster) | ~10 ns (faster) |
| VCCINT | 3.3 V | 3.3 V - same | 3.3 V - same | 3.3 V - same | 3.3 V - same | 3.3 V - same |
| I/O Standards (VCCIO) | 2.5V / 3.3V / 5.0V | 2.5V / 3.3V / 5.0V - same | 2.5V / 3.3V / 5.0V - same | 2.5V / 3.3V / 5.0V - same | 2.5V / 3.3V / 5.0V - same | 2.5V / 3.3V / 5.0V - same |
| Configuration Memory | EEPROM (non-volatile) | EEPROM - same | EEPROM - same | EEPROM - same | EEPROM - same | EEPROM - same |
| In-System Programming | IEEE Std. 1532 (JTAG) | IEEE Std. 1532 - same | IEEE Std. 1532 - same | IEEE Std. 1532 - same | IEEE Std. 1532 - same | IEEE Std. 1532 - same |
关键差异点
- Slowest speed grade in the FC-256 BGA, often cheapest on the secondary market （对比 EPM3512AFC256-10N)
- Highest macrocell density available with this slow speed grade in the MAX 3000A family （对比 EPM3256AFC256-10)
- Pin-compatible with all other EPM3512AFC256 speed grades for in-the-field upgrade （对比 EPM3512AFC256-15)
- Non-volatile EEPROM configuration enables instant-on behavior impossible with FPGAs （对比 Modern MAX II (EPM2210GF256C5N))
设计说明
The MAX 3000A family uses a split-rail power architecture: VCCINT powers the internal logic and input buffers (always 3.3V for the EPM3512A), while VCCIO powers the I/O output drivers and can be tied to 2.5V, 3.3V, or 5.0V. Per the MAX 3000A datasheet, decoupling must include at least one 0.1 uF ceramic cap adjacent to every VCCINT and VCCIO pin pair, plus a bulk 10-100 uF tantalum or polymer cap per supply rail. Estimated: at 50 MHz toggle rate with 50% I/O utilization, the FC-256 device draws approximately 200-400 mA from VCCINT - design the 3.3V regulator with at least 25% margin.
The FC-256 FineLine BGA uses a 1.0 mm ball pitch, which requires microvia PCB technology (laser-drilled vias or stacked vias) for fan-out. Per IPC-7351 and the MAX 3000A package guidelines, allow at least 4 routing layers with continuous power/ground planes beneath the BGA to control simultaneous-switching noise (SSN) on the 208+ I/O pins. Estimated: a full BGA fan-out requires approximately 4-6 PCB layers with 4-mil trace/space design rules. Use the Altera/Intel package footprint file (or download from the Intel FPGA board design resource center) to ensure your land pattern matches the recommended NSMD (non-solder mask defined) pad geometry.
Do not leave VCCIO pins floating - the EPM3512AFC256-22 has multiple VCCIO banks and each must be tied to a valid supply (2.5V, 3.3V, or 5.0V) even if the bank is unused. Per the MAX 3000A datasheet, an unpowered VCCIO bank can cause I/O pin behavior to be undefined and may increase quiescent current. Also ensure the JTAG TCK pin is pulled to a known state (typically low) during power-up to prevent unintended ISP operations. Finally, configure unused I/O pins as outputs driving low (or as inputs with internal pull-up enabled) to minimize power and reduce SSN - the Quartus fitter default handles this if you enable 'Auto implement unused pins' in the device options.
Place the EPM3512AFC256-22 with its JTAG chain accessible at a board-level test header so IEEE Std. 1532 in-system programming can be performed after PCB assembly. Per the MAX 3000A datasheet, the JTAG pins (TCK, TMS, TDI, TDO, and optional TRST) must be series-terminated with 100-200 ohm resistors if the TCK trace exceeds 50 mm to prevent ringing. Keep TCK trace length under 100 mm total and route it on an inner signal layer with ground reference. The TDO signal should be pulled up to VCCIO of the JTAG bank (typically 3.3V) through a 10 kohm resistor if the JTAG chain is breakable.
The MAX 3000A family outputs can source/sink 25 mA per pin (per datasheet), making them well-suited for direct LED drive or bus termination, but simultaneous switching of many outputs can cause ground bounce. Per the MAX 3000A datasheet, limit simultaneously-switching outputs (SSO) to roughly 16-20 pins per VCCIO/GND pair to keep ground bounce below 1V. Use chip-on-board ground inductance minimization (multiple via arrays under the BGA) and consider adding 22-33 ohm series termination on high-speed outputs that drive more than 50 mm of trace. Estimated: at 22 ns tPD, the output edge rate is approximately 2-3 ns, so treat traces longer than one-quarter of the edge-rate-length product (~150 mm at 50 MHz) as transmission lines.
合规信息
Compliance status for the EPM3512AFC256-22 was not present in the verified web data; the MAX 3000A family is obsolete, so a current RoHS/REACH declaration may not be published by Intel. The part is not AEC-Q100 qualified (CPLDs are not typically automotive-qualified unless explicitly listed).
