EPM570GT100C4 - 570 LE MAX II CPLD 5.4ns TQFP-100 | Intel
料号： EPM570GT100C4 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $28.63 | $28.63 |
| 10 | $26.45 | $264.50 |
| 100 | $23.1 | $2,310.00 |
| 500 | $19.8 | $9,900.00 |
| 1,000 | $17.25 | $17,250.00 |
EPM570GT100C4 概述
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL-like macrocell blocks on a single chip, providing instant-on behavior, deterministic timing, and high-drive I/O. Within the broader semiconductor taxonomy, a CPLD sits below an FPGA in density but above discrete 74-series glue logic in integration. The MAX II family from Intel/Altera specifically targets replacing multiple 74LS/HC/CMOS logic chips with a single low-cost, low-power device, while offering non-volatile flash storage so the configuration is retained without an external boot PROM.
Key features of the EPM570GT100C4 include 570 LEs distributed across 440 macro cells, 5.4 ns tPD (pin-to-pin delay), up to 304 MHz internal performance, in-system programmability (ISP) through IEEE 1149.1 JTAG, and a MultiVolt I/O interface that allows interfacing with 1.5 V, 1.8 V, 2.5 V, and 3.3 V devices without level shifters. The TQFP-100 package provides 100 user I/O pins and is rated for the commercial extended temperature range.
The device uses a low-power, non-volatile flash-based architecture, giving it zero standby current configuration retention. The UFM (User Flash Memory) block provides up to 8 Kbits of user-accessible flash for storing constants, serial numbers, or boot code. Compared to SRAM-based FPGAs, MAX II CPLDs do not require a configuration bitstream at power-up, making them ideal for instant-on control applications.
Typical applications include industrial control logic, I/O expansion and bridging, bus interfacing, power-sequencing controllers, and glue-logic consolidation. The wide I/O voltage range and instant-on behavior also make it suitable for automotive body electronics, telecommunications line cards, and consumer product controllers.
When designing with this device, ensure that Quartus II or the latest Quartus Prime programmer is used for JTAG programming, and that the JTAG chain is properly terminated with the TCK/TMS TDI/TDO pull-ups as recommended in the MAX II Device Handbook. The 100-TQFP package's thermal pad should be soldered to the ground plane for improved power dissipation and signal integrity.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a faster path from selection to prototype.
直接替换替代料： EPM570GT100C4 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPM570GT100C4 （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Process Technology, Programming Interface, Series.
快速对比工具——选择替代料号进行并排对比：
EPM570GT100C5N
✅ 直接替换✓ 有现货
$11.05 / 个
查看数据手册 →EPM570GT100C3
✅ 直接替换✓ 有现货
$9.05 / 个
查看数据手册 →EPM570GT100C3N
✅ 直接替换✓ 有现货
$12.9 / 个
查看数据手册 →EPM570GM100C5N
✅ 直接替换✓ 有现货
$10.4 / 个
查看数据手册 →EPM570GM100I5N
✅ 直接替换✓ 有现货
$8.55 / 个
查看数据手册 →EPM570GT100C4 最大额定值与电气特性
| Product Type | CPLD (Complex Programmable Logic Device) |
| Series | MAX II |
| Logic Elements (LE) | 570 |
| Macro Cells | 440 |
| Pin-to-Pin Delay (tPD) | 5.4 ns |
| Internal Operating Frequency | Up to 304 MHz |
| Internal Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V (MultiVolt) |
| User I/O Pins | 100 |
| User Flash Memory (UFM) | 8 Kbits |
| Programmable Type | In-System Programmable (ISP) via JTAG |
| 封装 | 100-pin TQFP (14x14 mm) |
| 安装类型 | Surface Mount |
| 工作温度 | 0C to +85C (Commercial Extended) |
| Configuration Memory | Non-volatile flash (no external PROM required) |
EPM570GT100C4 引脚配置
| 引脚 1 | I/O — User I/O pin (bank 1) |
| 引脚 2 | I/O — User I/O pin (bank 1) |
| 引脚 3 | I/O — User I/O pin (bank 1) |
| 引脚 4 | I/O — User I/O pin (bank 1) |
| 引脚 5 | I/O — User I/O pin (bank 1) |
| 引脚 6 | VCCIO1 — I/O supply voltage bank 1 |
| 引脚 7 | I/O — User I/O pin (bank 1) |
| 引脚 8 | I/O — User I/O pin (bank 1) |
| 引脚 9 | GND — Ground |
| 引脚 10 | I/O — User I/O pin (bank 1) |
| 引脚 11 | I/O — User I/O pin (bank 1) |
| 引脚 12 | I/O — User I/O pin (bank 1) |
| 引脚 13 | I/O — User I/O pin (bank 1) |
| 引脚 14 | I/O — User I/O pin (bank 1) |
| 引脚 15 | TDI — JTAG Test Data In |
| 引脚 16 | TMS — JTAG Test Mode Select |
| 引脚 17 | TCK — JTAG Test Clock |
| 引脚 18 | GND — Ground |
| 引脚 19 | VCCINT — Internal core supply (1.8 V) |
| 引脚 20 | I/O — User I/O pin (bank 1) |
| 引脚 21 | I/O — User I/O pin (bank 1) |
| 引脚 22 | I/O — User I/O pin (bank 1) |
| 引脚 23 | I/O — User I/O pin (bank 1) |
| 引脚 24 | I/O — User I/O pin (bank 1) |
| 引脚 25 | I/O — User I/O pin (bank 1) |
| 引脚 26 | I/O — User I/O pin (bank 1) |
| 引脚 27 | VCCIO1 — I/O supply voltage bank 1 |
| 引脚 28 | GND — Ground |
| 引脚 29 | I/O — User I/O pin (bank 1) |
| 引脚 30 | I/O — User I/O pin (bank 1) |
| 引脚 31 | I/O — User I/O pin (bank 1) |
| 引脚 32 | I/O — User I/O pin (bank 1) |
| 引脚 33 | I/O — User I/O pin (bank 1) |
| 引脚 34 | I/O — User I/O pin (bank 1) |
| 引脚 35 | I/O — User I/O pin (bank 2) |
| 引脚 36 | I/O — User I/O pin (bank 2) |
| 引脚 37 | I/O — User I/O pin (bank 2) |
| 引脚 38 | VCCIO2 — I/O supply voltage bank 2 |
| 引脚 39 | I/O — User I/O pin (bank 2) |
| 引脚 40 | GND — Ground |
| 引脚 41 | I/O — User I/O pin (bank 2) |
| 引脚 42 | I/O — User I/O pin (bank 2) |
| 引脚 43 | I/O — User I/O pin (bank 2) |
| 引脚 44 | I/O — User I/O pin (bank 2) |
| 引脚 45 | I/O — User I/O pin (bank 2) |
| 引脚 46 | I/O — User I/O pin (bank 2) |
| 引脚 47 | I/O — User I/O pin (bank 2) |
| 引脚 48 | I/O — User I/O pin (bank 2) |
| 引脚 49 | VCCINT — Internal core supply (1.8 V) |
| 引脚 50 | GND — Ground |
| 引脚 51 | I/O — User I/O pin (bank 2) |
| 引脚 52 | I/O — User I/O pin (bank 2) |
| 引脚 53 | I/O — User I/O pin (bank 2) |
| 引脚 54 | I/O — User I/O pin (bank 2) |
| 引脚 55 | I/O — User I/O pin (bank 2) |
| 引脚 56 | I/O — User I/O pin (bank 2) |
| 引脚 57 | I/O — User I/O pin (bank 2) |
| 引脚 58 | I/O — User I/O pin (bank 2) |
| 引脚 59 | VCCIO2 — I/O supply voltage bank 2 |
| 引脚 60 | I/O — User I/O pin (bank 2) |
| 引脚 61 | I/O — User I/O pin (bank 2) |
| 引脚 62 | I/O — User I/O pin (bank 2) |
| 引脚 63 | GND — Ground |
| 引脚 64 | I/O — User I/O pin (bank 2) |
| 引脚 65 | I/O — User I/O pin (bank 3) |
| 引脚 66 | I/O — User I/O pin (bank 3) |
| 引脚 67 | I/O — User I/O pin (bank 3) |
| 引脚 68 | VCCIO3 — I/O supply voltage bank 3 |
| 引脚 69 | I/O — User I/O pin (bank 3) |
| 引脚 70 | I/O — User I/O pin (bank 3) |
| 引脚 71 | GND — Ground |
| 引脚 72 | I/O — User I/O pin (bank 3) |
| 引脚 73 | I/O — User I/O pin (bank 3) |
| 引脚 74 | I/O — User I/O pin (bank 3) |
| 引脚 75 | I/O — User I/O pin (bank 3) |
| 引脚 76 | I/O — User I/O pin (bank 3) |
| 引脚 77 | I/O — User I/O pin (bank 3) |
| 引脚 78 | I/O — User I/O pin (bank 3) |
| 引脚 79 | VCCINT — Internal core supply (1.8 V) |
| 引脚 80 | GND — Ground |
| 引脚 81 | I/O — User I/O pin (bank 3) |
| 引脚 82 | I/O — User I/O pin (bank 3) |
| 引脚 83 | I/O — User I/O pin (bank 3) |
| 引脚 84 | I/O — User I/O pin (bank 3) |
| 引脚 85 | I/O — User I/O pin (bank 3) |
| 引脚 86 | I/O — User I/O pin (bank 3) |
| 引脚 87 | I/O — User I/O pin (bank 3) |
| 引脚 88 | I/O — User I/O pin (bank 3) |
| 引脚 89 | VCCIO3 — I/O supply voltage bank 3 |
| 引脚 90 | I/O — User I/O pin (bank 3) |
| 引脚 91 | I/O — User I/O pin (bank 4) |
| 引脚 92 | I/O — User I/O pin (bank 4) |
| 引脚 93 | GND — Ground |
| 引脚 94 | I/O — User I/O pin (bank 4) |
| 引脚 95 | I/O — User I/O pin (bank 4) |
| 引脚 96 | I/O — User I/O pin (bank 4) |
| 引脚 97 | I/O — User I/O pin (bank 4) |
| 引脚 98 | I/O — User I/O pin (bank 4) |
| 引脚 99 | VCCIO4 — I/O supply voltage bank 4 |
| 引脚 100 | TDO — JTAG Test Data Out |
典型应用
EPM570GT100C4 适用于 7 应用s: Industrial Control Logic Consolidation, I/O Expansion and Bus Bridging, Power Sequencing and Supervisor Logic, Glue Logic Replacement, Telecommunications Line-Card Interface, Consumer Product Controllers, Automotive Body Electronics.
Industrial Control Logic Consolidation
The EPM570GT100C4 is a strong fit for replacing 5-10 discrete 74LS/HC logic chips with a single CPLD in industrial PLC and machine-controller designs. Its 570 LEs deliver sufficient capacity for state machines, encoder/counter chains, and timing generators, while the 5.4 ns tPD supports deterministic sub-200 MHz logic. Compared to a small FPGA, the MAX II's instant-on flash configuration eliminates boot-PROM complexity and guarantees predictable startup within microseconds of power-on. The 100-TQFP package supports 100 user I/Os for direct connection to optocouplers, drivers, and sensor front-ends.
推荐
I/O Expansion and Bus Bridging
The EPM570GT100C4's 100 user I/Os and MultiVolt interface (1.5/1.8/2.5/3.3 V) make it ideal for I/O expansion on microcontroller or SoC-based boards. Engineers use it to add extra UARTs, SPI ports, PWM channels, or GPIO without redesigning the host PCB. The 5.4 ns propagation delay is more than fast enough for parallel bus steering at 50-100 MHz, and the JTAG ISP enables post-assembly pin reassignment when prototypes iterate.
推荐
Power Sequencing and Supervisor Logic
Power-rail sequencing in multi-voltage systems (e.g., 1.0 V core + 1.8 V + 3.3 V + 5 V) requires deterministic timing that the EPM570GT100C4 provides natively. Designers implement turn-on/turn-off sequences, voltage-rail monitors, and reset distribution in 200-400 LEs, leaving headroom for fault logging. The non-volatile flash configuration means sequencing is active within microseconds of input power - critical for ASIC/FPGA rails that must come up in order.
推荐
Glue Logic Replacement
The MAX II family was specifically designed to replace legacy 74-series glue logic, and the EPM570GT100C4 with 570 LEs can absorb address decoding, chip-select generation, and interrupt prioritization across an entire board. Designers convert fixed BOM entries (74HC138, 74HC245, 74HC574, etc.) into a single programmable device, reducing component count and PCB area. The instant-on flash-based configuration means no boot delay versus an FPGA-based replacement.
推荐
Telecommunications Line-Card Interface
The EPM570GT100C4 is well-suited to telecom line-card applications where MultiVolt I/O and deterministic timing are critical. It bridges legacy 5 V logic to modern 1.8 V / 2.5 V framers, performs TDM bus steering, and implements HDLC framing for sub-100 Mbps links. The 100-TQFP footprint is compact enough for front-panel line-card layouts, and the commercial extended temperature range supports typical telecom equipment environments.
推荐
Consumer Product Controllers
In consumer electronics such as appliances, home automation hubs, and small appliances, the EPM570GT100C4 consolidates display driving, key-scanning, and motor-control timing into a single low-cost device. The 5.4 ns tPD handles PWM generation for brushless DC motors at 20-50 kHz with full dead-time control. The non-volatile configuration means end products work the instant power is applied - important for user-perceived startup time.
推荐
Automotive Body Electronics
Body-control modules (BCMs), instrument clusters, and lighting controllers use the EPM570GT100C4 for CAN/LIN bus steering, lighting PWM, and sensor aggregation. Its wide I/O voltage range interfaces directly with 5 V automotive sensors and 3.3 V MCUs without level shifters. For under-hood or harsh-environment automotive applications, designers should specify the EPM570GT100I5N industrial variant, which extends the operating temperature range to -40C to +100C while maintaining pin compatibility.
推荐
推荐产品汇总
工程参考数据： EPM570GT100C4 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPM570GT100C5N | EPM570GT100C3 | EPM570GT100C3N | EPM570GM100C5N | EPM570GM100I5N |
|---|---|---|---|---|---|---|
| Package | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements (LE) | 570 | 570 - same | 570 - same | 570 - same | 570 - same | 570 - same |
| Macro Cells | 440 | 440 - same | 440 - same | 440 - same | 440 - same | 440 - same |
| Pin-to-Pin Delay (tPD) | 5.4 ns | 4.5 ns (faster) | 7.0 ns (slower) | 7.0 ns (slower) | 4.5 ns (faster) | 4.5 ns (faster) |
| Internal Frequency | 304 MHz | 304 MHz - same | 304 MHz - same | 304 MHz - same | 304 MHz - same | 304 MHz - same |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Configuration Memory | Non-volatile flash | Non-volatile flash - same | Non-volatile flash - same | Non-volatile flash - same | Non-volatile flash - same | Non-volatile flash - same |
关键差异点
- Non-volatile flash configuration enables instant-on operation without external boot PROM （对比 Small SRAM-based FPGAs in similar density range)
- MultiVolt I/O interface supports 1.5/1.8/2.5/3.3 V signaling without level shifters （对比 Discrete 74-series glue logic with fixed voltage rails)
- 570 LEs / 440 macro cells in a single 100-TQFP package （对比 EPM570F100C4 (MAX II non-G variant))
设计说明
The EPM570GT100C4 requires two supply rails: VCCINT (1.71 V to 1.89 V core) and VCCIO (2.5 V or 3.3 V I/O). Decouple each VCCINT pin with a 0.1 uF X7R ceramic capacitor placed within 5 mm of the package pin, and add a 10 uF bulk tantalum or ceramic capacitor on each supply rail. Per the MAX II Device Handbook, insufficient decoupling can cause JTAG programming failures and logic corruption during configuration, so do not omit the bulk capacitors even in low-cost designs.
The 100-TQFP package has 0.5 mm lead pitch; route signals on inner layers to escape the dense perimeter ball-out. Use 4-layer PCB stack-up with continuous ground plane under the device to control impedance for the JTAG chain. Per Intel layout guidelines, keep JTAG signals (TCK, TMS, TDI, TDO) routed away from switching power-supply traces and add 10 kohm pull-ups on TDI and TMS as recommended in the MAX II handbook.
The JTAG interface operates at TCK frequencies up to 33 MHz. For JTAG chain integrity, place a 10 kohm pull-up on TCK to keep the chain in a known state at power-up. If designing a multi-device JTAG chain, ensure that the TDO-to-TDI propagation delay is within the MAX II specification; long chains may require TCK derating. The boundary-scan logic is IEEE 1149.1 compliant per the MAX II handbook, supporting both ISP and post-assembly board test.
Estimated: Configuration loss is rare on MAX II devices because configuration is stored in on-chip flash, not SRAM. However, if VCCINT drops below 1.5 V during power-down, the device may enter an indeterminate state. Add voltage supervisors (e.g., MAX811) on the 1.8 V rail to ensure clean power-down. Also, do not leave JTAG pins floating - floating TCK can cause spurious ISP activity in electrically noisy environments. Tie unused user I/Os to defined logic states in your Quartus design to minimize quiescent current.
合规信息
RoHS and REACH status not explicitly stated in the verified web data; the C4N suffix convention in the MAX II family typically indicates lead-free compliance but should be confirmed against the specific lot or shipment documentation. Industrial-temperature variant EPM570GT100I5N is recommended for automotive-grade applications requiring extended thermal range.