EPM570GT100C4 - 570 LE MAX II CPLD 5.4ns TQFP-100 | Intel
MPN: EPM570GT100C4 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.63 | $28.63 |
| 10 | $26.45 | $264.50 |
| 100 | $23.1 | $2,310.00 |
| 500 | $19.8 | $9,900.00 |
| 1,000 | $17.25 | $17,250.00 |
Drop-in alternatives for EPM570GT100C4 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM570GT100C5N
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View Datasheet βEPM570GT100C3
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View Datasheet βEPM570GT100C3N
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$12.9 / Unit
View Datasheet βEPM570GM100C5N
β Drop-Inβ In Stock
$10.4 / Unit
View Datasheet βEPM570GM100I5N
β Drop-Inβ In Stock
$8.55 / Unit
View Datasheet βEPM570GT100C4 Maximum Ratings & Electrical Characteristics
| Product Type | CPLD (Complex Programmable Logic Device) |
| Series | MAX II |
| Logic Elements (LE) | 570 |
| Macro Cells | 440 |
| Pin-to-Pin Delay (tPD) | 5.4 ns |
| Internal Operating Frequency | Up to 304 MHz |
| Internal Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V (MultiVolt) |
| User I/O Pins | 100 |
| User Flash Memory (UFM) | 8 Kbits |
| Programmable Type | In-System Programmable (ISP) via JTAG |
| Package | 100-pin TQFP (14x14 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (Commercial Extended) |
| Configuration Memory | Non-volatile flash (no external PROM required) |
EPM570GT100C4 Pin Configuration
| Pin 1 | I/O β User I/O pin (bank 1) |
| Pin 2 | I/O β User I/O pin (bank 1) |
| Pin 3 | I/O β User I/O pin (bank 1) |
| Pin 4 | I/O β User I/O pin (bank 1) |
| Pin 5 | I/O β User I/O pin (bank 1) |
| Pin 6 | VCCIO1 β I/O supply voltage bank 1 |
| Pin 7 | I/O β User I/O pin (bank 1) |
| Pin 8 | I/O β User I/O pin (bank 1) |
| Pin 9 | GND β Ground |
| Pin 10 | I/O β User I/O pin (bank 1) |
| Pin 11 | I/O β User I/O pin (bank 1) |
| Pin 12 | I/O β User I/O pin (bank 1) |
| Pin 13 | I/O β User I/O pin (bank 1) |
| Pin 14 | I/O β User I/O pin (bank 1) |
| Pin 15 | TDI β JTAG Test Data In |
| Pin 16 | TMS β JTAG Test Mode Select |
| Pin 17 | TCK β JTAG Test Clock |
| Pin 18 | GND β Ground |
| Pin 19 | VCCINT β Internal core supply (1.8 V) |
| Pin 20 | I/O β User I/O pin (bank 1) |
| Pin 21 | I/O β User I/O pin (bank 1) |
| Pin 22 | I/O β User I/O pin (bank 1) |
| Pin 23 | I/O β User I/O pin (bank 1) |
| Pin 24 | I/O β User I/O pin (bank 1) |
| Pin 25 | I/O β User I/O pin (bank 1) |
| Pin 26 | I/O β User I/O pin (bank 1) |
| Pin 27 | VCCIO1 β I/O supply voltage bank 1 |
| Pin 28 | GND β Ground |
| Pin 29 | I/O β User I/O pin (bank 1) |
| Pin 30 | I/O β User I/O pin (bank 1) |
| Pin 31 | I/O β User I/O pin (bank 1) |
| Pin 32 | I/O β User I/O pin (bank 1) |
| Pin 33 | I/O β User I/O pin (bank 1) |
| Pin 34 | I/O β User I/O pin (bank 1) |
| Pin 35 | I/O β User I/O pin (bank 2) |
| Pin 36 | I/O β User I/O pin (bank 2) |
| Pin 37 | I/O β User I/O pin (bank 2) |
| Pin 38 | VCCIO2 β I/O supply voltage bank 2 |
| Pin 39 | I/O β User I/O pin (bank 2) |
| Pin 40 | GND β Ground |
| Pin 41 | I/O β User I/O pin (bank 2) |
| Pin 42 | I/O β User I/O pin (bank 2) |
| Pin 43 | I/O β User I/O pin (bank 2) |
| Pin 44 | I/O β User I/O pin (bank 2) |
| Pin 45 | I/O β User I/O pin (bank 2) |
| Pin 46 | I/O β User I/O pin (bank 2) |
| Pin 47 | I/O β User I/O pin (bank 2) |
| Pin 48 | I/O β User I/O pin (bank 2) |
| Pin 49 | VCCINT β Internal core supply (1.8 V) |
| Pin 50 | GND β Ground |
| Pin 51 | I/O β User I/O pin (bank 2) |
| Pin 52 | I/O β User I/O pin (bank 2) |
| Pin 53 | I/O β User I/O pin (bank 2) |
| Pin 54 | I/O β User I/O pin (bank 2) |
| Pin 55 | I/O β User I/O pin (bank 2) |
| Pin 56 | I/O β User I/O pin (bank 2) |
| Pin 57 | I/O β User I/O pin (bank 2) |
| Pin 58 | I/O β User I/O pin (bank 2) |
| Pin 59 | VCCIO2 β I/O supply voltage bank 2 |
| Pin 60 | I/O β User I/O pin (bank 2) |
| Pin 61 | I/O β User I/O pin (bank 2) |
| Pin 62 | I/O β User I/O pin (bank 2) |
| Pin 63 | GND β Ground |
| Pin 64 | I/O β User I/O pin (bank 2) |
| Pin 65 | I/O β User I/O pin (bank 3) |
| Pin 66 | I/O β User I/O pin (bank 3) |
| Pin 67 | I/O β User I/O pin (bank 3) |
| Pin 68 | VCCIO3 β I/O supply voltage bank 3 |
| Pin 69 | I/O β User I/O pin (bank 3) |
| Pin 70 | I/O β User I/O pin (bank 3) |
| Pin 71 | GND β Ground |
| Pin 72 | I/O β User I/O pin (bank 3) |
| Pin 73 | I/O β User I/O pin (bank 3) |
| Pin 74 | I/O β User I/O pin (bank 3) |
| Pin 75 | I/O β User I/O pin (bank 3) |
| Pin 76 | I/O β User I/O pin (bank 3) |
| Pin 77 | I/O β User I/O pin (bank 3) |
| Pin 78 | I/O β User I/O pin (bank 3) |
| Pin 79 | VCCINT β Internal core supply (1.8 V) |
| Pin 80 | GND β Ground |
| Pin 81 | I/O β User I/O pin (bank 3) |
| Pin 82 | I/O β User I/O pin (bank 3) |
| Pin 83 | I/O β User I/O pin (bank 3) |
| Pin 84 | I/O β User I/O pin (bank 3) |
| Pin 85 | I/O β User I/O pin (bank 3) |
| Pin 86 | I/O β User I/O pin (bank 3) |
| Pin 87 | I/O β User I/O pin (bank 3) |
| Pin 88 | I/O β User I/O pin (bank 3) |
| Pin 89 | VCCIO3 β I/O supply voltage bank 3 |
| Pin 90 | I/O β User I/O pin (bank 3) |
| Pin 91 | I/O β User I/O pin (bank 4) |
| Pin 92 | I/O β User I/O pin (bank 4) |
| Pin 93 | GND β Ground |
| Pin 94 | I/O β User I/O pin (bank 4) |
| Pin 95 | I/O β User I/O pin (bank 4) |
| Pin 96 | I/O β User I/O pin (bank 4) |
| Pin 97 | I/O β User I/O pin (bank 4) |
| Pin 98 | I/O β User I/O pin (bank 4) |
| Pin 99 | VCCIO4 β I/O supply voltage bank 4 |
| Pin 100 | TDO β JTAG Test Data Out |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570GT100C4 is suitable for 7 applications: Industrial Control Logic Consolidation, I/O Expansion and Bus Bridging, Power Sequencing and Supervisor Logic, Glue Logic Replacement, Telecommunications Line-Card Interface, Consumer Product Controllers, Automotive Body Electronics.
Industrial Control Logic Consolidation
The EPM570GT100C4 is a strong fit for replacing 5-10 discrete 74LS/HC logic chips with a single CPLD in industrial PLC and machine-controller designs. Its 570 LEs deliver sufficient capacity for state machines, encoder/counter chains, and timing generators, while the 5.4 ns tPD supports deterministic sub-200 MHz logic. Compared to a small FPGA, the MAX II's instant-on flash configuration eliminates boot-PROM complexity and guarantees predictable startup within microseconds of power-on. The 100-TQFP package supports 100 user I/Os for direct connection to optocouplers, drivers, and sensor front-ends.
Recommended
I/O Expansion and Bus Bridging
The EPM570GT100C4's 100 user I/Os and MultiVolt interface (1.5/1.8/2.5/3.3 V) make it ideal for I/O expansion on microcontroller or SoC-based boards. Engineers use it to add extra UARTs, SPI ports, PWM channels, or GPIO without redesigning the host PCB. The 5.4 ns propagation delay is more than fast enough for parallel bus steering at 50-100 MHz, and the JTAG ISP enables post-assembly pin reassignment when prototypes iterate.
Recommended
Power Sequencing and Supervisor Logic
Power-rail sequencing in multi-voltage systems (e.g., 1.0 V core + 1.8 V + 3.3 V + 5 V) requires deterministic timing that the EPM570GT100C4 provides natively. Designers implement turn-on/turn-off sequences, voltage-rail monitors, and reset distribution in 200-400 LEs, leaving headroom for fault logging. The non-volatile flash configuration means sequencing is active within microseconds of input power - critical for ASIC/FPGA rails that must come up in order.
Recommended
Glue Logic Replacement
The MAX II family was specifically designed to replace legacy 74-series glue logic, and the EPM570GT100C4 with 570 LEs can absorb address decoding, chip-select generation, and interrupt prioritization across an entire board. Designers convert fixed BOM entries (74HC138, 74HC245, 74HC574, etc.) into a single programmable device, reducing component count and PCB area. The instant-on flash-based configuration means no boot delay versus an FPGA-based replacement.
Recommended
Telecommunications Line-Card Interface
The EPM570GT100C4 is well-suited to telecom line-card applications where MultiVolt I/O and deterministic timing are critical. It bridges legacy 5 V logic to modern 1.8 V / 2.5 V framers, performs TDM bus steering, and implements HDLC framing for sub-100 Mbps links. The 100-TQFP footprint is compact enough for front-panel line-card layouts, and the commercial extended temperature range supports typical telecom equipment environments.
Recommended
Consumer Product Controllers
In consumer electronics such as appliances, home automation hubs, and small appliances, the EPM570GT100C4 consolidates display driving, key-scanning, and motor-control timing into a single low-cost device. The 5.4 ns tPD handles PWM generation for brushless DC motors at 20-50 kHz with full dead-time control. The non-volatile configuration means end products work the instant power is applied - important for user-perceived startup time.
Recommended
Automotive Body Electronics
Body-control modules (BCMs), instrument clusters, and lighting controllers use the EPM570GT100C4 for CAN/LIN bus steering, lighting PWM, and sensor aggregation. Its wide I/O voltage range interfaces directly with 5 V automotive sensors and 3.3 V MCUs without level shifters. For under-hood or harsh-environment automotive applications, designers should specify the EPM570GT100I5N industrial variant, which extends the operating temperature range to -40C to +100C while maintaining pin compatibility.
Recommended
Recommended Products Summary
Engineering reference data for EPM570GT100C4 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570GT100C5N | EPM570GT100C3 | EPM570GT100C3N | EPM570GM100C5N | EPM570GM100I5N |
|---|---|---|---|---|---|---|
| Package | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements (LE) | 570 | 570 - same | 570 - same | 570 - same | 570 - same | 570 - same |
| Macro Cells | 440 | 440 - same | 440 - same | 440 - same | 440 - same | 440 - same |
| Pin-to-Pin Delay (tPD) | 5.4 ns | 4.5 ns (faster) | 7.0 ns (slower) | 7.0 ns (slower) | 4.5 ns (faster) | 4.5 ns (faster) |
| Internal Frequency | 304 MHz | 304 MHz - same | 304 MHz - same | 304 MHz - same | 304 MHz - same | 304 MHz - same |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Configuration Memory | Non-volatile flash | Non-volatile flash - same | Non-volatile flash - same | Non-volatile flash - same | Non-volatile flash - same | Non-volatile flash - same |
Key Differentiators
- Non-volatile flash configuration enables instant-on operation without external boot PROM (vs Small SRAM-based FPGAs in similar density range)
- MultiVolt I/O interface supports 1.5/1.8/2.5/3.3 V signaling without level shifters (vs Discrete 74-series glue logic with fixed voltage rails)
- 570 LEs / 440 macro cells in a single 100-TQFP package (vs EPM570F100C4 (MAX II non-G variant))
Design Notes
The EPM570GT100C4 requires two supply rails: VCCINT (1.71 V to 1.89 V core) and VCCIO (2.5 V or 3.3 V I/O). Decouple each VCCINT pin with a 0.1 uF X7R ceramic capacitor placed within 5 mm of the package pin, and add a 10 uF bulk tantalum or ceramic capacitor on each supply rail. Per the MAX II Device Handbook, insufficient decoupling can cause JTAG programming failures and logic corruption during configuration, so do not omit the bulk capacitors even in low-cost designs.
The 100-TQFP package has 0.5 mm lead pitch; route signals on inner layers to escape the dense perimeter ball-out. Use 4-layer PCB stack-up with continuous ground plane under the device to control impedance for the JTAG chain. Per Intel layout guidelines, keep JTAG signals (TCK, TMS, TDI, TDO) routed away from switching power-supply traces and add 10 kohm pull-ups on TDI and TMS as recommended in the MAX II handbook.
The JTAG interface operates at TCK frequencies up to 33 MHz. For JTAG chain integrity, place a 10 kohm pull-up on TCK to keep the chain in a known state at power-up. If designing a multi-device JTAG chain, ensure that the TDO-to-TDI propagation delay is within the MAX II specification; long chains may require TCK derating. The boundary-scan logic is IEEE 1149.1 compliant per the MAX II handbook, supporting both ISP and post-assembly board test.
Estimated: Configuration loss is rare on MAX II devices because configuration is stored in on-chip flash, not SRAM. However, if VCCINT drops below 1.5 V during power-down, the device may enter an indeterminate state. Add voltage supervisors (e.g., MAX811) on the 1.8 V rail to ensure clean power-down. Also, do not leave JTAG pins floating - floating TCK can cause spurious ISP activity in electrically noisy environments. Tie unused user I/Os to defined logic states in your Quartus design to minimize quiescent current.
Compliance Information
RoHS and REACH status not explicitly stated in the verified web data; the C4N suffix convention in the MAX II family typically indicates lead-free compliance but should be confirmed against the specific lot or shipment documentation. Industrial-temperature variant EPM570GT100I5N is recommended for automotive-grade applications requiring extended thermal range.
