EPM570GT100C4 - 570 LE MAX II CPLD 5.4ns TQFP-100 | Intel
Référence : EPM570GT100C4 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.63 | $28,63 |
| 10 | $26.45 | $264,50 |
| 100 | $23.1 | $2 310,00 |
| 500 | $19.8 | $9 900,00 |
| 1 000 | $17.25 | $17 250,00 |
EPM570GT100C4 Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL-like macrocell blocks on a single chip, providing instant-on behavior, deterministic timing, and high-drive I/O. Within the broader semiconductor taxonomy, a CPLD sits below an FPGA in density but above discrete 74-series glue logic in integration. The MAX II family from Intel/Altera specifically targets replacing multiple 74LS/HC/CMOS logic chips with a single low-cost, low-power device, while offering non-volatile flash storage so the configuration is retained without an external boot PROM.
Key features of the EPM570GT100C4 include 570 LEs distributed across 440 macro cells, 5.4 ns tPD (pin-to-pin delay), up to 304 MHz internal performance, in-system programmability (ISP) through IEEE 1149.1 JTAG, and a MultiVolt I/O interface that allows interfacing with 1.5 V, 1.8 V, 2.5 V, and 3.3 V devices without level shifters. The TQFP-100 package provides 100 user I/O pins and is rated for the commercial extended temperature range.
The device uses a low-power, non-volatile flash-based architecture, giving it zero standby current configuration retention. The UFM (User Flash Memory) block provides up to 8 Kbits of user-accessible flash for storing constants, serial numbers, or boot code. Compared to SRAM-based FPGAs, MAX II CPLDs do not require a configuration bitstream at power-up, making them ideal for instant-on control applications.
Typical applications include industrial control logic, I/O expansion and bridging, bus interfacing, power-sequencing controllers, and glue-logic consolidation. The wide I/O voltage range and instant-on behavior also make it suitable for automotive body electronics, telecommunications line cards, and consumer product controllers.
When designing with this device, ensure that Quartus II or the latest Quartus Prime programmer is used for JTAG programming, and that the JTAG chain is properly terminated with the TCK/TMS TDI/TDO pull-ups as recommended in the MAX II Device Handbook. The 100-TQFP package's thermal pad should be soldered to the ground plane for improved power dissipation and signal integrity.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a faster path from selection to prototype.
Alternatives de remplacement direct pour EPM570GT100C4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570GT100C4 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Process Technology, Programming Interface, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570GT100C5N
✅ Remplacement direct✓ En stock
$11.05 / unité
Voir la fiche technique →EPM570GT100C3
✅ Remplacement direct✓ En stock
$9.05 / unité
Voir la fiche technique →EPM570GT100C3N
✅ Remplacement direct✓ En stock
$12.9 / unité
Voir la fiche technique →EPM570GM100C5N
✅ Remplacement direct✓ En stock
$10.4 / unité
Voir la fiche technique →EPM570GM100I5N
✅ Remplacement direct✓ En stock
$8.55 / unité
Voir la fiche technique →EPM570GT100C4 Valeurs maximales et caractéristiques électriques
| Product Type | CPLD (Complex Programmable Logic Device) |
| Series | MAX II |
| Logic Elements (LE) | 570 |
| Macro Cells | 440 |
| Pin-to-Pin Delay (tPD) | 5.4 ns |
| Internal Operating Frequency | Up to 304 MHz |
| Internal Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V (MultiVolt) |
| User I/O Pins | 100 |
| User Flash Memory (UFM) | 8 Kbits |
| Programmable Type | In-System Programmable (ISP) via JTAG |
| Boîtier | 100-pin TQFP (14x14 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +85C (Commercial Extended) |
| Configuration Memory | Non-volatile flash (no external PROM required) |
Configuration des broches de EPM570GT100C4
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | VCCIO1 — I/O supply voltage bank 1 |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | GND — Ground |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | TDI — JTAG Test Data In |
| Broche 16 | TMS — JTAG Test Mode Select |
| Broche 17 | TCK — JTAG Test Clock |
| Broche 18 | GND — Ground |
| Broche 19 | VCCINT — Internal core supply (1.8 V) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | I/O — User I/O pin (bank 1) |
| Broche 22 | I/O — User I/O pin (bank 1) |
| Broche 23 | I/O — User I/O pin (bank 1) |
| Broche 24 | I/O — User I/O pin (bank 1) |
| Broche 25 | I/O — User I/O pin (bank 1) |
| Broche 26 | I/O — User I/O pin (bank 1) |
| Broche 27 | VCCIO1 — I/O supply voltage bank 1 |
| Broche 28 | GND — Ground |
| Broche 29 | I/O — User I/O pin (bank 1) |
| Broche 30 | I/O — User I/O pin (bank 1) |
| Broche 31 | I/O — User I/O pin (bank 1) |
| Broche 32 | I/O — User I/O pin (bank 1) |
| Broche 33 | I/O — User I/O pin (bank 1) |
| Broche 34 | I/O — User I/O pin (bank 1) |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | I/O — User I/O pin (bank 2) |
| Broche 37 | I/O — User I/O pin (bank 2) |
| Broche 38 | VCCIO2 — I/O supply voltage bank 2 |
| Broche 39 | I/O — User I/O pin (bank 2) |
| Broche 40 | GND — Ground |
| Broche 41 | I/O — User I/O pin (bank 2) |
| Broche 42 | I/O — User I/O pin (bank 2) |
| Broche 43 | I/O — User I/O pin (bank 2) |
| Broche 44 | I/O — User I/O pin (bank 2) |
| Broche 45 | I/O — User I/O pin (bank 2) |
| Broche 46 | I/O — User I/O pin (bank 2) |
| Broche 47 | I/O — User I/O pin (bank 2) |
| Broche 48 | I/O — User I/O pin (bank 2) |
| Broche 49 | VCCINT — Internal core supply (1.8 V) |
| Broche 50 | GND — Ground |
| Broche 51 | I/O — User I/O pin (bank 2) |
| Broche 52 | I/O — User I/O pin (bank 2) |
| Broche 53 | I/O — User I/O pin (bank 2) |
| Broche 54 | I/O — User I/O pin (bank 2) |
| Broche 55 | I/O — User I/O pin (bank 2) |
| Broche 56 | I/O — User I/O pin (bank 2) |
| Broche 57 | I/O — User I/O pin (bank 2) |
| Broche 58 | I/O — User I/O pin (bank 2) |
| Broche 59 | VCCIO2 — I/O supply voltage bank 2 |
| Broche 60 | I/O — User I/O pin (bank 2) |
| Broche 61 | I/O — User I/O pin (bank 2) |
| Broche 62 | I/O — User I/O pin (bank 2) |
| Broche 63 | GND — Ground |
| Broche 64 | I/O — User I/O pin (bank 2) |
| Broche 65 | I/O — User I/O pin (bank 3) |
| Broche 66 | I/O — User I/O pin (bank 3) |
| Broche 67 | I/O — User I/O pin (bank 3) |
| Broche 68 | VCCIO3 — I/O supply voltage bank 3 |
| Broche 69 | I/O — User I/O pin (bank 3) |
| Broche 70 | I/O — User I/O pin (bank 3) |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — User I/O pin (bank 3) |
| Broche 73 | I/O — User I/O pin (bank 3) |
| Broche 74 | I/O — User I/O pin (bank 3) |
| Broche 75 | I/O — User I/O pin (bank 3) |
| Broche 76 | I/O — User I/O pin (bank 3) |
| Broche 77 | I/O — User I/O pin (bank 3) |
| Broche 78 | I/O — User I/O pin (bank 3) |
| Broche 79 | VCCINT — Internal core supply (1.8 V) |
| Broche 80 | GND — Ground |
| Broche 81 | I/O — User I/O pin (bank 3) |
| Broche 82 | I/O — User I/O pin (bank 3) |
| Broche 83 | I/O — User I/O pin (bank 3) |
| Broche 84 | I/O — User I/O pin (bank 3) |
| Broche 85 | I/O — User I/O pin (bank 3) |
| Broche 86 | I/O — User I/O pin (bank 3) |
| Broche 87 | I/O — User I/O pin (bank 3) |
| Broche 88 | I/O — User I/O pin (bank 3) |
| Broche 89 | VCCIO3 — I/O supply voltage bank 3 |
| Broche 90 | I/O — User I/O pin (bank 3) |
| Broche 91 | I/O — User I/O pin (bank 4) |
| Broche 92 | I/O — User I/O pin (bank 4) |
| Broche 93 | GND — Ground |
| Broche 94 | I/O — User I/O pin (bank 4) |
| Broche 95 | I/O — User I/O pin (bank 4) |
| Broche 96 | I/O — User I/O pin (bank 4) |
| Broche 97 | I/O — User I/O pin (bank 4) |
| Broche 98 | I/O — User I/O pin (bank 4) |
| Broche 99 | VCCIO4 — I/O supply voltage bank 4 |
| Broche 100 | TDO — JTAG Test Data Out |
Applications typiques
EPM570GT100C4 convient pour 7 applications: Industrial Control Logic Consolidation, I/O Expansion and Bus Bridging, Power Sequencing and Supervisor Logic, Glue Logic Replacement, Telecommunications Line-Card Interface, Consumer Product Controllers, Automotive Body Electronics.
Industrial Control Logic Consolidation
The EPM570GT100C4 is a strong fit for replacing 5-10 discrete 74LS/HC logic chips with a single CPLD in industrial PLC and machine-controller designs. Its 570 LEs deliver sufficient capacity for state machines, encoder/counter chains, and timing generators, while the 5.4 ns tPD supports deterministic sub-200 MHz logic. Compared to a small FPGA, the MAX II's instant-on flash configuration eliminates boot-PROM complexity and guarantees predictable startup within microseconds of power-on. The 100-TQFP package supports 100 user I/Os for direct connection to optocouplers, drivers, and sensor front-ends.
Recommandé
I/O Expansion and Bus Bridging
The EPM570GT100C4's 100 user I/Os and MultiVolt interface (1.5/1.8/2.5/3.3 V) make it ideal for I/O expansion on microcontroller or SoC-based boards. Engineers use it to add extra UARTs, SPI ports, PWM channels, or GPIO without redesigning the host PCB. The 5.4 ns propagation delay is more than fast enough for parallel bus steering at 50-100 MHz, and the JTAG ISP enables post-assembly pin reassignment when prototypes iterate.
Recommandé
Power Sequencing and Supervisor Logic
Power-rail sequencing in multi-voltage systems (e.g., 1.0 V core + 1.8 V + 3.3 V + 5 V) requires deterministic timing that the EPM570GT100C4 provides natively. Designers implement turn-on/turn-off sequences, voltage-rail monitors, and reset distribution in 200-400 LEs, leaving headroom for fault logging. The non-volatile flash configuration means sequencing is active within microseconds of input power - critical for ASIC/FPGA rails that must come up in order.
Recommandé
Glue Logic Replacement
The MAX II family was specifically designed to replace legacy 74-series glue logic, and the EPM570GT100C4 with 570 LEs can absorb address decoding, chip-select generation, and interrupt prioritization across an entire board. Designers convert fixed BOM entries (74HC138, 74HC245, 74HC574, etc.) into a single programmable device, reducing component count and PCB area. The instant-on flash-based configuration means no boot delay versus an FPGA-based replacement.
Recommandé
Telecommunications Line-Card Interface
The EPM570GT100C4 is well-suited to telecom line-card applications where MultiVolt I/O and deterministic timing are critical. It bridges legacy 5 V logic to modern 1.8 V / 2.5 V framers, performs TDM bus steering, and implements HDLC framing for sub-100 Mbps links. The 100-TQFP footprint is compact enough for front-panel line-card layouts, and the commercial extended temperature range supports typical telecom equipment environments.
Recommandé
Consumer Product Controllers
In consumer electronics such as appliances, home automation hubs, and small appliances, the EPM570GT100C4 consolidates display driving, key-scanning, and motor-control timing into a single low-cost device. The 5.4 ns tPD handles PWM generation for brushless DC motors at 20-50 kHz with full dead-time control. The non-volatile configuration means end products work the instant power is applied - important for user-perceived startup time.
Recommandé
Automotive Body Electronics
Body-control modules (BCMs), instrument clusters, and lighting controllers use the EPM570GT100C4 for CAN/LIN bus steering, lighting PWM, and sensor aggregation. Its wide I/O voltage range interfaces directly with 5 V automotive sensors and 3.3 V MCUs without level shifters. For under-hood or harsh-environment automotive applications, designers should specify the EPM570GT100I5N industrial variant, which extends the operating temperature range to -40C to +100C while maintaining pin compatibility.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570GT100C4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570GT100C5N | EPM570GT100C3 | EPM570GT100C3N | EPM570GM100C5N | EPM570GM100I5N |
|---|---|---|---|---|---|---|
| Package | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements (LE) | 570 | 570 - same | 570 - same | 570 - same | 570 - same | 570 - same |
| Macro Cells | 440 | 440 - same | 440 - same | 440 - same | 440 - same | 440 - same |
| Pin-to-Pin Delay (tPD) | 5.4 ns | 4.5 ns (faster) | 7.0 ns (slower) | 7.0 ns (slower) | 4.5 ns (faster) | 4.5 ns (faster) |
| Internal Frequency | 304 MHz | 304 MHz - same | 304 MHz - same | 304 MHz - same | 304 MHz - same | 304 MHz - same |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Configuration Memory | Non-volatile flash | Non-volatile flash - same | Non-volatile flash - same | Non-volatile flash - same | Non-volatile flash - same | Non-volatile flash - same |
Principaux différenciateurs
- Non-volatile flash configuration enables instant-on operation without external boot PROM (vs Small SRAM-based FPGAs in similar density range)
- MultiVolt I/O interface supports 1.5/1.8/2.5/3.3 V signaling without level shifters (vs Discrete 74-series glue logic with fixed voltage rails)
- 570 LEs / 440 macro cells in a single 100-TQFP package (vs EPM570F100C4 (MAX II non-G variant))
Notes de conception
The EPM570GT100C4 requires two supply rails: VCCINT (1.71 V to 1.89 V core) and VCCIO (2.5 V or 3.3 V I/O). Decouple each VCCINT pin with a 0.1 uF X7R ceramic capacitor placed within 5 mm of the package pin, and add a 10 uF bulk tantalum or ceramic capacitor on each supply rail. Per the MAX II Device Handbook, insufficient decoupling can cause JTAG programming failures and logic corruption during configuration, so do not omit the bulk capacitors even in low-cost designs.
The 100-TQFP package has 0.5 mm lead pitch; route signals on inner layers to escape the dense perimeter ball-out. Use 4-layer PCB stack-up with continuous ground plane under the device to control impedance for the JTAG chain. Per Intel layout guidelines, keep JTAG signals (TCK, TMS, TDI, TDO) routed away from switching power-supply traces and add 10 kohm pull-ups on TDI and TMS as recommended in the MAX II handbook.
The JTAG interface operates at TCK frequencies up to 33 MHz. For JTAG chain integrity, place a 10 kohm pull-up on TCK to keep the chain in a known state at power-up. If designing a multi-device JTAG chain, ensure that the TDO-to-TDI propagation delay is within the MAX II specification; long chains may require TCK derating. The boundary-scan logic is IEEE 1149.1 compliant per the MAX II handbook, supporting both ISP and post-assembly board test.
Estimated: Configuration loss is rare on MAX II devices because configuration is stored in on-chip flash, not SRAM. However, if VCCINT drops below 1.5 V during power-down, the device may enter an indeterminate state. Add voltage supervisors (e.g., MAX811) on the 1.8 V rail to ensure clean power-down. Also, do not leave JTAG pins floating - floating TCK can cause spurious ISP activity in electrically noisy environments. Tie unused user I/Os to defined logic states in your Quartus design to minimize quiescent current.
Informations de conformité
RoHS and REACH status not explicitly stated in the verified web data; the C4N suffix convention in the MAX II family typically indicates lead-free compliance but should be confirmed against the specific lot or shipment documentation. Industrial-temperature variant EPM570GT100I5N is recommended for automotive-grade applications requiring extended thermal range.