Infineon

IGB30N60H3ATMA1 - 600V 30A TRENCHSTOP IGBT3 | Infineon

料号: IGB30N60H3ATMA1 ✓ 量产中
有现货 1-3 个工作日内发货
600 V Vdss 60 A Id PG-TO263-3-2 (D2PAK) Package
低至 $1.62 USD / 件
最小起订量: 1 |
价格更新于: 2026-09-14
批量定价
数量 单价 小计
1 $2.85 $2.85
10 $2.55 $25.50
100 $2.18 $218.00
500 $1.85 $925.00
1,000 $1.62 $1,620.00
ℹ️ 所有价格均以 USD 计价

IGB30N60H3ATMA1 概述

The Infineon IGB30N60H3ATMA1 is a high-speed 600 V, 30 A single TRENCHSTOP IGBT3 housed in a PG-TO263-3-2 (D2PAK) surface-mount package, rated for 187 W of power dissipation. It is built on Infineon's field-stop trench technology, which delivers MOSFET-like turn-off switching behavior and a tight balance between conduction and switching losses. The part is qualified to industrial-grade reliability standards and is supplied on tape-and-reel for high-volume SMT assembly.

An IGBT (Insulated Gate Bipolar Transistor) is a three-terminal power semiconductor that combines the voltage-driven, low-conduction-loss gate of a MOSFET with the high-current, low-saturation-voltage capability of a bipolar transistor. In the broader power-semiconductor hierarchy, an IGBT sits between MOSFETs (used at lower voltages and higher switching frequencies) and thyristors (used at very high currents); it is the workhorse device for medium- to high-voltage switching converters, motor drives, and inductive heating inverters.

Key features of the IGB30N60H3ATMA1 include a collector-emitter breakdown voltage of 600 V, a continuous DC collector current rating of 60 A (pulsed), low saturation voltage VCE(sat) of approximately 1.95 V, and a nominal turn-off time of 262 ns. The trench field-stop structure produces a square reverse-biased safe operating area (RBSOA) and short-circuit ruggedness, while the low gate charge and intrinsic anti-parallel diode simplify half-bridge design.

Typical applications for the IGB30N60H3ATMA1 include uninterruptible power supplies (UPS), solar inverters, welding converters, induction heating, switch-mode power supplies (SMPS) with hard-switched topologies, and industrial motor drives. The D2PAK footprint is widely accepted by designers building high-density PFC and inverter stages that require both thermal performance and SMT assembly.

When designing with this device, ensure the gate-drive voltage swings between -15 V and +15 V (or at minimum 0 V to +15 V with a negative turn-off bias for hard-switching topologies). The exposed metal tab of the D2PAK must be soldered to a sufficient copper area to keep junction temperature within ratings; at full 60 A conduction the device dissipates well over 100 W and demands careful thermal management.

This page synthesizes distributor stock and pricing, same-family TRENCHSTOP drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving the engineer a single decision-ready reference.

直接替换替代料: IGB30N60H3ATMA1 ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: IGB30N60H3ATMA1 (相同外形与封装尺寸) ——差异在于 Package, Mounting Type, Gate-Emitter Voltage (VGE), Maximum Power Dissipation (Ptot), Technology.

Infineon
Package: TO-247 (PG-TO247-3-1) through-hole, 3 pins + tab
Mounting Type: Through Hole
Gate-Emitter Voltage (VGE): ±20 V (max)
对比 IGB30N60H3ATMA1 →
Infineon
Package: PG-TO252-3 (DPAK), 3 pins (2 + tab)
Maximum Power Dissipation (Ptot): 250 W
Technology: TRENCHSTOP IGBT3 (field-stop trench with anti-parallel diode)
对比 IGB30N60H3ATMA1 →

快速对比工具——选择替代料号进行并排对比:

IGB15N60H3ATMA1

✅ 直接替换
📦 PG-TO263-3-2 (D2PAK)
IC 30 A vs 60 A (-50%), same die family and pinout, suitable for lower-current designs

📋 参考替代料(不在目录中)

IGW30N60H3FKSA1

✅ 直接替换 ⚠️ 规格未核验
Infineon
📦 TO-247
Infineon Technologies · TRENCHSTOP IGBT3 · Trench Field Stop · 600 V · 60 A · 187 W

✓ 有现货

$2.49 / 个

查看数据手册 →

STGB30H60DFB

✅ 直接替换
📦 TO-263 (D2PAK)
600 V / 30 A equivalent, ST HB2 trench technology, slightly different switching characteristics

📋 参考替代料(不在目录中)

IKD15N60RFATMA1

✅ 直接替换
Infineon
📦 PG-TO252-3 (DPAK)
TRENCHSTOP IGBT3 (field-stop trench with anti-parallel diode) · 600 V · 30 A · 15 A · +/-20 V · 1.5 V (typical)

✓ 有现货

$1.35 / 个

查看数据手册 →

IGB30N60H3ATMA1 最大额定值与电气特性

Manufacturer Infineon Technologies
Product Family TRENCHSTOP IGBT3
Collector-Emitter Voltage (VCE) 600 V
Continuous DC Collector Current (IC, TC=25C) 60 A
功耗(Ptot) 187 W
Gate-Emitter Voltage (VGE) +/- 20 V
集电极-发射极饱和电压(Vce(sat)) 1.95 V (typ, at IC=30 A, VGE=15 V)
Turn-Off Time (toff) 262 ns (nominal)
Technology Trench Field Stop
Configuration Single IGBT
封装 PG-TO263-3-2 (D2PAK)
安装类型 Surface Mount
工作结温 -40C to +175C
Storage Temperature -55C to +150C
Terminal Form Gull Wing
引脚数量 3 (2 + Tab)
RoHS 状态 Compliant
Switching Behavior MOSFET-like turn-off

IGB30N60H3ATMA1 引脚配置

D2PAK (TO-263) Package Pinout Diagram D2PAK TO-263 3-pin SMD power, JEDEC TO-263. Large thermal tab. 1 2 3 D2PAK (TO-263)
引脚 1 Gate (G) — MOSFET-style gate input; drive with +15 V on, -5 to -15 V off
引脚 2 Collector (C) — Main current terminal; internally connected to the metal tab
引脚 3 Emitter (E) — Source reference for gate drive and main current return
引脚 Tab Collector / Heatsink — Electrically tied to Pin 2 (Collector); solder to PCB copper for thermal dissipation

Reverse Biased 安全工作区 (RBSOA)

直流连续工作

典型应用

IGB30N60H3ATMA1 适用于 6 应用s: Uninterruptible Power Supply (UPS) Inverter, Solar Inverter Boost and H-Bridge Stages, Induction Heating Resonant Inverter, Industrial Motor Drive Inverter, Welding Converter Power Stage, Switch-Mode Power Supply (SMPS) PFC Stage.

⚡

Uninterruptible Power Supply (UPS) Inverter

The IGB30N60H3ATMA1 is well-suited for 1-5 kVA online UPS inverter stages operating from a 400 V rectified DC bus. Its 600 V collector-emitter breakdown provides substantial margin above the typical 325 V bus peak, while the 60 A continuous current rating supports inverter designs up to 5 kW. The trench field-stop structure delivers MOSFET-like turn-off behavior, which reduces dead-time cross-conduction losses in the 20-50 kHz switching range typical of modern UPS designs.

✈️

Solar Inverter Boost and H-Bridge Stages

Residential and small-commercial solar inverters use the IGB30N60H3ATMA1 in PFC boost and full-bridge inverter sections. Its 600 V breakdown handles the 400 V DC bus with adequate transient headroom, and the 60 A continuous current supports 5-10 kW designs. The 1.95 V VCE(sat) minimizes conduction losses during peak power point tracking, while the fast 262 ns turn-off time enables 16-32 kHz switching for compact magnetics in transformerless string inverter topologies.

🏭

Induction Heating Resonant Inverter

The IGB30N60H3ATMA1 is a strong choice for induction cooking and industrial induction heating inverters operating in the 20-100 kHz resonant switching range. Its trench field-stop structure provides low turn-off losses critical for zero-voltage switching (ZVS) resonant topologies. The 187 W power dissipation rating and D2PAK footprint with substantial copper heatsinking enable continuous 30-40 A operation in the resonant tank circuit, supporting cooking appliances and metal hardening equipment up to 5 kW.

🏭

Industrial Motor Drive Inverter

Three-phase industrial motor drives for fans, pumps, and small servo systems use the IGB30N60H3ATMA1 in 400 V class inverter stages. The 600 V rating handles the rectified 230/400 V AC bus with margin, and the 60 A continuous current supports 7.5-15 kW motor drives. The MOSFET-like turn-off behavior simplifies dead-time management, while the rugged RBSOA provides short-circuit protection during motor startup transients and load dump events.

🔧

Welding Converter Power Stage

Inverter-based welding machines use the IGB30N60H3ATMA1 in the primary H-bridge or full-bridge converter stage that feeds the high-frequency welding transformer. Its 60 A continuous current and 187 W dissipation support 200-400 A welding output designs. The fast switching and low VCE(sat) balance conduction and switching losses in the 20-100 kHz hard-switched primary, while the rugged short-circuit withstand capability handles the arc-strike transients inherent to MMA/TIG welding processes.

⚡

Switch-Mode Power Supply (SMPS) PFC Stage

Power factor correction (PFC) boost stages in 1-3 kW SMPS designs use the IGB30N60H3ATMA1 as the boost switch when the output voltage is 400 V class and current requirements exceed 15 A. Its low VCE(sat) reduces conduction losses in continuous conduction mode (CCM), while the trench field-stop technology provides fast turn-off for the hard-switched boost topology. The D2PAK footprint enables compact SMT construction with adequate copper area for thermal management.

What is the collector-emitter breakdown voltage of IGB30N60H3ATMA1?
The IGB30N60H3ATMA1 has a collector-emitter breakdown voltage (VCE) of 600 V, making it suitable for 400 V rectified bus applications in PFC and inverter stages. According to the Infineon datasheet, the part is designed as a TRENCHSTOP IGBT3 trench field-stop device, providing MOSFET-like turn-off switching behavior and a robust square RBSOA. This 600 V rating gives adequate margin for 230 V AC rectified bus designs (peak ~325 V) plus transient headroom.
What is the maximum continuous collector current of IGB30N60H3ATMA1?
The IGB30N60H3ATMA1 is rated for a continuous DC collector current of 60 A at TC=25C, with derating required at higher case temperatures. The 187 W power dissipation rating in the PG-TO263-3-2 (D2PAK) package requires a substantial copper pour on the PCB. Designers typically derate to 30-40 A continuous in real applications to maintain safe junction temperature under forced-air or convection cooling.
Where to buy IGB30N60H3ATMA1 online?
The IGB30N60H3ATMA1 can be purchased in stock from major authorized distributors including DigiKey (Digi-Key part 2783288-ND), Mouser, Newark (order code 49AC0265RL), and Octopart-listed distributors. As of 2026-09-15, multiple distributors show active stock; pricing starts around $1.62-$2.85 per unit depending on quantity breaks. XAIPART also offers this part with volume pricing tiers for OEM customers.
What is the price of IGB30N60H3ATMA1?
As of 2026-09-15, the IGB30N60H3ATMA1 unit price is approximately $2.85 at qty 1, scaling down to $1.62 at qty 1000 across major distributors. Volume pricing on tape-and-reel (3000-piece reels) is typically negotiated directly with Infineon franchised distributors. Pricing varies by region and distributor, so engineers should check DigiKey, Mouser, and Newark for current stock and breaks.
What is the lead time for IGB30N60H3ATMA1?
As of 2026-09-15, the IGB30N60H3ATMA1 shows in-stock availability at DigiKey (ships today) and other major distributors, indicating a typical lead time of 0-4 weeks for standard orders. For high-volume OEM contracts of 10k+ pieces, lead times may extend to 6-10 weeks depending on wafer allocation. The part is currently active in Infineon's product lifecycle, so no obsolescence risk is expected in the near term.
Is IGB30N60H3ATMA1 in stock at major distributors?
Yes, as of 2026-09-15 the IGB30N60H3ATMA1 is in stock at DigiKey (Digi-Key part 2783288-ND, ships today), Mouser, and Newark. Octopart aggregates 6 distributors with active stock listings. The 3000-piece tape-and-reel packaging (TMA1 suffix) is the standard shipping format for SMT assembly lines. For emergency prototype needs, smaller cut-tape quantities are also available.
What is the best drop-in replacement for IGB30N60H3ATMA1?
The closest drop-in replacement is the Infineon IGW30N60H3 (TO-247 package, same 600 V / 30 A TRENCHSTOP IGBT3 silicon), though the through-hole TO-247 differs from the surface-mount D2PAK. For true D2PAK drop-in compatibility within Infineon's portfolio, the IGB15N60H3ATMA1 (lower current) shares the same PG-TO263-3-2 footprint. For cross-brand equivalents, the STGB30H60DFB (STMicroelectronics, TO-263 D2PAK) is a drop-in option with similar 600 V / 30 A ratings.
IGB30N60H3ATMA1 vs IGW30N60H3 - which is better for hard-switching applications?
The IGB30N60H3ATMA1 (D2PAK surface-mount) and IGW30N60H3 (TO-247 through-hole) use the same TRENCHSTOP IGBT3 silicon die, so their electrical performance is essentially identical. The IGB30N60H3ATMA1 is preferred for high-density SMT converter designs where automated assembly and low-profile construction matter. The IGW30N60H3 is preferred for through-hole designs requiring bolt-down heatsinks for very high thermal loads (200+ W dissipation).
Can STGB30H60DFB replace IGB30N60H3ATMA1?
Yes, the STMicroelectronics STGB30H60DFB is a pin-compatible drop-in replacement for the IGB30N60H3ATMA1 in the same TO-263 (D2PAK) footprint. Both parts share 600 V breakdown voltage and 30 A current ratings, though the STGB30H60DFB uses ST's proprietary HB2 trench technology with slightly different switching characteristics. Verify gate-charge and turn-off timing in your specific application, especially for high-frequency PFC designs above 50 kHz.
When should I choose IGB30N60H3ATMA1 over IGB15N60H3ATMA1?
Choose the IGB30N60H3ATMA1 when your converter requires continuous currents above 15 A or peak pulsed currents above 30 A, such as in 3-5 kW PFC stages, induction heating inverters, or welding converters. Choose the lower-current IGB15N60H3ATMA1 when designing sub-1.5 kW converters where thermal headroom and lower conduction losses are priorities. Both parts share the same PG-TO263-3-2 footprint, enabling easy design migration.
Is IGB30N60H3ATMA1 suitable for solar inverter applications?
Yes, the IGB30N60H3ATMA1 is well-suited for residential and small-commercial solar inverter boost and H-bridge stages. Its 600 V breakdown handles the typical 400 V DC bus with margin, and the 60 A continuous current supports 5-10 kW inverter designs. The MOSFET-like turn-off behavior reduces switching losses in the 16-32 kHz switching frequency range commonly used in modern transformerless string inverters. The D2PAK footprint enables compact, automated SMT assembly.
What are the key specifications of IGB30N60H3ATMA1 that engineers should know?
The key specifications of the IGB30N60H3ATMA1 are: 600 V collector-emitter breakdown voltage, 60 A continuous DC collector current (TC=25C), 187 W power dissipation, 1.95 V VCE(sat) at 30 A, 262 ns nominal turn-off time, and PG-TO263-3-2 (D2PAK) surface-mount package. It uses Infineon's TRENCHSTOP IGBT3 trench field-stop technology with MOSFET-like turn-off behavior, qualified for industrial-grade operating temperatures from -40C to +175C junction.
Where to download IGB30N60H3ATMA1 datasheet PDF?
The official IGB30N60H3ATMA1 datasheet PDF is available directly from Infineon's product page at infineon.com/part/IGB30N60H3. The datasheet URL is also accessible via the asset download link on the manufacturer's site. Third-party sources like FindIC and Datasheets.com mirror the same document, but engineers should always reference the Infineon original for the most current revision and qualification status.
Where to find IGB30N60H3ATMA1 pinout for D2PAK?
The IGB30N60H3ATMA1 in PG-TO263-3-2 (D2PAK) follows the standard 3-pin IGBT pinout: Pin 1 = Gate, Pin 2 = Collector (internally connected to the metal tab/heatsink), Pin 3 = Emitter. The exposed metal tab is the collector thermal pad and must be soldered to PCB copper for both electrical connection and thermal dissipation. The Infineon datasheet provides the mechanical drawing and recommended land pattern in the package section.
What is the best Infineon equivalent for IGB30N60H3ATMA1 in TO-247?
The best Infineon same-family drop-in equivalent in TO-247 through-hole packaging is the IGW30N60H3. Both parts use the same TRENCHSTOP IGBT3 silicon die with identical 600 V / 30 A ratings. The only differences are mechanical: IGW30N60H3 is TO-247 (through-hole, bolt-down heatsink), while IGB30N60H3ATMA1 is PG-TO263-3-2 (D2PAK, surface-mount). Choose IGW30N60H3 for very high dissipation designs requiring screw-down heatsinks.
Is IGB30N60H3ATMA1 the same as IGB30N60H3?
No, IGB30N60H3ATMA1 and IGB30N60H3 are the same silicon die, but the ATMA1 suffix indicates the specific tape-and-reel packaging variant for SMT assembly (3000 pieces per reel). The base IGB30N60H3 may be supplied in tube or bulk. Both share identical electrical specifications from the same Infineon datasheet family. Designers specifying for high-volume SMT should use the ATMA1 suffix to ensure the correct shipping format.

工程参考数据: IGB30N60H3ATMA1 ——对比、设计指导和合规信息。

选型指南

Choose the IGB30N60H3ATMA1 when designing a 600 V class surface-mount power stage requiring 30-60 A continuous collector current in a compact, SMT-assembled product. It is the preferred part for 1-10 kW UPS, solar inverter, induction heating, welding, and industrial motor drive applications where automated assembly and good thermal performance are needed. Choose the IGB15N60H3ATMA1 when your design operates below 15 A continuous and you want the same Infineon silicon in a smaller thermal budget. Choose the IGW30N60H3 when you need a through-hole TO-247 package with bolt-down heatsink for higher continuous dissipation above 200 W. Choose the STGB30H60DFB when you need a second-source cross-brand drop-in equivalent in the same D2PAK footprint, or when STMicroelectronics is your preferred vendor.

与替代料对比

参数 本产品 IGB15N60H3ATMA1 IGW30N60H3 STGB30H60DFB IKD15N60RFATMA1
Brand Infineon Infineon Infineon STMicroelectronics Infineon
Package PG-TO263-3-2 (D2PAK) PG-TO263-3-2 (D2PAK) - same TO-247 (through-hole) TO-263 (D2PAK) - same PG-TO252-3 (DPAK)
Collector-Emitter Voltage (VCE) 600 V 600 V 600 V 600 V 600 V
Continuous Collector Current (IC, TC=25C) 60 A 31 A 60 A 60 A 30 A
Technology TRENCHSTOP IGBT3 (Trench Field Stop) TRENCHSTOP IGBT3 TRENCHSTOP IGBT3 HB2 Trench Field Stop TRENCHSTOP IGBT3
Mounting Type Surface Mount Surface Mount Through-Hole Surface Mount Surface Mount

关键差异点

  • Industry-leading TRENCHSTOP IGBT3 trench field-stop technology (对比 STGB30H60DFB)
  • Higher continuous current rating in same D2PAK footprint (对比 IGB15N60H3ATMA1)
  • Surface-mount D2PAK package optimized for automated assembly (对比 IGW30N60H3)

设计说明

Estimated: At full 60 A conduction with VCE(sat)=1.95 V, conduction loss alone is approximately 117 W. With switching losses in a 20 kHz hard-switched PFC stage adding 10-20 W, total dissipation reaches 130-140 W. The PG-TO263-3-2 (D2PAK) package has a junction-to-ambient thermal resistance around 40 C/W on a 1 sq inch copper pour; a heatsink with thermal resistance below 0.5 C/W plus forced-air cooling is required for full-current operation. Always calculate junction temperature rise as Tj = Pd * (RthJC + RthCS + RthSA) + Tambient, and ensure Tj remains below 150C for reliable long-term operation.

The D2PAK exposed metal tab (Pin 2, Collector) must be soldered directly to a sufficient PCB copper pour to achieve the thermal dissipation ratings. Recommended minimum copper area is 1 sq inch on the top layer plus thermal vias to inner planes. Keep the gate-drive traces short (under 1 inch) and route them away from the high-current collector traces to minimize dv/dt induced gate-voltage spikes. Place the gate-driver IC as close as possible to the gate pin to minimize parasitic inductance in the gate loop.

Do not operate the IGB30N60H3ATMA1 with VGE below the gate-emitter threshold; if the gate is left floating during power-up, the IGBT may partially turn on and cause shoot-through in half-bridge configurations. Always use a proper gate-driver IC with defined logic inputs, and provide a pull-down resistor (10 kohm typical) on the gate pin to ensure a defined off-state during transient conditions. Exceeding VGE=+/-20 V absolute maximum can destroy the gate oxide; clamp the gate voltage with a 15 V Zener diode for protection.

The high dv/dt (typically 5-10 kV/us) of the IGB30N60H3ATMA1 during turn-off can induce voltage spikes on the gate due to parasitic miller capacitance (Cres). Use a negative gate-drive bias (-5 to -15 V) for hard-switched topologies to prevent parasitic turn-on, and add a small gate-source resistor (10-100 ohm) to dampen ringing. Snubber circuits (RCD or RCD-plus-diode) across the collector-emitter are often required in half-bridge configurations to limit voltage overshoot below the 600 V breakdown rating.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
无铅
Yes
无卤
Unknown
冲突矿物
Compliant

RoHS compliant per Infineon product page. Not AEC-Q100 qualified - this part is designed for industrial-grade applications, not automotive. Industrial operating junction temperature range is -40C to +175C.

数据核验日期: 2026-09-15 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

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Infineon IGB30N60H3ATMA1 IGB15N60H3ATMA1 IGW30N60H3 STGB30H60DFB IKD15N60RFATMA1 STMicroelectronics IGBT Insulated Gate Bipolar Transistor TRENCHSTOP TRENCHSTOP IGBT3 Trench Field Stop PG-TO263-3-2 D2PAK TO-247 DPAK collector-emitter voltage VCE(sat) turn-off time MOSFET-like turn-off RBSOA RoHS AEC-Q100 gate driver PFC stage solar inverter induction heating UPS inverter welding converter motor drive switch-mode power supply
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