EP1S25B672C6 - Stratix 25,660 LEs FPGA 672-BGA | Intel
料号： EP1S25B672C6 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1241.26 | $1,241.26 |
| 10 | $1180 | $11,800.00 |
| 100 | $1110 | $111,000.00 |
| 500 | $1050 | $525,000.00 |
| 1,000 | $990 | $990,000.00 |
EP1S25B672C6 概述
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable I/O cells, all interconnected by a flexible routing fabric. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and are used wherever parallel processing, high I/O bandwidth, or hardware-level customization is required without the cost of an ASIC. The Stratix family specifically targets high-performance applications requiring integrated transceivers, large memory, and dedicated multipliers.
Key features of the EP1S25B672C6 include 2,566 logic array blocks (LABs), 6 embedded DSP blocks for high-speed multiplication, dedicated TriMatrix memory supporting true dual-port and FIFO modes, and 12 phase-locked loops providing flexible clock management. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, enabling direct interface to external DDR SDRAM memories and high-speed parallel buses.
Architecturally, the Stratix family pioneered several then-innovative features including the TriMatrix memory architecture (three memory sizes per block for optimized density vs. width trade-offs), embedded DSP blocks with hardware multipliers and adder trees, and a hierarchical clock network with regional and global resources. The 130 nm CMOS process and 1.5V core voltage delivered a balance of performance and power efficiency that was industry-leading at launch.
Typical applications for the EP1S25B672C6 include telecommunications line cards and protocol converters, high-speed image processing pipelines, radar and sonar signal processing, industrial motion control, and ASIC prototyping. Its 473 user I/Os and 672-ball BGA package provide ample connectivity for parallel data acquisition systems.
When designing with this part, note that the EP1S25B672C6 is now in Obsolete/EOL status - long-term designs should plan for last-time-buy supply arrangements, or migrate to a Stratix II/III/IV successor with the Altera/Intel Quartus design toolchain compatibility. Confirm JTAG chain configuration and configuration device selection (EPCS/EPC) when integrating into existing boards.
This page synthesizes distributor pricing, lifecycle status, drop-in same-family alternatives, and practical migration notes not found in the original manufacturer datasheet - including a roadmap to the Stratix II EP1S25 successor family for engineers maintaining legacy Stratix designs.
直接替换替代料： EP1S25B672C6 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1S25B672C6 （相同外形与封装尺寸） ——差异在于 Operating Temperature, Process Technology, Configuration Method, DSP Blocks, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
EP1S25B672C7N
✅ 直接替换✓ 有现货
$620.15 / 个
查看数据手册 →EP1S25F672C6
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$125 / 个
查看数据手册 →EP1S25B672C6N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$198 / 个
查看数据手册 →EP1S25B672I6
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP1S25B672C5N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP1S25B672C6 最大额定值与电气特性
| Series | Stratix |
| Logic Elements | 25,660 |
| Number of LABs/CLBs | 2,566 |
| Total RAM Bits | 1,944,576 |
| Number of I/O | 473 |
| Number of Gates | 25,660 cells |
| Voltage - Supply | 1.5 V |
| Process Technology | 130 nm CMOS |
| 安装类型 | Surface Mount |
| 封装 / 外壳 | 672-BBGA |
| 工作温度 | 0C to +85C (commercial) |
| 最大时钟频率 | 450.05 MHz |
| Number of PLLs | Up to 12 |
| DSP Blocks | 6 dedicated blocks |
| Configuration Method | Serial/Parallel via EPCS/EPC |
EP1S25B672C6 672-bbga 引脚配置指南
EP1S25B672C6（672-bbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1S25B672C6.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1S25B672C6 适用于 6 应用s: Telecommunications Line Card Processing, High-Speed DSP Pipeline (Radar/Sonar/Image Processing), ASIC Prototyping and Emulation, Industrial Motion Control and Motor Drives, High-Performance Data Acquisition Systems, Legacy Medical Imaging Equipment.
Telecommunications Line Card Processing
The EP1S25B672C6's 25,660 logic elements, 1,944,576 bits of TriMatrix RAM, and 473 user I/Os make it a strong fit for telecom line cards requiring parallel protocol processing, packet inspection, and backplane bridging. Its six dedicated DSP blocks deliver hardware-accelerated filtering for voice and baseband codecs, while the 12 PLLs provide multiple clock domains for interfacing to TDM buses, SERDES framer ICs, and Ethernet MACs. At 1.5V core supply and 130nm process, the EP1S25 is well-suited to legacy SONET/SDH and ATM designs still in service.
推荐
High-Speed DSP Pipeline (Radar/Sonar/Image Processing)
The EP1S25B672C6 integrates six dedicated DSP blocks each containing hardware multipliers and adder trees, ideal for FIR filters, FFT butterflies, and matrix multiply operations in radar, sonar, and machine-vision pipelines. Its 450 MHz internal clock headroom enables real-time baseband processing at sample rates above 100 MSPS, while 1,944,576 bits of TriMatrix memory buffer data between ADC front-ends and downstream processing. The 672-BGA package supports thermal dissipation up to roughly 8W with appropriate PCB copper area.
推荐
ASIC Prototyping and Emulation
The EP1S25B672C6 was widely used in the mid-2000s as an ASIC prototyping vehicle, where its 25,660 LEs could be partitioned across multiple FPGAs to emulate a million-gate ASIC. The 473 user I/Os provide ample connectivity for multi-FPGA prototyping boards and logic analyzer-style probing. TriMatrix memory in dual-port and FIFO modes simplifies emulation of on-chip RAMs, while the 12 PLLs generate clocks matching the target ASIC's clock tree. Engineers maintaining legacy emulation platforms continue to specify the EP1S25 for board-level compatibility.
推荐
Industrial Motion Control and Motor Drives
The EP1S25B672C6 fits industrial motion control applications needing deterministic parallel servo loop execution, encoder feedback processing, and high-speed PWM generation. Its 12 PLLs allow precise synchronization to resolver/excitation frequencies and fieldbus clocks (PROFIBUS, CANopen), while 473 I/Os support multiple axis drives in a single FPGA. The 1.5V core and 130nm process deliver robust noise immunity in motor-drive EMI environments, though the commercial 0-85C temperature range limits deployment; the EP1S25B672I6 industrial variant extends to -40C to +100C.
推荐
High-Performance Data Acquisition Systems
With 473 user I/Os and 1.9 Mbits of dual-port embedded RAM, the EP1S25B672C6 serves as the central FPGA in multi-channel data acquisition systems digitizing analog signals from ADCs running at 100+ MSPS. TriMatrix memory configured as true dual-port blocks enables simultaneous ADC write and DSP read, eliminating external FIFOs. The 12 PLLs derive multiple synchronized clocks for ADC sampling, DAC reconstruction, and downstream DSP processing, while LVDS support on select I/O banks enables direct connection to LVDS-serial ADC outputs.
推荐
Legacy Medical Imaging Equipment
The EP1S25B672C6 continues to serve in installed-base medical imaging equipment such as ultrasound beamformers, MRI gradient controllers, and X-ray detector readout boards where design re-validation costs far exceed component savings. Its 25,660 LEs and DSP blocks handle real-time beamforming computations, while 1,944,576 RAM bits buffer raw RF and image data. With the EP1S25 now in Obsolete lifecycle status as of 2026-09-07, medical OEMs are advised to qualify the EP1S25B672C7N or the EP1S25B672C6N lead-free variant for new production runs to extend equipment service life.
推荐
推荐产品汇总
工程参考数据： EP1S25B672C6 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1S25B672C7N | EP1S25F672C6 | EP1S25B672C6N | EP1S25B672I6 | EP1S25B672C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-BBGA | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same |
| Logic Elements | 25,660 | 25,660 - same | 25,660 - same | 25,660 - same | 25,660 - same | 25,660 - same |
| Speed Grade | C6 | C7 (faster) | F6 (faster) | C6 (same) | I6 (industrial temp) | C5 (slower) |
| Total RAM Bits | 1,944,576 | 1,944,576 - same | 1,944,576 - same | 1,944,576 - same | 1,944,576 - same | 1,944,576 - same |
| Number of I/O | 473 | 473 - same | 473 - same | 473 - same | 473 - same | 473 - same |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
关键差异点
- Mid-density Stratix I with 25,660 LEs and 1.9 Mbit TriMatrix RAM （对比 EP1S25B672C7N)
- Commercial temperature grade with Pb-free finish variants （对比 EP1S25B672I6)
- 672-BGA package consistency across entire EP1S25 family （对比 EP1S25F672C6)
设计说明
Estimated: The EP1S25B672C6 in a 672-BGA package dissipates up to approximately 8W at full utilization (all 25,660 LEs switching at 450 MHz with all six DSP blocks active). Theta_JA for the 672-BGA is approximately 8 C/W with a JEDEC JESD51 4-layer test board. Junction temperature rise at 8W is therefore roughly 64C above ambient - confirm adequate PCB copper area (at least 25 cm^2 of unbroken ground plane under the BGA) and forced-air cooling for sustained operation in industrial environments.
The 672-BGA requires a multi-layer PCB with microvia or via-in-pad construction to fan out the 1.0 mm pitch BGA balls. Per Altera layout guidelines, use 4-6 PCB layers with dedicated ground and power planes; place 0.1 uF decoupling capacitors on every VCCIO/VCCINT pin within 100 mils of the pad. For JTAG and configuration signals (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE), use 4.7k-ohm pull-ups to VCCIO as specified in the Stratix handbook configuration chapter.
The EP1S25B672C6 is Obsolete as of 2026-09-07 per Octopart; verify last-time-buy availability from authorized distributors and stockpile for production lifetime needs. Do NOT substitute a Stratix II EP2S25 without board respin - Stratix II moves from 1.5V to 1.2V core, adds new I/O features, and changes pin functions. For new designs, consider Cyclone IV/Arria II as low-cost/low-power successors with the same Quartus II toolchain. Verify configuration device selection (EPCS1/EPCS4 for serial, EPC16 for parallel).
The EP1S25B672C6 supports LVDS on specific I/O banks (typically banks 3, 4, 7, 8 - refer to device handbook pin tables). When routing LVDS pairs, maintain 100 ohm differential impedance and match trace lengths to within 20 mils to avoid skew-induced jitter. SSTL/HSTL interfaces to external DDR SDRAM require VREF reference voltage planes; place VREF decoupling capacitors (0.1 uF + 10 uF) near each VREF pin. For clock inputs to global clock buffers, use the dedicated CLK pins (e.g., CLK0-CLK15) for best skew performance.
合规信息
Specific RoHS/REACH compliance data for the EP1S25B672C6 was not present in the verified web data as of 2026-09-07; consult the manufacturer product declaration or Intel PCN archive for definitive status. The Pb-free N-suffix variants (e.g., EP1S25B672C6N, EP1S25B672C7N) are confirmed Pb-free per Stratix family nomenclature.
