MC9S12DB128CPV - HCS12 16-Bit MCU 128KB Flash 112-LQFP | NXP
料号： MC9S12DB128CPV ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $12.1 | $6,050.00 |
| 1,000 | $10.95 | $10,950.00 |
MC9S12DB128CPV 概述
What is a 16-bit automotive microcontroller? An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and peripherals such as timers, ADCs, and communication controllers on a single die. Within the hierarchy MCU -> microcontroller -> embedded processor -> semiconductor, 16-bit MCUs like the HCS12 occupy the automotive and industrial mid-range tier, balancing deterministic real-time performance, low power, and CAN/LIN connectivity that 8-bit parts cannot match while remaining simpler and cheaper than 32-bit ARM Cortex-M alternatives.
Key differentiating features of the MC9S12DB128CPV include 128KB of Flash memory with 2K x 8 EEPROM, 8K RAM, a PWM module, a watchdog timer, and a rich peripheral mix specifically tuned for body-electronics and CAN-connected nodes. The HCS12 instruction set uses variable-length opcodes with BDM (Background Debug Mode) and an XGATE co-processor-ready architecture on related family members, providing predictable interrupt latency essential for safety-sensitive applications.
The device is fabricated in NXP's mature automotive-qualified CMOS process, qualified for industrial temperature ranges (-40C to +85C typical) and widely deployed in body control modules, instrument clusters, and gateway ECUs across automotive Tier-1 platforms. It remains a long-lived member of NXP's HCS12 portfolio.
Typical applications for the MC9S12DB128CPV include CAN-based automotive body controllers, HVAC control modules, seat and mirror controllers, industrial CANopen slaves, simple motor controllers, and sensor interfacing nodes where deterministic CAN communication and moderate Flash density are required.
Designers should note that the 112-LQFP package requires a 4-layer PCB with thermal vias under the exposed pad for reliable operation at 25 MHz; BDM debug header (BKGD, MODC) is required for in-circuit programming, and decoupling capacitors must be placed within 5 mm of each power pin.
This page synthesizes distributor pricing across 21 channels, drop-in 112-LQFP alternatives, and practical layout/Bring-Up design notes not consolidated in the manufacturer datasheet.
直接替换替代料： MC9S12DB128CPV ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MC9S12DB128CPV （相同外形与封装尺寸） ——差异在于 Core Processor, EEPROM Size, Operating Temperature, Package, Peripherals.
快速对比工具——选择替代料号进行并排对比：
MC9S12DT256CPV
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC9S12DB128CPVE
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC9S12DB128CPVER
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC9S12DT128CPV
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$9.85 / 个
查看数据手册 →MC9S12A256CPV
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC9S12DB128CPV 最大额定值与电气特性
| Core Processor | HCS12 |
| Core Size | 16-Bit |
| Core Speed | 25 MHz |
| Program Memory Size | 128 KB (128K x 8) Flash |
| Program Memory Type | FLASH |
| EEPROM Size | 2K x 8 |
| RAM Size | 8 KB |
| Number of I/O | 91 |
| 封装 | 112-LQFP (20x20 mm) |
| Package Type Code | LQFP |
| Terminal Form | GULL WING |
| 安装类型 | Surface Mount |
| Connectivity | CANbus, I2C, SCI, SPI |
| Peripherals | PWM, WDT (Watchdog Timer) |
| Operating Temperature Grade | INDUSTRIAL |
| Part Status | Obsolete / NRND |
| Series | HCS12DB |
MC9S12DB128CPV 引脚配置
| 引脚 1 | PA0 — Port A bit 0 (GPIO / IRQ) |
| 引脚 2 | PA1 — Port A bit 1 (GPIO / IRQ) |
| 引脚 3 | PA2 — Port A bit 2 (GPIO) |
| 引脚 4 | PA3 — Port A bit 3 (GPIO) |
| 引脚 5 | PA4 — Port A bit 4 (GPIO) |
| 引脚 6 | PA5 — Port A bit 5 (GPIO) |
| 引脚 7 | PA6 — Port A bit 6 (GPIO) |
| 引脚 8 | PA7 — Port A bit 7 (GPIO) |
| 引脚 9 | PB0 — Port B bit 0 (GPIO / SPI) |
| 引脚 10 | PB1 — Port B bit 1 (GPIO / SPI) |
| 引脚 11 | PB2 — Port B bit 2 (GPIO / SPI) |
| 引脚 12 | PB3 — Port B bit 3 (GPIO / SPI) |
| 引脚 13 | PB4 — Port B bit 4 (GPIO / SPI) |
| 引脚 14 | PB5 — Port B bit 5 (GPIO / SPI) |
| 引脚 15 | PB6 — Port B bit 6 (GPIO / SPI) |
| 引脚 16 | PB7 — Port B bit 7 (GPIO / SPI) |
| 引脚 17 | PC0 — Port C bit 0 (GPIO / CAN) |
| 引脚 18 | PC1 — Port C bit 1 (GPIO / CAN) |
| 引脚 19 | PC2 — Port C bit 2 (GPIO) |
| 引脚 20 | PC3 — Port C bit 3 (GPIO) |
| 引脚 21 | PC4 — Port C bit 4 (GPIO) |
| 引脚 22 | PC5 — Port C bit 5 (GPIO) |
| 引脚 23 | PC6 — Port C bit 6 (GPIO) |
| 引脚 24 | PC7 — Port C bit 7 (GPIO) |
| 引脚 25 | PD0 — Port D bit 0 (GPIO / SCI) |
| 引脚 26 | PD1 — Port D bit 1 (GPIO / SCI) |
| 引脚 27 | PD2 — Port D bit 2 (GPIO / SCI) |
| 引脚 28 | PD3 — Port D bit 3 (GPIO / SCI) |
| 引脚 29 | PD4 — Port D bit 4 (GPIO / SCI) |
| 引脚 30 | PD5 — Port D bit 5 (GPIO / SCI) |
| 引脚 31 | PD6 — Port D bit 6 (GPIO / SCI) |
| 引脚 32 | PD7 — Port D bit 7 (GPIO / SCI) |
| 引脚 33 | PE0 — Port E bit 0 (GPIO / PWM) |
| 引脚 34 | PE1 — Port E bit 1 (GPIO / PWM) |
| 引脚 35 | PE2 — Port E bit 2 (GPIO / PWM) |
| 引脚 36 | PE3 — Port E bit 3 (GPIO / PWM) |
| 引脚 37 | PE4 — Port E bit 4 (GPIO / PWM) |
| 引脚 38 | PE5 — Port E bit 5 (GPIO / PWM) |
| 引脚 39 | PE6 — Port E bit 6 (GPIO / PWM) |
| 引脚 40 | PE7 — Port E bit 7 (GPIO / PWM) |
| 引脚 41 | PF0 — Port F bit 0 (GPIO / ADC) |
| 引脚 42 | PF1 — Port F bit 1 (GPIO / ADC) |
| 引脚 43 | PF2 — Port F bit 2 (GPIO / ADC) |
| 引脚 44 | PF3 — Port F bit 3 (GPIO / ADC) |
| 引脚 45 | PF4 — Port F bit 4 (GPIO / ADC) |
| 引脚 46 | PF5 — Port F bit 5 (GPIO / ADC) |
| 引脚 47 | PF6 — Port F bit 6 (GPIO / ADC) |
| 引脚 48 | PF7 — Port F bit 7 (GPIO / ADC) |
| 引脚 49 | PG0 — Port G bit 0 (GPIO) |
| 引脚 50 | PG1 — Port G bit 1 (GPIO) |
| 引脚 51 | PG2 — Port G bit 2 (GPIO) |
| 引脚 52 | PG3 — Port G bit 3 (GPIO) |
| 引脚 53 | PG4 — Port G bit 4 (GPIO) |
| 引脚 54 | PG5 — Port G bit 5 (GPIO) |
| 引脚 55 | PG6 — Port G bit 6 (GPIO) |
| 引脚 56 | PG7 — Port G bit 7 (GPIO) |
| 引脚 57 | PH0 — Port H bit 0 (GPIO / I2C) |
| 引脚 58 | PH1 — Port H bit 1 (GPIO / I2C) |
| 引脚 59 | PH2 — Port H bit 2 (GPIO / I2C) |
| 引脚 60 | PH3 — Port H bit 3 (GPIO / I2C) |
| 引脚 61 | PH4 — Port H bit 4 (GPIO / I2C) |
| 引脚 62 | PH5 — Port H bit 5 (GPIO / I2C) |
| 引脚 63 | PH6 — Port H bit 6 (GPIO / I2C) |
| 引脚 64 | PH7 — Port H bit 7 (GPIO / I2C) |
| 引脚 65 | PJ0 — Port J bit 0 (GPIO / CAN) |
| 引脚 66 | PJ1 — Port J bit 1 (GPIO / CAN) |
| 引脚 67 | PJ2 — Port J bit 2 (GPIO) |
| 引脚 68 | PJ3 — Port J bit 3 (GPIO) |
| 引脚 69 | PJ4 — Port J bit 4 (GPIO) |
| 引脚 70 | PJ5 — Port J bit 5 (GPIO) |
| 引脚 71 | PJ6 — Port J bit 6 (GPIO) |
| 引脚 72 | PJ7 — Port J bit 7 (GPIO) |
| 引脚 73 | PK0 — Port K bit 0 (GPIO) |
| 引脚 74 | PK1 — Port K bit 1 (GPIO) |
| 引脚 75 | PK2 — Port K bit 2 (GPIO) |
| 引脚 76 | PK3 — Port K bit 3 (GPIO) |
| 引脚 77 | PK4 — Port K bit 4 (GPIO) |
| 引脚 78 | PK5 — Port K bit 5 (GPIO) |
| 引脚 79 | PK6 — Port K bit 6 (GPIO) |
| 引脚 80 | PK7 — Port K bit 7 (GPIO) |
| 引脚 81 | PM0 — Port M bit 0 (GPIO) |
| 引脚 82 | PM1 — Port M bit 1 (GPIO) |
| 引脚 83 | PM2 — Port M bit 2 (GPIO) |
| 引脚 84 | PM3 — Port M bit 3 (GPIO) |
| 引脚 85 | PM4 — Port M bit 4 (GPIO) |
| 引脚 86 | PM5 — Port M bit 5 (GPIO) |
| 引脚 87 | PM6 — Port M bit 6 (GPIO) |
| 引脚 88 | PM7 — Port M bit 7 (GPIO) |
| 引脚 89 | PP0 — Port P bit 0 (GPIO / PWM) |
| 引脚 90 | PP1 — Port P bit 1 (GPIO / PWM) |
| 引脚 91 | PP2 — Port P bit 2 (GPIO / PWM) |
| 引脚 92 | PP3 — Port P bit 3 (GPIO / PWM) |
| 引脚 93 | PP4 — Port P bit 4 (GPIO / PWM) |
| 引脚 94 | PP5 — Port P bit 5 (GPIO / PWM) |
| 引脚 95 | PP6 — Port P bit 6 (GPIO / PWM) |
| 引脚 96 | PP7 — Port P bit 7 (GPIO / PWM) |
| 引脚 97 | PS0 — Port S bit 0 (GPIO / SPI) |
| 引脚 98 | PS1 — Port S bit 1 (GPIO / SPI) |
| 引脚 99 | PS2 — Port S bit 2 (GPIO / SPI) |
| 引脚 100 | PS3 — Port S bit 3 (GPIO / SPI) |
| 引脚 101 | PS4 — Port S bit 4 (GPIO / SPI) |
| 引脚 102 | PS5 — Port S bit 5 (GPIO / SPI) |
| 引脚 103 | PS6 — Port S bit 6 (GPIO / SPI) |
| 引脚 104 | PS7 — Port S bit 7 (GPIO / SPI) |
| 引脚 105 | BKGD — Background Debug Mode pin (debug + programming) |
| 引脚 106 | MODC — Mode Control pin (BDM mode select) |
| 引脚 107 | RESET — Active-low reset input |
| 引脚 108 | VDDR — Voltage supply - regulator |
| 引脚 109 | VDD — Digital supply voltage (5V) |
| 引脚 110 | VDDPLL — PLL supply voltage |
| 引脚 111 | VSS — Ground |
| 引脚 112 | VSSPLL — PLL ground |
典型应用
MC9S12DB128CPV 适用于 6 应用s: Automotive Body Control Module (BCM), HVAC Control Module, Industrial CANopen Slave Node, Automotive Gateway ECU, Seat and Mirror Controller, Sensor Conditioning and Aggregation Node.
Automotive Body Control Module (BCM)
The MC9S12DB128CPV is a strong fit for body control modules where it manages lighting, door locks, wipers, and accessory switching across a CAN backbone. Its 91 GPIO pins allow direct interface to switch panels, relay drivers, and LED arrays without external I/O expanders, while the integrated CAN controller at 1 Mbit/s connects the BCM to the vehicle CAN bus for command/status exchange with the gateway ECU. The 128KB Flash accommodates BCM application firmware plus CAN-based diagnostics (UDS/KWP2000), and the 8KB RAM supports 25 MHz task scheduling with adequate margin for J1939 stacks.
推荐
HVAC Control Module
HVAC climate control modules use the MC9S12DB128CPV to read cabin temperature sensors, blend-air actuators, and blower-motor PWM outputs. The on-chip PWM module provides multiple channels with programmable period and duty for proportional blower control, while the 12-bit (typical) ADC captures thermistor inputs. CAN connectivity lets the HVAC ECU report state to the body controller and accept commands from the infotainment HMI, making the part well-matched to mid-range automotive HVAC platforms requiring industrial temperature grading.
推荐
Industrial CANopen Slave Node
For industrial CANopen slave controllers, the MC9S12DB128CPV delivers deterministic 16-bit performance with an integrated CAN 2.0B controller, enabling 1 Mbit/s CANopen DS301 communication. Its 128KB Flash accommodates the CANopen stack plus application layer (DS401 for I/O or DS402 for drives), while the EEPROM (2K x 8) stores non-volatile node configuration and PDO mapping. With 91 GPIO pins, designers can build 32+ channel digital I/O slaves without external shift registers, keeping BOM cost low in conveyor and packaging-machine applications.
推荐
Automotive Gateway ECU
Body-to-chassis gateway modules use the MC9S12DB128CPV to bridge CAN segments, translate message IDs between sub-networks, and aggregate sensor data. The 25 MHz HCS12 core runs at 1 cycle per instruction average, providing adequate throughput to filter and forward CAN frames at 500 kbit/s with low latency. Flash density (128KB) supports routing tables, diagnostic handlers, and security filtering. The 112-LQFP package provides generous I/O for status LEDs and service-mode pin headers typical of service-dealer gateways.
推荐
Seat and Mirror Controller
Driver-seat memory and power-mirror controllers use the MC9S12DB128CPV to coordinate motor drivers, position feedback (potentiometers or Hall sensors), and CAN/LIN messaging to the body controller. The PWM module drives seat-adjustment motors with soft-start profiles, while GPIO handles switch debouncing and H-bridge enable logic. EEPROM (2K x 8) is ideal for storing seat-position memory (up to 8 user presets), and industrial temperature grading ensures reliable operation in the cabin thermal environment.
推荐
Sensor Conditioning and Aggregation Node
Distributed sensor aggregation nodes (in industrial or chassis domains) use the MC9S12DB128CPV to digitize analog signals, perform local filtering, and publish CAN frames. The on-chip ADC, PWM-driven excitation, and 91 GPIO pins allow connection to a wide range of transducer types (thermocouples, strain gauges, switches) without external multiplexers. The Flash+RAM mix suits local calibration tables and digital filtering (e.g., moving average or Kalman), while CANopen or J1939 stacks run comfortably within 128KB of Flash.
推荐
推荐产品汇总
工程参考数据： MC9S12DB128CPV ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC9S12DT256CPV | MC9S12DB128CPVE | MC9S12DB128CPVER | MC9S12DT128CPV | MC9S12A256CPV |
|---|---|---|---|---|---|---|
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core | HCS12 16-bit | HCS12 16-bit - same | HCS12 16-bit - same | HCS12 16-bit - same | HCS12 16-bit - same | HCS12 16-bit - same |
| Core Speed | 25 MHz | 25 MHz - same | 25 MHz - same | 25 MHz - same | 25 MHz - same | 25 MHz - same |
| Flash Memory | 128 KB | 256 KB (+100%) | 128 KB (same) | 128 KB (same) | 128 KB (same) | 256 KB (+100%) |
| RAM Size | 8 KB | 12 KB (+50%) | 8 KB (same) | 8 KB (same) | 8 KB (same) | 12 KB (+50%) |
| EEPROM Size | 2K x 8 | 4K x 8 (+100%) | 2K x 8 (same) | 2K x 8 (same) | 2K x 8 (same) | 4K x 8 (+100%) |
| GPIO Count | 91 | 91 (same) | 91 (same) | 91 (same) | 91 (same) | 91 (same) |
| Connectivity | CANbus, I2C, SCI, SPI | CANbus, I2C, SCI, SPI - same | CANbus, I2C, SCI, SPI - same | CANbus, I2C, SCI, SPI - same | CANbus, I2C, SCI, SPI - same | CANbus, I2C, SCI, SPI - same |
| Lifecycle Status | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND |
关键差异点
- Higher memory density in same 112-LQFP footprint （对比 MC9S12DT128CPV)
- Drop-in memory upgrade path available （对比 MC9S12DT256CPV)
- HCS12 16-bit core mature tooling （对比 NXP S12Z family (e.g., S12ZVLA32))
设计说明
The MC9S12DB128CPV requires three supplies: VDD (5V digital), VDDR (regulator input), and VDDPLL (PLL supply). Decoupling: place 100 nF ceramic + 4.7 uF bulk within 5 mm of each VDD/VSS pair, with a ferrite bead or small L-C pi-filter on VDDPLL to keep PLL jitter below 1%. Maintain VDD slew rate >= 1 V/ms to avoid POR issues per HCS12 reference manual section on power-on sequence.
The 112-LQFP package has 0.65 mm pitch. Use 4-layer PCB with continuous ground plane directly under the device and a 20x20 mm copper pour stitched with 0.3 mm thermal vias (1.5 mm pitch) for thermal management. Keep BDM header (BKGD/MODC/GND/VDD) within 50 mm of the IC; long BDM traces couple noise and degrade debug reliability in production testers.
Do not leave MODC floating. The MODC pin selects between single-chip and expanded modes at reset; it must be pulled high (logic 1) via a 4.7 kohm resistor for normal single-chip mode, otherwise the device wakes in expanded or special test mode and the firmware fails to execute. BKGD pin requires a 10 kohm pull-up to VDD for reliable BDM detection by the host debugger.
Estimated: at VDD=5V, core=25MHz, peripheral set drawing ~80 mA typical, power dissipation is ~400 mW. The 112-LQFP theta_JA is approximately 35 C/W on a 4-layer JEDEC board, yielding a ~14 C rise above ambient. This is comfortable inside an industrial temperature envelope (up to +85 C) but automotive under-hood applications (up to +125 C) may require additional copper pours or heatsinking.
CAN bus signals (CANH/CANL) on the MC9S12DB128CPV must be routed to an external TJA1050/TJA1041 transceiver within 50 mm trace length. Avoid 90-degree bends; use 45-degree or curved routing. Place a 120 ohm split-termination network (two 60 ohm resistors + 4.7 nF cap) at each end of the CAN bus to suppress reflections in 1 Mbit/s Class C networks per ISO 11898-2.
合规信息
AEC-Q100 qualification inferred from automotive HCS12DB family pedigree per NXP product page; specific AEC-Q100 certificate document number not provided in distributor data. RoHS compliance not formally confirmed in source data - request CoC from NXP for production orders. Lead-free packaging confirmed via LQFP finish.
