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NXP Semiconductors

MPC555LFCZP40 - 40MHz PowerPC 32-Bit MCU, 448KB Flash | NXP

料号: MPC555LFCZP40 ⚠ 最后一次采购
有现货 1-3 个工作日内发货
5 V (typical, MPC500 family) Vdss 272-PBGA (27 x 27 mm) Package 40 MHz Speed 448 KB (448K x 8) Flash Memory
低至 $36.75 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-17
批量定价
数量 单价 小计
1 $56.35 $56.35
10 $53.5 $535.00
100 $48.9 $4,890.00
500 $42.1 $21,050.00
1,000 $36.75 $36,750.00
ℹ️ 所有价格均以 USD 计价

MPC555LFCZP40 概述

The NXP MPC555LFCZP40 is a 32-bit PowerPC microcontroller from the MPC5xx family, operating at 40 MHz with 448 KB of on-chip Flash program memory and 26 KB of SRAM, packaged in a 272-ball Plastic BGA (PBGA) measuring 27 x 27 mm. The device integrates a PowerPC core with a 32-bit RISC architecture, 101 I/O lines, and an external oscillator interface, making it suitable for high-reliability automotive and industrial embedded designs.

What is a 32-bit PowerPC microcontroller? A microcontroller (MCU) is a single-chip computer containing a CPU, memory, and peripherals, while a 32-bit architecture means the data path, registers, and ALU operations are 32 bits wide, enabling higher code density and faster arithmetic than 8-bit or 16-bit MCUs. The PowerPC core family originated as a RISC architecture developed jointly by Apple, IBM, and Motorola, and NXP (formerly Freescale) adapted it for automotive and industrial control. The MPC5xx sits within the broader hierarchy of MCU -> 32-bit MCU -> PowerPC core MCU -> automotive-grade MCU. The LFCZP40 suffix encodes Speed grade (40 MHz), a specific mask/revision, and the 272-pin PBGA package.

Key features include 448 KB of embedded Flash for program storage, 26 KB of SRAM for data, 101 general-purpose I/O lines, support for external crystal/oscillator clocking, and automotive-grade qualification that allows deployment under harsh environmental conditions. The wide operating temperature range and robust peripheral set support engine control units and other safety-critical systems.

The architecture combines the PowerPC integer unit with a peripheral set tailored for real-time control, including timers, ADC channels, CAN modules, and serial interfaces. Its deterministic interrupt latency and on-chip memory arrangement remove the need for external program memory in many applications.

Typical applications include automotive engine and transmission control, robotics motion control, and avionics subsystems. Industrial automation controllers, drive electronics, and high-reliability safety platforms also rely on this part where deterministic 32-bit performance and automotive-grade qualification are required.

Designers should evaluate the device's power consumption versus system throughput, ensure firmware accommodates the Flash endurance limits, and reserve sufficient PCB area for the 27 x 27 mm 272-ball PBGA footprint including clearances for the BGA escape routing.

This page synthesizes distributor pricing, drop-in compatible MPC5xx alternatives, and practical design notes that supplement the manufacturer's datasheet.

直接替换替代料: MPC555LFCZP40 ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MPC555LFCZP40 (相同外形与封装尺寸) ——差异在于 Core Architecture, RAM Size, Number of I/O, Package, Program Memory Size.

NXP Semiconductors
Core Architecture: PowerPC
RAM Size: 26K x 8
Number of I/O: 101
对比 MPC555LFCZP40 →
NXP Semiconductors
Core Architecture: 32-bit RISC
Number of I/O: 56 (approximate)
Package: 272-PBGA (27x27 mm)
对比 MPC555LFCZP40 →
NXP Semiconductors
RAM Size: 26 KB (26K x 8)
Number of I/O: 101
Package: 272-PBGA (27x27 mm)
对比 MPC555LFCZP40 →

快速对比工具——选择替代料号进行并排对比:

MPC555LFAZP40

✅ 直接替换
📦 272-PBGA (27x27)
same 272-PBGA Z-package and 448 KB Flash / 40 MHz core, different mask/revision (A vs C)

📋 参考替代料(不在目录中)

MPC555LFMZP40

✅ 直接替换
NXP Semiconductors
📦 272-PBGA (27x27)
32-bit microcontroller · PowerPC · 40 MHz · 448 KB (448K x 8) · 26 KB (26K x 8) · 101 · 272-PBGA (27x27 mm) · Surface mount

✓ 有现货

联系询价

查看数据手册 →

MPC555LFMVR40

✅ 直接替换
NXP Semiconductors
📦 272-PBGA (27x27)
NXP Semiconductors · MPC500 / Qorivva · PowerPC e500 / MPC5xx · 32-bit RISC · 40 MHz · 448 KB FLASH · 32 KB SRAM · 5 V nominal

✓ 有现货

$24.95 / 个

查看数据手册 →

MPC555LFCVR40

✅ 直接替换
📦 272-PBGA (27x27)
same 272-BGA family but V-package pitch/layout differs slightly from Z; confirm footprint match before substitution

📋 参考替代料(不在目录中)

MPC555LFCZP40 最大额定值与电气特性

Core Architecture PowerPC MPC5xx (32-bit)
Program Memory Size 448 KB (448K x 8) Flash
RAM Size 26 KB
最大时钟频率 40 MHz
Number of I/O Lines 101
封装 / 外壳 272-PBGA (27 x 27 mm)
Oscillator Type External
电源电压 5 V (typical, MPC500 family)
Peripherals Timers, ADC, CAN, serial interfaces (per MPC5xx family)
安装类型 Surface Mount
Packaging Tray
数据总线宽度 32-bit
Program Memory Type Flash
Family Series MPC500 / MPC5xx

MPC555LFCZP40 272-pbga (27 x 27 mm) 引脚配置指南

MPC555LFCZP40(272-pbga (27 x 27 mm) 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

MPC555LFCZP40 的 272-pbga (27 x 27 mm) 封装引脚图

暂无详细引脚数据: MPC555LFCZP40.

请参阅 数据手册 以查看完整引脚配置。

典型应用

MPC555LFCZP40 适用于 6 应用s: Automotive Engine Control Unit, Transmission Control Module, Industrial Robotics Motion Controller, Avionics Flight Control Subsystem, Industrial Automation PLC, Automotive Body and Chassis Module.

🚗

Automotive Engine Control Unit

The MPC555LFCZP40's 40 MHz PowerPC core, 448 KB Flash, and automotive-grade qualification make it suited for engine management modules where deterministic execution and large on-chip program memory dominate the design. Its 101 I/O lines connect to ignition drivers, fuel injectors, and O2/MAF sensor signal conditioning, while the integrated CAN modules interface with the vehicle bus. Unlike external-memory designs, the on-chip Flash path simplifies PCB layout and improves boot-time predictability, which is critical for safety-critical powertrain controllers meeting ISO 26262 expectations at the time of design.

🚗

Transmission Control Module

Transmission controllers require real-time torque calculations and high-speed serial communication, both of which the MPC555LFCZP40 supports through its PowerPC architecture and integrated CAN interfaces. The 26 KB SRAM absorbs transient speed/load tables during gear-shift events, while 448 KB of Flash holds shift maps and adaptive learning parameters. Compared with newer MPC55xx successors, the LFCZP40 retains an extensive installed base and validated firmware libraries for mature transmission platforms, reducing qualification risk during redesigns of long-life vehicles.

🏭

Industrial Robotics Motion Controller

Industrial motion controllers benefit from the deterministic 32-bit PowerPC core that executes PID loops at consistent cycle times, while the 101 I/O lines drive multi-axis motor feedback and servo loop controls. The 40 MHz clock and on-chip 448 KB Flash support complex trajectory-generation firmware without external memory, freeing PCB real-estate for driver stages. The robust BGA package and automotive-grade temperature range allow deployment in factory cabinets where ambient temperature swings challenge lesser-grade MCUs.

✈️

Avionics Flight Control Subsystem

The MPC555LFCZP40 supplies deterministic 32-bit throughput with automotive-grade qualification that allows deployment in non-safety-critical avionics subsystems such as utility controls and actuator interfaces. Its 448 KB Flash accommodates flight-surfaces firmware, while 26 KB of SRAM stages uplink/downlink command buffers. The 272-PBGA package withstands the high-vibration environment typical of avionics bays. Designers should pair the MCU with redundant watchdog and supervisory circuits to meet DO-178C / DO-254 objectives required for certifiable designs.

🏭

Industrial Automation PLC

Programmable logic controllers serving heavy industrial machinery leverage the MPC555LFCZP40's 32-bit arithmetic and 101 I/O lines for digital and analog I/O handling. The 448 KB Flash stores ladder-logic runtimes and complex motion profiles, while the external oscillator pin supports deterministic cycle synchronization across multiple PLC nodes. Versus modern Cortex-M based PLC CPUs, the MPC555 parts trade raw clock frequency for mature firmware ecosystems and long-life support windows in factory-automation applications.

🚗

Automotive Body and Chassis Module

Body control modules for lighting, HVAC, and chassis subsystems draw on the MPC555LFCZP40's broad I/O count (101 lines) and automotive CAN integration to coordinate distributed body functions without external bus bridges. The 448 KB Flash holds calibration tables for lighting patterns and HVAC modes, while on-chip SRAM supports LIN/CAN message buffering. Compared with newer MPC56xx parts, the LFCZP40 delivers proven firmware IP that accelerates time-to-market for niche and retrofit automotive applications.

推荐产品汇总

MPC555LFAZP40 Drop-in successor mask revision on same 272-PBGA 用于: Automotive Engine Control Unit, Avionics Flight Control Subsystem, Automotive Body and Chassis Module MC33816 External gate driver IC for engine control outputs 用于: Automotive Engine Control Unit MPC555LFMZP40 NXP Semiconductors 用于: Transmission Control Module TJA1040 High-speed CAN transceiver 用于: Transmission Control Module MPC555LFCVR40 Same-family NXP MCU on closely related BGA 用于: Industrial Robotics Motion Controller MAX31913 Industrial digital input translator for I/O expansion 用于: Industrial Robotics Motion Controller MAX1232 Watchdog/supervisor for fault-tolerant resets 用于: Avionics Flight Control Subsystem MPC555LFMVR40 NXP Semiconductors 用于: Industrial Automation PLC MAX1480B 用于: Industrial Automation PLC TJA1027 LIN transceiver for body electronics 用于: Automotive Body and Chassis Module
What is the program memory size of MPC555LFCZP40?
The MPC555LFCZP40 integrates 448 KB of on-chip Flash program memory (448K x 8) alongside 26 KB of SRAM, according to NXP product documentation. This single-chip memory arrangement removes external program memory in most applications, simplifying PCB layout and improving boot determinism for automotive engine control units.
Does MPC555LFCZP40 have an integrated CAN module?
Yes. The MPC555 device family integrates CAN (Controller Area Network) modules alongside other peripherals for real-time automotive networking. Engineers should consult the manufacturer datasheet for the exact CAN channel count, baud rate capabilities, and acceptance filter configuration for production designs.
What package does MPC555LFCZP40 use?
The MPC555LFCZP40 ships in a 272-pin Plastic Ball Grid Array (PBGA) package measuring 27 x 27 mm with surface-mount mounting. The wide BGA footprint requires careful escape routing and at least 6 routing layers on the PCB to fan out all 272 signals without via congestion.
What is the maximum clock frequency of MPC555LFCZP40?
The MPC555LFCZP40 operates at a maximum clock frequency of 40 MHz on its PowerPC core. According to NXP documentation, the device uses an external oscillator source; the 40 MHz figure in the part suffix indicates the speed grade that reflects the maximum internal core clock.
Is MPC555LFCZP40 still in production?
The NXP product page marks MPC555LFCZP40 with end-of-life indicators including Discontinuance and Product Change Notice entries, which means the part is approaching or in last-time-buy status. Engineers designing new platforms should evaluate current production alternatives within the MPC55xx or MPC5xx families.
What is the difference between MPC555LFCZP40 and MPC555LFCVR40?
The MPC555LFCZP40 is supplied in a 272-PBGA Z-package while the MPC555LFCVR40 uses the V/BGA form factor (often different ball pitch and layout). Both run at 40 MHz with 448 KB Flash and 26 KB SRAM, but the BGA variants are NOT pin-compatible because PCB footprint, ball pitch, and pin map differ.
Can MPC562MZP56 replace MPC555LFCZP40?
The MPC562MZP56 is not a drop-in replacement for MPC555LFCZP40. While both belong to NXP's MPC5xx/MPC56x automotive family, they differ in core architecture (MPC555 uses PowerPC, MPC56x uses the e200 core), pin count, and package. Designers should plan firmware and PCB migration rather than rely on direct substitution.
Where can I buy MPC555LFCZP40 right now?
MPC555LFCZP40 is listed in stock at distributors including LCSC (from $56.35) and Heisener (approximately $135.89, stock 7,312 pieces as of 2026-10-17). Contact distributors for live quotes because lead times on end-of-life parts can fluctuate; Rochester Electronics and other aftermarket suppliers often carry obsolete allocations.
How much does MPC555LFCZP40 cost in 100-piece quantities?
As of 2026-10-17, MPC555LFCZP40 pricing breaks down to approximately $48.90 per unit at qty 100, dropping to about $36.75 per unit at qty 1000. Higher volumes and authorized NXP distribution channels usually produce meaningful price improvements, but with last-time-buy status, prices may rise as supply tightens.
What is the typical lead time for MPC555LFCZP40 orders?
As of 2026-10-17, Heisener advertises that MPC555LFCZP40 can ship immediately with estimated delivery in 5 to 10 business days. LCSC also lists the part in stock. Lead times on legacy NXP parts swing with broker activity, so request a quotation to confirm availability for production orders.
Which NXP part is the best drop-in replacement for MPC555LFCZP40?
The best drop-in compatible replacement for MPC555LFCZP40 is typically MPC555LFAZP40, which shares the 272-PBGA (Z-package, 27 x 27 mm) footprint and the same 40 MHz core / 448 KB Flash configuration. Designers should compare mask revisions and errata sheets before re-qualifying a long-lifecycle successor such as the MPC55xx family.
What is the operating temperature range of MPC555LFCZP40?
The MPC555LFCZP40 is qualified for automotive-grade operating ranges, typically -40C to +125C junction temperature. Confirm the exact temperature grade and any mission-profile derating recommendations with the latest NXP datasheet because automotive MCUs often have multiple temperature suffixes.
Where do I download the MPC555LFCZP40 datasheet PDF?
The official MPC555LFCZP40 datasheet is available from NXP at https://www.nxp.com/part/MPC555LFCZP40 in the Data Sheet section. Third-party archives such as Digchip and Datasheets.com also host PDF copies, but always cross-reference the latest NXP revision to capture mask updates and errata.
Does MPC555LFCZP40 support automotive functional safety requirements?
Yes. The MPC555 family was designed for safety-critical automotive subsystems, including engine and transmission control, and provides the deterministic real-time performance required for those platforms. For functional-safety certification beyond the core qualification, consult the NXP safety manual and PPAP documentation specific to your project.
Is MPC555LFCZP40 lead-free and RoHS compliant?
According to NXP product information, MPC555LFCZP40 is supplied with lead-free terminal finish, but the latest RoHS exemption status should be confirmed against the manufacturer datasheet revision because automotive-grade legacy parts sometimes carry specific exemption clauses. Use the NXP product page to verify current compliance certifications.

工程参考数据: MPC555LFCZP40 ——对比、设计指导和合规信息。

选型指南

Choose MPC555LFCZP40 when the system has a legacy firmware base tied to the mask-C silicon and a Z-package 272-PBGA PCB layout, especially for engine and transmission control units requiring deterministic 32-bit PowerPC performance. Choose MPC555LFAZP40 when a second mask revision can shorten supply-chain risk without touching the PCB. Choose MPC555LFMZP40 or MPC555LFMVR40 when the latest mask revision is preferred and either the Z-package or the V-package footprint matches. For brand-new designs outside the MPC5xx firmware ecosystem, consider migrating to the MPC56xx family, but plan firmware and qualification effort accordingly.

与替代料对比

参数 本产品 MPC555LFAZP40 MPC555LFMZP40 MPC555LFMVR40 MPC555LFCVR40
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 272-PBGA (27x27 mm) 272-PBGA (27x27 mm) - same 272-PBGA (27x27 mm) - same 272-PBGA (27x27 mm) - same 272-BGA (27x27 mm) - same family, V-package variant
Core / Architecture PowerPC MPC5xx (32-bit) PowerPC MPC5xx (32-bit) - same PowerPC MPC5xx (32-bit) - same PowerPC MPC5xx (32-bit) - same PowerPC MPC5xx (32-bit) - same
Clock Frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
Flash Program Memory 448 KB 448 KB 448 KB 448 KB 448 KB
SRAM 26 KB 26 KB 26 KB 26 KB 26 KB
I/O Lines 101 101 101 101 101
Mask / Revision LFCZP40 (mask C) LFAZP40 (mask A) LFMZP40 (mask M) LFMVR40 (V-package, mask M) LFCVR40 (V-package, mask C)

关键差异点

  • Mask-revision flexibility within same footprint (对比 MPC555LFAZP40)
  • Documented automotive-grade qualification (对比 MPC555LFCVR40 (V-package variant))
  • Large on-chip Flash reduces external memory (对比 MPC555LFMVR40)

设计说明

Estimated: the 272-ball PBGA at 27 x 27 mm typically has 1.27 mm ball pitch, which requires at least a 6-layer PCB stack-up with microvia technology to escape all signals. Plan dog-bone or via-in-pad fan-outs early and reserve 2 layers for ground to provide a low-impedance return path for high-speed signals.

Estimated: at 40 MHz with all peripherals enabled, the MPC555 family consumes on the order of 200-500 mW from the 5 V supply. Place 100 nF ceramic decoupling caps adjacent to every VDD/VSS pair and add 10 uF bulk tantalum or polymer caps near the regulator to limit switching transients during peripheral bursts.

Do not confuse the LFCZP40 with the LFCVR40 in purchasing or PCB layout: both share the 272-BGA 27 x 27 mm outline, but the Z-package and V-package can differ subtly in ball land-pattern assignments in some MPC555 mask revisions. Always cross-check the pin map against the active NXP datasheet revision before committing artwork.

Estimated: even though the automotive-grade part supports -40C to +125C junction, achieving it on the BGA requires thermal vias under the die-expose pad stitched to internal ground planes. Without these vias, board-level delta_JA can exceed 30 C/W and push the part close to its thermal ceiling at high ambient.

合规信息

RoHS
Unknown
REACH
Unknown
AEC-Q100
Qualified
无铅
Yes
无卤
Unknown
冲突矿物
Unknown

AEC-Q100 automotive qualification per NXP product family documentation; RoHS, REACH, halogen-free, and conflict-mineral certifications not confirmed in the provided web data and should be verified against the latest NXP datasheet.

数据核验日期: 2026-10-17 ——数据由 XAIPART 元器件工程团队核验和整理

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