MPC555LFCZP40 - 40MHz PowerPC 32-Bit MCU, 448KB Flash | NXP
N.º de pieza: MPC555LFCZP40 ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $56.35 | $56,35 |
| 10 | $53.5 | $535,00 |
| 100 | $48.9 | $4.890,00 |
| 500 | $42.1 | $21.050,00 |
| 1.000 | $36.75 | $36.750,00 |
MPC555LFCZP40 Descripción general
What is a 32-bit PowerPC microcontroller? A microcontroller (MCU) is a single-chip computer containing a CPU, memory, and peripherals, while a 32-bit architecture means the data path, registers, and ALU operations are 32 bits wide, enabling higher code density and faster arithmetic than 8-bit or 16-bit MCUs. The PowerPC core family originated as a RISC architecture developed jointly by Apple, IBM, and Motorola, and NXP (formerly Freescale) adapted it for automotive and industrial control. The MPC5xx sits within the broader hierarchy of MCU -> 32-bit MCU -> PowerPC core MCU -> automotive-grade MCU. The LFCZP40 suffix encodes Speed grade (40 MHz), a specific mask/revision, and the 272-pin PBGA package.
Key features include 448 KB of embedded Flash for program storage, 26 KB of SRAM for data, 101 general-purpose I/O lines, support for external crystal/oscillator clocking, and automotive-grade qualification that allows deployment under harsh environmental conditions. The wide operating temperature range and robust peripheral set support engine control units and other safety-critical systems.
The architecture combines the PowerPC integer unit with a peripheral set tailored for real-time control, including timers, ADC channels, CAN modules, and serial interfaces. Its deterministic interrupt latency and on-chip memory arrangement remove the need for external program memory in many applications.
Typical applications include automotive engine and transmission control, robotics motion control, and avionics subsystems. Industrial automation controllers, drive electronics, and high-reliability safety platforms also rely on this part where deterministic 32-bit performance and automotive-grade qualification are required.
Designers should evaluate the device's power consumption versus system throughput, ensure firmware accommodates the Flash endurance limits, and reserve sufficient PCB area for the 27 x 27 mm 272-ball PBGA footprint including clearances for the BGA escape routing.
This page synthesizes distributor pricing, drop-in compatible MPC5xx alternatives, and practical design notes that supplement the manufacturer's datasheet.
Alternativas directas para MPC555LFCZP40 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC555LFCZP40 (mismo factor de forma y huella) — difiere en Core Architecture, RAM Size, Number of I/O, Package, Program Memory Size.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC555LFAZP40
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC555LFMZP40
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →MPC555LFMVR40
✅ Sustitución directa✓ En stock
$24.95 / unidad
Ver hoja de datos →MPC555LFCVR40
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC555LFCZP40 Valores máximos y características eléctricas
| Core Architecture | PowerPC MPC5xx (32-bit) |
| Program Memory Size | 448 KB (448K x 8) Flash |
| RAM Size | 26 KB |
| Frecuencia de reloj máxima | 40 MHz |
| Number of I/O Lines | 101 |
| Encapsulado / Carcasa | 272-PBGA (27 x 27 mm) |
| Oscillator Type | External |
| Tensión de alimentación | 5 V (typical, MPC500 family) |
| Peripherals | Timers, ADC, CAN, serial interfaces (per MPC5xx family) |
| Tipo de montaje | Surface Mount |
| Packaging | Tray |
| Ancho del bus de datos | 32-bit |
| Program Memory Type | Flash |
| Family Series | MPC500 / MPC5xx |
Guía de configuración de pines de MPC555LFCZP40 272-pbga (27 x 27 mm)
Configuración de pines para MPC555LFCZP40 (encapsulado 272-pbga (27 x 27 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC555LFCZP40.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC555LFCZP40 es adecuado para 6 aplicacións: Automotive Engine Control Unit, Transmission Control Module, Industrial Robotics Motion Controller, Avionics Flight Control Subsystem, Industrial Automation PLC, Automotive Body and Chassis Module.
Automotive Engine Control Unit
The MPC555LFCZP40's 40 MHz PowerPC core, 448 KB Flash, and automotive-grade qualification make it suited for engine management modules where deterministic execution and large on-chip program memory dominate the design. Its 101 I/O lines connect to ignition drivers, fuel injectors, and O2/MAF sensor signal conditioning, while the integrated CAN modules interface with the vehicle bus. Unlike external-memory designs, the on-chip Flash path simplifies PCB layout and improves boot-time predictability, which is critical for safety-critical powertrain controllers meeting ISO 26262 expectations at the time of design.
Recomendado
Transmission Control Module
Transmission controllers require real-time torque calculations and high-speed serial communication, both of which the MPC555LFCZP40 supports through its PowerPC architecture and integrated CAN interfaces. The 26 KB SRAM absorbs transient speed/load tables during gear-shift events, while 448 KB of Flash holds shift maps and adaptive learning parameters. Compared with newer MPC55xx successors, the LFCZP40 retains an extensive installed base and validated firmware libraries for mature transmission platforms, reducing qualification risk during redesigns of long-life vehicles.
Recomendado
Industrial Robotics Motion Controller
Industrial motion controllers benefit from the deterministic 32-bit PowerPC core that executes PID loops at consistent cycle times, while the 101 I/O lines drive multi-axis motor feedback and servo loop controls. The 40 MHz clock and on-chip 448 KB Flash support complex trajectory-generation firmware without external memory, freeing PCB real-estate for driver stages. The robust BGA package and automotive-grade temperature range allow deployment in factory cabinets where ambient temperature swings challenge lesser-grade MCUs.
Recomendado
Avionics Flight Control Subsystem
The MPC555LFCZP40 supplies deterministic 32-bit throughput with automotive-grade qualification that allows deployment in non-safety-critical avionics subsystems such as utility controls and actuator interfaces. Its 448 KB Flash accommodates flight-surfaces firmware, while 26 KB of SRAM stages uplink/downlink command buffers. The 272-PBGA package withstands the high-vibration environment typical of avionics bays. Designers should pair the MCU with redundant watchdog and supervisory circuits to meet DO-178C / DO-254 objectives required for certifiable designs.
Recomendado
Industrial Automation PLC
Programmable logic controllers serving heavy industrial machinery leverage the MPC555LFCZP40's 32-bit arithmetic and 101 I/O lines for digital and analog I/O handling. The 448 KB Flash stores ladder-logic runtimes and complex motion profiles, while the external oscillator pin supports deterministic cycle synchronization across multiple PLC nodes. Versus modern Cortex-M based PLC CPUs, the MPC555 parts trade raw clock frequency for mature firmware ecosystems and long-life support windows in factory-automation applications.
Recomendado
Automotive Body and Chassis Module
Body control modules for lighting, HVAC, and chassis subsystems draw on the MPC555LFCZP40's broad I/O count (101 lines) and automotive CAN integration to coordinate distributed body functions without external bus bridges. The 448 KB Flash holds calibration tables for lighting patterns and HVAC modes, while on-chip SRAM supports LIN/CAN message buffering. Compared with newer MPC56xx parts, the LFCZP40 delivers proven firmware IP that accelerates time-to-market for niche and retrofit automotive applications.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC555LFCZP40 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC555LFAZP40 | MPC555LFMZP40 | MPC555LFMVR40 | MPC555LFCVR40 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 272-PBGA (27x27 mm) | 272-PBGA (27x27 mm) - same | 272-PBGA (27x27 mm) - same | 272-PBGA (27x27 mm) - same | 272-BGA (27x27 mm) - same family, V-package variant |
| Core / Architecture | PowerPC MPC5xx (32-bit) | PowerPC MPC5xx (32-bit) - same | PowerPC MPC5xx (32-bit) - same | PowerPC MPC5xx (32-bit) - same | PowerPC MPC5xx (32-bit) - same |
| Clock Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash Program Memory | 448 KB | 448 KB | 448 KB | 448 KB | 448 KB |
| SRAM | 26 KB | 26 KB | 26 KB | 26 KB | 26 KB |
| I/O Lines | 101 | 101 | 101 | 101 | 101 |
| Mask / Revision | LFCZP40 (mask C) | LFAZP40 (mask A) | LFMZP40 (mask M) | LFMVR40 (V-package, mask M) | LFCVR40 (V-package, mask C) |
Diferenciadores clave
- Mask-revision flexibility within same footprint (frente a MPC555LFAZP40)
- Documented automotive-grade qualification (frente a MPC555LFCVR40 (V-package variant))
- Large on-chip Flash reduces external memory (frente a MPC555LFMVR40)
Notas de diseño
Estimated: the 272-ball PBGA at 27 x 27 mm typically has 1.27 mm ball pitch, which requires at least a 6-layer PCB stack-up with microvia technology to escape all signals. Plan dog-bone or via-in-pad fan-outs early and reserve 2 layers for ground to provide a low-impedance return path for high-speed signals.
Estimated: at 40 MHz with all peripherals enabled, the MPC555 family consumes on the order of 200-500 mW from the 5 V supply. Place 100 nF ceramic decoupling caps adjacent to every VDD/VSS pair and add 10 uF bulk tantalum or polymer caps near the regulator to limit switching transients during peripheral bursts.
Do not confuse the LFCZP40 with the LFCVR40 in purchasing or PCB layout: both share the 272-BGA 27 x 27 mm outline, but the Z-package and V-package can differ subtly in ball land-pattern assignments in some MPC555 mask revisions. Always cross-check the pin map against the active NXP datasheet revision before committing artwork.
Estimated: even though the automotive-grade part supports -40C to +125C junction, achieving it on the BGA requires thermal vias under the die-expose pad stitched to internal ground planes. Without these vias, board-level delta_JA can exceed 30 C/W and push the part close to its thermal ceiling at high ambient.
Información de cumplimiento
AEC-Q100 automotive qualification per NXP product family documentation; RoHS, REACH, halogen-free, and conflict-mineral certifications not confirmed in the provided web data and should be verified against the latest NXP datasheet.
