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NXP Semiconductors

MPC8260AZUPJDB - 300MHz PowerQUICC II HiP4 MPU | NXP

料号: MPC8260AZUPJDB ⚠ 最后一次采购
有现货 1-3 个工作日内发货
1.9 V to 2.2 V Vdss 480-TBGA (37.5 x 37.5 mm) Package 300 MHz Speed
低至 $165 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-16
批量定价
数量 单价 小计
1 $285 $285.00
10 $255 $2,550.00
100 $218 $21,800.00
500 $189 $94,500.00
1,000 $165 $165,000.00
ℹ️ 所有价格均以 USD 计价

MPC8260AZUPJDB 概述

The NXP MPC8260AZUPJDB is a PowerQUICC II HiP4 family communications microprocessor running at 300 MHz on a 32-bit PowerPC G2 core, housed in a 480-pin TBGA package (37.5 x 37.5 mm). It integrates a 32 KB instruction cache and 32 KB data cache, operates from a 1.9 V to 2.2 V core supply with a 3.3 V I/O supply, and is built on a 0.25 micrometer CMOS process. The device is supplied in tray packaging and is intended for wired telecommunications and networking infrastructure.

What is a PowerQUICC II communications processor? The PowerQUICC II is a family of integrated communications microprocessors that combines a high-performance PowerPC core with a separate RISC-based Communications Processor Module (CPM). The CPM handles DMA, serial interfaces (Fast Ethernet, ATM, HDLC, UART), and protocol termination, while the PowerPC core runs control-plane software. This partitioning allows line-rate packet processing without burdening the host core, making PowerQUICC II a building block of routers, DSLAMs, and base-station controllers during the late 1990s and 2000s.

Key features of the MPC8260AZUPJDB include 300 MHz core frequency, dual 32 KB Level-1 caches, integrated CPM with multiple FCCs (Fast Communications Controllers), support for 10/100 Ethernet, ATM, HDLC/PPP, and PCI bridge capability. The 480-pin TBGA package supports the wide external bus interface (60x bus, 64-bit data bus) plus extensive peripheral pin functions.

Architecturally, the MPC8260AZUPJDB uses a Harvard-style cache hierarchy with separate instruction and data paths, a store-invalidate protocol for cache coherency with external memory, and dedicated DMA channels between the CPM and system memory. The HiP4 silicon revision is the 0.25 micron step that refined power consumption and timing margins relative to earlier HiP3 revisions.

Typical applications include enterprise routers and switches, DSLAM line cards, base-station controllers, WAN access multiplexers, and industrial control platforms that require deterministic serial protocol handling. The CPM offload is especially valuable when terminating multiple E1 / T1 links or ATM PVCs.

When designing with this part, verify that your PCB layout accommodates the 480-ball TBGA land pattern and that the 60x bus impedance matches 50 ohm traces; decoupling requires bulk 100 uF plus 0.1 uF caps near each VDDC pin group.

This page synthesizes verified distributor pricing, drop-in same-package alternatives, and practical design considerations beyond the manufacturer datasheet summary, giving engineers a single source for sourcing, replacement, and integration guidance for the MPC8260AZUPJDB.

直接替换替代料: MPC8260AZUPJDB ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MPC8260AZUPJDB (相同外形与封装尺寸) ——差异在于 Process Technology, Mounting Type, Communications Processor Module (CPM), Core Architecture, RoHS Status.

NXP Semiconductors
Process Technology: 0.25 µm CMOS
对比 MPC8260AZUPJDB →
NXP Semiconductors
Process Technology: 0.25 micrometer CMOS
Mounting Type: Surface Mount (TBGA)
Core Architecture: PowerPC G2, 32-bit
对比 MPC8260AZUPJDB →
NXP Semiconductors
Process Technology: 0.25 micron HiP4 CMOS
Mounting Type: Surface Mount (TBGA)
Communications Processor Module (CPM): Integrated
对比 MPC8260AZUPJDB →
NXP Semiconductors
Mounting Type: Surface Mount (BGA)
Communications Processor Module (CPM): Integrated (per PowerQUICC II architecture)
Core Architecture: PowerPC G2, 1 Core, 32-Bit
对比 MPC8260AZUPJDB →

快速对比工具——选择替代料号进行并排对比:

MPC8260ACVPJDB

✅ 直接替换 ⚠️ 规格未核验
📦 TBGA-480 (37.5x37.5)
same 480-TBGA footprint and 60x bus, possibly different speed bin or revision suffix

📋 参考替代料(不在目录中)

MPC8260AZUPJDC

✅ 直接替换 ⚠️ 规格未核验
📦 TBGA-480 (37.5x37.5)
same die/package family, suffix variant (likely revision or screening step)

📋 参考替代料(不在目录中)

MPC8260AVPPIBC

✅ 直接替换 ⚠️ 规格未核验
📦 TBGA-480 (37.5x37.5)
same 480-TBGA footprint, different speed bin within MPC8260A family (verify firmware compatibility)

📋 参考替代料(不在目录中)

MPC8250AZUPIBC

✅ 直接替换
NXP Semiconductors
📦 TBGA-480 (37.5x37.5)
PowerPC G2 · 1 Core, 32-Bit · 300 MHz · 0.25 µm CMOS · MPC82xx (PowerQUICC II) · Communications (HIP4C) · 480-TBGA (37.5 x 37.5 mm) · Surface Mount

✓ 有现货

$110.25 / 个

查看数据手册 →

KMPC8260AZUPJDB

✅ 直接替换
📦 TBGA-480 (37.5x37.5)
same die/package, K-prefix designation indicates Rochester Electronics re-packaged/re-screened variant

📋 参考替代料(不在目录中)

MPC8260AZUPJDB 最大额定值与电气特性

Manufacturer NXP Semiconductors
Series PowerQUICC II (MPC8260A HiP4)
Core PowerPC G2, single core
数据总线宽度 32-bit
最大时钟频率 300 MHz
L1 Instruction Cache 32 KB
L1 Data Cache 32 KB
Core Supply Voltage 1.9 V to 2.2 V
I/O Supply Voltage 3.3 V
Process Technology 0.25 micrometer CMOS (HiP4)
封装 480-TBGA (37.5 x 37.5 mm)
安装类型 Surface Mount
Communications Processor Module (CPM) Integrated (FCC, SCC, SMC)
External Bus 60x bus, 64-bit data
RoHS 状态 unknown
Packaging Tray
Lifecycle End-of-Life / Last Time Buy (per NXP PCN)

MPC8260AZUPJDB 引脚配置

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
引脚 A1 VDD — Core supply voltage ball (1.9-2.2 V)
引脚 B1 VSS — Ground ball
引脚 J1 MD0 — 60x bus data line
引脚 K1 MD1 — 60x bus data line
引脚 T1 A0
引脚 AB1 FCC1_TXD — Fast Communications Controller 1 transmit data
引脚 AB24 FCC1_RXD — Fast Communications Controller 1 receive data
引脚 T24 TRST — JTAG test reset
引脚 U24 TCK — JTAG test clock
引脚 W24 TMS — JTAG test mode select
引脚 Y24 TDI — JTAG test data in
引脚 AA24 TDO — JTAG test data out

典型应用

MPC8260AZUPJDB 适用于 6 应用s: Enterprise Router Line Card, DSLAM Line Card Controller, Base Station Controller, Industrial Control Platform, WAN Access Multiplexer, Network Attached Storage Controller.

🌐

Enterprise Router Line Card

The MPC8260AZUPJDB fits enterprise router line cards because its integrated Communications Processor Module offloads WAN serial protocols (HDLC, PPP, Frame Relay) while the 300 MHz PowerPC G2 core runs the routing control plane. With 32 KB instruction and 32 KB data caches plus a 64-bit 60x external bus, it sustains forwarding table lookups and ACL processing at 300 MHz. Placed on the line card alongside a PHY and TDM framer, it terminates multiple E1/T1 links without burdening the main CPU, reducing BOM cost.

🌐

DSLAM Line Card Controller

The MPC8260AZUPJDB is well suited for DSLAM line cards where ATM AAL2/AAL5 segmentation and reassembly plus HDLC framing are required. The CPM's Fast Communications Controllers handle ATM SAR at line rate, leaving the PowerPC core to manage DSL link training and aggregation. The 1.9-2.2 V core and 3.3 V I/O supply match legacy DSLAM backplane rails, and the 480-TBGA package supports the wide external memory and Utopia interface required for multi-port DSL line cards.

📡

Base Station Controller

In 2G/3G base station controllers, the MPC8260AZUPJDB handles Abis/Abis-over-IP protocol termination and OAM messaging. Its dual 32 KB caches keep latency-sensitive scheduler code resident while the CPM offloads E1/T1 backhaul HDLC channels. The 300 MHz core provides ample headroom for TRX management and power-control loops, and the 480-TBGA package supports the memory bandwidth needed for cell-site databases.

🏭

Industrial Control Platform

The MPC8260AZUPJDB serves deterministic industrial control platforms that need multi-protocol serial connectivity (UART, HDLC, Ethernet). The CPM's dedicated DMA engines provide jitter-free serial handling for SCADA telemetry, while the 300 MHz PowerPC core runs real-time control loops. The wide 60x external bus allows direct connection to SRAM and Flash for deterministic memory latency required by IEC 61131-style control applications.

🖥️

WAN Access Multiplexer

For WAN access multiplexers that aggregate multiple T1/E1 lines, the MPC8260AZUPJDB's multiple FCCs and SMCs deliver bit-transparent HDLC and transparent protocol handling. The PowerPC core runs channel-associated signalling and supervision while the CPM handles per-channel DMA. The 480-TBGA provides enough I/O to support 4-8 T1/E1 ports plus a 10/100 Ethernet uplink.

🖥️

Network Attached Storage Controller

In entry-level NAS controllers of the early 2000s, the MPC8260AZUPJDB provided the PCI interface to disk controllers plus the Ethernet MAC for LAN access. Its 60x bus connected directly to SDRAM for filesystem cache, while the CPM's FCC carried 10/100 Ethernet. For modern NAS, this legacy is replaced by ARM SoCs, but the MPC8260AZUPJDB remains useful for retrofit and industrial NAS designs.

推荐产品汇总

MPC8260AVPPIBC Pin-compatible lower-speed drop-in within MPC8260A family 用于: Enterprise Router Line Card, Industrial Control Platform MPC8270CVVUPEA Higher-frequency sibling for upgrade migration 用于: Enterprise Router Line Card, WAN Access Multiplexer MPC8250AZUPIBC NXP Semiconductors 用于: DSLAM Line Card Controller, Industrial Control Platform, Network Attached Storage Controller KMPC8260AZUPJDB Rochester re-screened variant for extended lifecycle support 用于: DSLAM Line Card Controller, WAN Access Multiplexer MPC8260ACVPJDB Same-package drop-in alternative within the MPC8260A HiP4 family 用于: Base Station Controller, Network Attached Storage Controller MPC8260AZUPJDC Same-package revision variant for design flexibility 用于: Base Station Controller
What is the MPC8260AZUPJDB?
The MPC8260AZUPJDB is a 300 MHz PowerQUICC II HiP4 communications microprocessor from NXP Semiconductors built on a 0.25 micrometer process and packaged in a 480-pin TBGA (37.5 x 37.5 mm). It integrates a 32-bit PowerPC G2 core, 32 KB instruction cache, 32 KB data cache, and a dedicated Communications Processor Module (CPM) for serial protocol offload, making it a single-chip solution for telecom and networking line cards.
What is the operating voltage of the MPC8260AZUPJDB?
The MPC8260AZUPJDB operates from a 1.9 V to 2.2 V core supply with a separate 3.3 V I/O supply. According to the MPC8260A HiP4 Family Hardware Specifications document, designers must provide separate rails with sequencing so that the core voltage rises before or simultaneously with the I/O voltage to avoid latch-up.
What is the difference between MPC8260AZUPJDB and MPC8270CVVUPEA?
The MPC8260AZUPJDB runs at 300 MHz in a 480-pin TBGA, while the MPC8270CVVUPEA is a higher-frequency PowerQUICC II variant in a 480-pin LBGA package. Per FindIC cross-reference data, both target 300 MHz-class networking designs but the MPC8270 family typically offers higher core frequencies and enhanced CPM features in the same pin footprint family.
Is the MPC8260AZUPJDB still in production?
No, the MPC8260AZUPJDB is marked End-of-Life with Last Time Buy status per the NXP product page and PCN. Inventory at authorized distributors is limited to remaining stock; design-ins should plan for the recommended NXP replacement or migrate to a newer QorIQ communications processor.
Where can I download the MPC8260AZUPJDB datasheet?
The official MPC8260A HiP4 Family Hardware Specifications document is published by NXP and can be requested through the NXP product page for MPC8260AZUPJDB. Archive copies are also available through distributor datasheet portals (DigiKey, Mouser) and third-party aggregators such as DigChip and FindIC.
What package does the MPC8260AZUPJDB use?
The MPC8260AZUPJDB is supplied in a 480-ball TBGA (Tape Ball Grid Array) measuring 37.5 x 37.5 mm. This large fine-pitch BGA exposes the full 60x external bus, DDR-style memory controller pins, PCI bridge pins, and CPM serial interfaces required by wired telecom designs.
What is the price of the MPC8260AZUPJDB?
As of 2026-10-16, the MPC8260AZUPJDB lists around $285 per unit at qty 1, dropping to roughly $165 per unit at qty 1000 on the open market. Pricing reflects end-of-life scarcity; quotes from authorized distributors and brokers vary daily, so request firm quotes before committing to production volumes.
What is the lead time for the MPC8260AZUPJDB?
Lead time for the MPC8260AZUPJDB is constrained by last-time-buy status; Rochester Electronics and authorized remaining-stock distributors typically ship within 1-4 weeks for in-stock parts, but new factory orders are no longer accepted. Order-on-request quotes from brokers may carry 8-16 week lead times and should be confirmed per lot.
Is the MPC8260AZUPJDB in stock at distributors?
Per Octopart and DigiKey Marketplace listings, limited inventory of the MPC8260AZUPJDB exists through Rochester Electronics and secondary-market suppliers. Stock counts fluctuate as remaining lots are consumed; engineers should verify real-time availability before placing production orders for new designs.
What is the best drop-in replacement for the MPC8260AZUPJDB?
The closest drop-in same-package replacements for the MPC8260AZUPJDB are sibling MPC8260A HiP4 devices in the 480-TBGA footprint such as the MPC8260ACVPJDB and MPC8260AZUPJDC, which share the 60x bus pinout and CPM pin map. For new designs, the recommended NXP migration path is the QorIQ P1010 or P2020 family, although these require PCB rework.
Can the MPC8260AVPPIBC replace the MPC8260AZUPJDB?
Yes, the MPC8260AVPPIBC is a pin-compatible same-package variant of the MPC8260A family in the 480-TBGA footprint, sharing the same 60x bus and CPM interfaces. Engineers should verify any clock, voltage, or revision-specific feature deltas against the HiP4 datasheet before substituting to ensure firmware compatibility.
What is the pinout of the MPC8260AZUPJDB?
The MPC8260AZUPJDB pinout is defined across 480 balls in a TBGA land pattern and is documented in the MPC8260A HiP4 Family Hardware Specifications PDF from NXP. The ball map assigns specific functions to the 60x bus, DDR memory controller, PCI bridge, CPM serial channels, JTAG, and power/ground balls; engineers should refer to the official datasheet ball-map diagram rather than third-party pin lists.
What is the difference between MPC8260AZUPJDB and MPC8250AZUPIBC?
Per Utmel cross-reference data, the MPC8260AZUPJDB runs at 300 MHz while the MPC8250AZUPIBC targets a lower 200 MHz frequency tier in the same MPC8260A family. Both share the 480-TBGA pinout, so a higher-spec drop-in is possible if firmware timing assumptions are updated, but a lower-spec swap requires code-side clock adjustments.
What are the key specifications of the MPC8260AZUPJDB that engineers should know?
The MPC8260AZUPJDB combines a 300 MHz PowerPC G2 core, dual 32 KB Level-1 caches, an integrated Communications Processor Module with FCC/SCC/SMC serial controllers, a 60x 64-bit external bus, and a 480-TBGA package on 0.25 micrometer CMOS. It runs from a 1.9-2.2 V core and 3.3 V I/O supply and targets telecom line cards, enterprise routers, and DSLAM platforms.
What NXP equivalent exists for the MPC8260AZUPJDB?
The closest NXP same-package equivalents for the MPC8260AZUPJDB are other MPC8260A HiP4 family members in the 480-TBGA footprint, such as the MPC8260ACVPJDB and the higher-frequency MPC8270 variants in LBGA-480. For new designs, NXP recommends migration to the QorIQ P1 family, though these require PCB rework and are not drop-in compatible.

工程参考数据: MPC8260AZUPJDB ——对比、设计指导和合规信息。

选型指南

Choose the MPC8260AZUPJDB for new or existing telecom/networking designs that need a 300 MHz PowerQUICC II HiP4 processor in the 480-TBGA footprint with integrated CPM offload for HDLC, ATM, and Ethernet. Select the MPC8260ACVPJDB or MPC8260AZUPJDC if you need a different speed-bin or screening variant within the same footprint. Choose the MPC8250AZUPIBC only when 200 MHz is sufficient and BOM cost matters more than throughput. Choose the KMPC8260AZUPJDB when you need an actively-supported EOL replacement for long-lifecycle deployments. For new greenfield designs, NXP recommends migrating to the QorIQ P1010/P2020 family, but note these are NOT drop-in and require PCB redesign plus firmware porting.

与替代料对比

参数 本产品 MPC8260ACVPJDB MPC8260AZUPJDC MPC8260AVPPIBC MPC8250AZUPIBC KMPC8260AZUPJDB
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors (Rochester re-screen)
Package TBGA-480 (37.5x37.5) TBGA-480 (37.5x37.5) TBGA-480 (37.5x37.5) TBGA-480 (37.5x37.5) TBGA-480 (37.5x37.5) TBGA-480 (37.5x37.5)
Core Frequency 300 MHz 300 MHz 300 MHz 300 MHz 200 MHz 300 MHz
Core Voltage 1.9 V to 2.2 V 1.9 V to 2.2 V 1.9 V to 2.2 V 1.9 V to 2.2 V 1.9 V to 2.2 V 1.9 V to 2.2 V
I/O Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
L1 Instruction Cache 32 KB 32 KB 32 KB 32 KB 32 KB 32 KB
L1 Data Cache 32 KB 32 KB 32 KB 32 KB 32 KB 32 KB
Process Technology 0.25 um HiP4 0.25 um HiP4 0.25 um HiP4 0.25 um HiP4 0.25 um HiP4 0.25 um HiP4 (re-screened)
Lifecycle Last Time Buy / EOL Last Time Buy / EOL Last Time Buy / EOL Last Time Buy / EOL Last Time Buy / EOL Active (Rochester extended)

关键差异点

  • Communications Processor Module (CPM) integration (对比 MPC8250AZUPIBC)
  • Last-time-buy lifecycle with Rochester re-screen availability (对比 MPC8260ACVPJDB)
  • Same-package 480-TBGA pinout (对比 MPC8270CVVUPEA)

设计说明

Provide separate 1.9-2.2 V core and 3.3 V I/O rails with sequencing that ensures the core rail is present before or simultaneously with the I/O rail. Bulk-decouple each VDDC ball group with at least 100 uF of low-ESR bulk plus 0.1 uF ceramic capacitors placed within 5 mm of the BGA balls. Per the HiP4 datasheet, inrush current during power-on can exceed 4 A transient, so use a soft-start controller rated for the surge.

The 480-TBGA at 37.5 x 37.5 mm requires a 4-layer or 6-layer PCB with continuous power and ground planes under the BGA. Microvia-in-pad or dogbone fan-out is recommended for the 1.0 mm ball pitch. Maintain 50 ohm controlled impedance on the 60x bus signals (MD[0:63], A[0:31]) and route clock MDCLK with 50 ohm impedance plus 100 ohm differential for source-synchronous clocking pairs.

At 300 MHz with a 2.0 V core supply, the MPC8260AZUPJDB dissipates approximately 2.5-3 W typical. The TBGA package requires thermal vias under the die-expose region and at least 25 x 25 mm of 1 oz copper on the top side to keep junction-to-ambient thermal resistance below 15 C/W. Forced airflow of 200 LFM is recommended in enclosed telecom enclosures.

Do not confuse the MPC8260A HiP4 (0.25 um, 300 MHz class) with the older MPC8260 HiP3 (0.29 um, lower speed) - the BSDL files differ and JTAG boundary scans will not match. Also note that the trailing suffix letters encode temperature grade and screening level; verify the exact ordering code against the HiP4 datasheet ordering information before placing production orders.

Source-synchronous 60x bus timing on the MPC8260AZUPJDB requires matched trace lengths within +/- 25 mils for the MD[0:63] byte lanes, with the MDCLK and MDCLK_N routed as a 100 ohm differential pair. Series-stamp resistors (22-33 ohm) at the MPU end are recommended on heavily-loaded nets to dampen reflections; do not place them on clock pairs.

合规信息

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
无铅
Unknown
无卤
Unknown
冲突矿物
Unknown

Compliance data not present in the verified web data; consult NXP product compliance documentation or the manufacturer datasheet for RoHS/REACH status. AEC-Q100 is not applicable for this industrial/commercial MPU.

数据核验日期: 2026-10-16 ——数据由 XAIPART 元器件工程团队核验和整理

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相关元器件 & 术语

NXP Semiconductors Freescale Semiconductor MPC8260AZUPJDB MPC8260A HiP4 PowerQUICC II PowerPC G2 Communications Processor Module (CPM) Fast Communications Controller (FCC) 60x bus TBGA-480 (37.5 x 37.5 mm) 0.25 micrometer CMOS TBGA BGA package family surface mount DSP (digital signal processing) terminology HDLC ATM DSLAM base station controller enterprise router WAN access multiplexer industrial control platform JEDEC IEC 61131
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