MPC8260AVVPJDB - PowerQUICC II 300MHz MPU | NXP | 480-TBGA
料号： MPC8260AVVPJDB ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $228.55 | $228.55 |
| 10 | $205.7 | $2,057.00 |
| 100 | $175.3 | $17,530.00 |
| 500 | $152.4 | $76,200.00 |
| 1,000 | $134.85 | $134,850.00 |
MPC8260AVVPJDB 概述
An integrated communications processor (ICP/MPU) is a category of embedded device that combines a general-purpose microprocessor core with dedicated hardware for fast packet processing, DMA, serial protocols, and memory controllers. PowerQUICC II sits inside the broader PowerQUICC family (I, II, III) and the wider communications-semiconductor hierarchy: MPU -> embedded processor -> PowerPC architecture -> integrated communications processor. This semantic hierarchy is what makes the MPC8260AVVPJDB a frequent answer for telecom and networking design questions.
Key features of the MPC8260AVVPJDB include a 300 MHz PowerPC G2 core, integrated CPM (Communications Processor Module), 60x bus, 32-bit data path, dual 10/100 Ethernet support via Fast Communications Controllers, multiple HDLC/Transparent SCC channels, and a flexible memory controller supporting SDRAM, ROM, and Flash. The device supports up to several Gbps of aggregate serial throughput via its serial channels.
Architecture-wise, the chip splits work between the G2 core (control plane, exception handling, protocol stacks) and the CPM (data plane, DMA, framing). The 480-TBGA package provides the I/O density needed for 60x, 32-bit memory bus, PCI, and multiple serial interfaces while preserving board routability. The 37.5 x 37.5 mm BGA has a 1.27 mm pitch array typical of high-end Freescale/NXP communications processors of that era.
Typical applications for the MPC8260AVVPJDB include branch-office routers, DSLAM line cards, wireless base-station controllers, industrial control routers, multi-protocol bridges, ATM/Frame Relay edge devices, and legacy telecom backplane designs. The integrated communications engine and PCI bridge also suit mid-range storage controllers. In non-carrier use, it is sometimes deployed in industrial SBCs requiring deterministic serial-channel behavior.
A key design consideration is the 480-TBGA requires controlled-impedance, multi-layer PCB with matched-length traces for the 60x bus and serial lines. Power sequencing of the 2V core and 3.3V I/O rails must follow the NXP PowerQUICC II Hardware Specifications document to avoid latch-up. JTAG boundary scan and BSDL support must be planned for production test.
This page consolidates distributor pricing, verified drop-in alternatives, and practical design considerations that go beyond what is published in the NXP datasheet, giving engineers a single decision-ready reference for selecting, sourcing, or replacing the MPC8260AVVPJDB.
直接替换替代料： MPC8260AVVPJDB ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPC8260AVVPJDB （相同外形与封装尺寸） ——差异在于 Process Technology, Mounting Type, L1 Data Cache, L1 Instruction Cache, Number of Cores.
快速对比工具——选择替代料号进行并排对比：
MPC8260AZUPJDB
✅ 直接替换✓ 有现货
$165 / 个
查看数据手册 →MPC8250AZUPIBC
✅ 直接替换✓ 有现货
$110.25 / 个
查看数据手册 →MPC8265AZUPIBC
✅ 直接替换📋 参考替代料（不在目录中）
MPC8270CVVUPEA
✅ 直接替换📋 参考替代料（不在目录中）
MPC8280CVVUPEA
✅ 直接替换📋 参考替代料（不在目录中）
MPC8260AVVPJDB 最大额定值与电气特性
| Processor Type | MPC82xx PowerQUICC II |
| Core Architecture | PowerPC G2, 32-bit |
| Core Frequency | 300 MHz |
| Number of Cores | 1 |
| 封装 | 480-TBGA (37.5 x 37.5 mm) |
| Core Voltage | 2 V |
| I/O Voltage | 3.3 V |
| Process Technology | 0.25 micrometer CMOS |
| Bus Interface | 60x bus |
| 安装类型 | Surface Mount (TBGA) |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| RoHS 状态 | RoHS Compliant |
MPC8260AVVPJDB 480-tbga (37.5 x 37.5 mm) 引脚配置指南
MPC8260AVVPJDB（480-tbga (37.5 x 37.5 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPC8260AVVPJDB.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPC8260AVVPJDB 适用于 6 应用s: Branch-Office Routers, DSLAM Line Cards, Wireless Base Station Controllers, Industrial Control Routers, Multi-Protocol Bridges and Gateways, Legacy Telecom Backplane Designs.
Branch-Office Routers
The MPC8260AVVPJDB's 300 MHz PowerPC G2 core plus integrated Communications Processor Module (CPM) make it well-suited to branch-office routers that need wire-speed WAN serial handling at low BOM cost. The dual 10/100 Ethernet Fast Communications Controllers deliver routed throughput for small-to-medium branch sites, while the SCCs run HDLC/PPP/Frame-Relay uplinks. Placed on the main board with 64-128 MB SDRAM, 8 MB Flash, and a single PHY per FCC, it eliminates an external serial controller. Designers prefer it because the PowerQUICC II silicon is field-proven across thousands of installed branches and Linux/uClinux BSPs are publicly available - lowering software risk for new deployments.
推荐
DSLAM Line Cards
In DSLAM line cards the MPC8260AVVPJDB acts as the aggregation and control-plane processor, handling ATM/HDLC traffic from multiple DSL PHY front-ends while exposing a single uplink to the central-office switch. The CPM's multi-channel SCC array gives one MPU to manage several DSL lines concurrently, and the 60x bus lets designers attach a high-density SDRAM bank for connection tables. Its 3.3V I/O and 2V core rail simplify power tree design on densely populated line cards. Compared to a discrete CPU + multi-UART design, the integrated CPM cuts component count and improves determinism for ATM cell processing.
推荐
Wireless Base Station Controllers
The MPC8260AVVPJDB is commonly deployed in 2G/3G base station controllers where deterministic serial-channel behaviour and a robust PowerPC software ecosystem outweigh raw MHz. Its CPM offloads Abis/Abis-over-IP framing, while the G2 core runs the radio resource management (RRM) stack and OAM. The 480-TBGA package exposes enough I/O for several E1/T1 framers and an Ethernet backhaul. Designers value the long lifecycle support and the BSP maturity from NXP/Freescale, which simplifies regulatory and carrier acceptance. Pin-compatible upgrades to MPC8270/MPC8280 let operators scale capacity on the same board layout.
推荐
Industrial Control Routers
Industrial control routers benefit from the MPC8260AVVPJDB's combination of PowerPC determinism, multi-protocol serial, and extended-temperature silicon options. The chip routinely runs Profibus, Modbus, and CAN bridging stacks over its SCC array while sustaining GbE-class Ethernet routing via the FCCs. The 60x bus supports ECC SDRAM critical for fault-tolerant plant-floor deployments. Designers use it in substation gateways, SCADA masters, and protocol-conversion appliances where COTS ARM SoCs cannot match PowerQUICC's proven serial-channel reliability. The chip's decade-long installed base means maintenance contracts and spare stock are widely available.
推荐
Multi-Protocol Bridges and Gateways
The MPC8260AVVPJDB is a strong fit for protocol-bridging appliances that must terminate HDLC/PPP/Frame-Relay on one side and present Ethernet/IP on the other. The dedicated CPM performs framing on the WAN side at line rate while the G2 core handles routing tables and management protocols (SNMP, RADIUS, CLI). Its PCI bridge lets designers attach co-processors for crypto acceleration or hardware compression. Compared to a software-only bridge on a generic MPU, the integrated CPM reduces CPU load by 40-60% for typical WAN payloads, improving latency and power consumption.
推荐
Legacy Telecom Backplane Designs
The MPC8260AVVPJDB is widely used in legacy telecom backplanes - TDM cross-connects, SDH/SONET mux equipment, and PBX control blades - where its TDM-friendly SCC array and 60x expansion bus remain industry-standard. Carrier customers often mandate PowerQUICC II silicon to keep firmware certification valid, and the 480-TBGA delivers enough I/O for backplane glue logic. The chip supports legacy operating systems (VxWorks, pSOS, Green Hills INTEGRITY) which cannot easily be ported to newer ARM platforms. Its NRP/last-time-buy status makes it critical to qualify second-source inventory for maintenance contracts extending past 2030.
推荐
推荐产品汇总
工程参考数据： MPC8260AVVPJDB ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC8260AZUPJDB | MPC8250AZUPIBC | MPC8265AZUPIBC | MPC8270CVVUPEA | MPC8280CVVUPEA |
|---|---|---|---|---|---|---|
| Package | 480-TBGA (37.5x37.5) | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC G2, 32-bit | PowerPC G2, 32-bit | PowerPC G2, 32-bit | PowerPC G2, 32-bit | PowerPC G2, 32-bit | PowerPC G2, 32-bit |
| Bus Interface | 60x bus | 60x bus | 60x bus | 60x bus | 60x bus | 60x bus |
| Process Technology | 0.25 micrometer CMOS | 0.25 micrometer CMOS | 0.25 micrometer CMOS | 0.25 micrometer CMOS | 0.25 micrometer CMOS | 0.25 micrometer CMOS |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| RoHS Compliant | Yes (Lead Free Rev B) | Yes (no-Pb) | Yes | Yes | Yes | Yes |
| Drop-In Replacement Confidence | Reference | High (same die) | Medium (sibling variant) | Medium (firmware re-check) | Medium (ROM/BSP verification) | Lower (pinout differs, redesign risk) |
关键差异点
- Identical die, exact drop-in （对比 MPC8260AZUPJDB)
- Broader CPM than siblings （对比 MPC8250AZUPIBC)
- Field-proven PowerPC software ecosystem （对比 MPC8280CVVUPEA)
设计说明
Estimated: the 480-TBGA at 1.27 mm pitch on a 37.5 x 37.5 mm body requires an 8-layer PCB with 0.5-oz copper on outer layers and continuous GND planes beneath the BGA. Escape routing from the inner rows uses 0.2 mm (8 mil) traces with 0.2 mm spacing, laser-drilled microvias (0.1 mm), and via-in-pad for the inner-row balls. Plan for X-ray inspection at production because the BGAs are not visible after reflow. Match the 60x bus length within +/- 2.5 mm to preserve timing margin at 300 MHz; series-strike resistors on the clock pair reduce SSO. Follow the NXP PowerQUICC II Hardware Specifications layout checklist before committing Gerbers.
Power sequencing is critical: bring up the 3.3V I/O rail first, then the 2V core rail within the maximum delay window specified in the NXP PowerQUICC II Hardware Specifications document - reverse sequencing risks latch-up. Use a supervisor IC with independent channel control so POR is gated by the 2V rail reaching spec. Decoupling: 20-30 low-ESR ceramic caps (0.1 uF X7R minimum) directly under and around the BGA, plus 4 x 10 uF bulk tantalum/ceramic on each rail. Estimated quiescent power at 300 MHz is approximately 2-3W for the core alone - thermal relief must be designed for 4-5W worst case.
Estimated: at 300 MHz full activity the MPC8260 die dissipates roughly 3 W, so the 480-TBGA junction-to-ambient thermal resistance (theta_JA around 15-20 C/W on a standard 8-layer JEDEC test board) limits ambient operation to roughly 70-80 C. For industrial deployments target a 1-oz copper inner-plane stack with thermal vias under the die-pad BGA balls, and consider a heatsink with thermal interface material if the enclosure is sealed. Validate with a thermal probe on the top of the package during worst-case firmware load; the silicon does not throttle, so derate by design margin.
The 60x bus operates at 100 MHz with single-edge clocking; route address and data signals on adjacent inner layers with matched impedance (50 ohms +/- 10%) and keep stubs minimal. Clock traces need length matching to within 1 mm of the longest address line. For high-speed CPM serial channels (FCC, SCC) use controlled-impedance differential routing (100 ohms for FCC RMII/MII, 120 ohms for some E1/T1 modes) and isolate analog grounds. Reference the NXP application note AN-2587 and the PowerQUICC II Design Checklist for pin-group-specific routing rules.
Common pitfalls: (1) using a Rev A datasheet with a Rev B silicon - the JTAG BSDL and errata differ; (2) omitting the HRESET pull-up - the chip will not exit reset cleanly without it; (3) tying MODCK[0-3] to wrong values for the boot mode; (4) forgetting ECC enable on the SDRAM controller when ECC memory is fitted; (5) assuming lead-free Rev B drops into a board designed for leaded Rev A - both fit the same footprint but the solder profile is different. Always verify the top marking against the NXP product change notifications before release.
合规信息
RoHS compliant per DigiKey product page (DigiKey part 954928) and Digchip datasheet; lead-free 'NO-PB Rev B' variant per Digchip. AEC-Q100 not applicable for this industrial/telecom MPU. Halogen-free and conflict-minerals status not explicitly stated in verified data.