MPC8270VVUPEA - PowerQUICC II 450MHz MPU | NXP Semiconductors
料号： MPC8270VVUPEA ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $195 | $195.00 |
| 10 | $178.5 | $1,785.00 |
| 100 | $162 | $16,200.00 |
| 250 | $152 | $38,000.00 |
| 500 | $145 | $72,500.00 |
MPC8270VVUPEA 概述
A communications processor (also called a network processor or comms MPU) is a specialized microprocessor that offloads packet processing, DMA, and serial-protocol handling from a host CPU. Within the broader hierarchy, it sits under microprocessor IC -> MPU -> communications processor -> PowerQUICC family. The MPC8270 belongs to NXP/Freescale's MPC82xx family, designed for high-throughput I/O rather than general-purpose compute.
Key features include a 450 MHz G2_LE core with 16K instruction and 16K data L1 caches, dual 10/100 Mbps Ethernet MACs, PCI 2.2 interface (32-bit, 66 MHz capable), USB 1.1 host/slave, up to three FCCs supporting HDLC/UART/SPI, and a 60x-compatible system bus. The CPM (Communications Processor Module) provides hardware-accelerated protocol termination independent of the core.
The architecture uses a 0.13-micron HiP7 process with separate RISC engines for system control and protocol handling. The 480-TBGA package delivers the high pin count required for parallel system buses plus multiple serial interfaces, while supporting industrial-grade 0 to 105 degrees C operation.
Typical applications include WAN interface cards, DSLAM line cards, routers, wireless base-station controllers, and industrial embedded systems requiring integrated multi-protocol I/O with deterministic real-time response.
When laying out the 480-TBGA, allocate at least 4-layer PCB stack-up with continuous power and ground planes under the device; use matched-impedance routing for the 60x system bus and Ethernet MII/GMII signals. Decoupling must include low-ESR bulk caps at each VDDCORE island.
This page synthesizes distributor pricing, parametric context, and practical design considerations not aggregated elsewhere, helping sourcing engineers evaluate the MPC8270VVUPEA against modern SoC alternatives.
直接替换替代料： MPC8270VVUPEA ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPC8270VVUPEA （相同外形与封装尺寸） ——差异在于 Process Technology, Core Architecture, USB, Mounting Type, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
MPC8270CVVUPEA
✅ 直接替换📋 参考替代料（不在目录中）
MPC8280VVUPEA
✅ 直接替换✓ 有现货
$102.3 / 个
查看数据手册 →MPC8275VVUPEA
✅ 直接替换📋 参考替代料（不在目录中）
MPC8265AVVPIBC
✅ 直接替换✓ 有现货
$167.59 / 个
查看数据手册 →MPC8250AVVPIBC
✅ 直接替换✓ 有现货
$108.9 / 个
查看数据手册 →MPC8270VVUPEA 最大额定值与电气特性
| Core Architecture | PowerPC G2_LE |
| Core Count | 1 |
| 数据总线宽度 | 32 bit |
| 最大时钟频率 | 450 MHz |
| Performance | 885 MIPS |
| Instruction Cache | 16 KB L1 |
| Data Cache | 16 KB L1 |
| Ethernet | Dual 10/100 Mbps MAC |
| PCI Interface | PCI 2.2, 32-bit, up to 66 MHz |
| USB | USB 1.1 host/slave |
| Serial Protocols | HDLC, UART, SPI, I2C |
| 封装 | 480-TBGA (37.5 x 37.5 mm) |
| 安装类型 | Surface Mount |
| 工作温度 | 0C to +105C |
| Family | PowerQUICC II MPC82xx |
| System Bus | 60x-compatible |
| Process Technology | 0.13 um HiP7 |
MPC8270VVUPEA 480-tbga (37.5 x 37.5 mm) 引脚配置指南
MPC8270VVUPEA（480-tbga (37.5 x 37.5 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPC8270VVUPEA.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPC8270VVUPEA 适用于 6 应用s: WAN Interface Card / Router Line Card, DSLAM Line Card Controller, Wireless Base Station Controller, Industrial Embedded Controller, Network Attached Storage Controller, Print Imaging and Multi-Function Controller.
WAN Interface Card / Router Line Card
The MPC8270VVUPEA's dual 10/100 Ethernet MACs, PCI 2.2 interface, and hardware-accelerated HDLC channels make it purpose-built for WAN interface and router line-card designs. At 450 MHz (885 MIPS) the G2_LE core can sustain routing table updates plus CPM-driven packet processing across two Ethernet ports simultaneously. Placed as the main processor on a CompactPCI or AdvancedTCA line card, it manages PHY links, performs forwarding-plane encapsulation, and exposes a PCI host bus to a control-plane CPU. The integrated CPM offloads serial-protocol termination, freeing the core for control-plane software. Compared to a generic MPU with external MACs, the MPC8270 cuts BOM count by 4-6 chips and reduces PCB area by roughly 30 percent in typical line-card reference designs from the manufacturer datasheet.
推荐
DSLAM Line Card Controller
DSLAM line cards require deterministic multi-channel HDLC handling, ATM segmentation, and uplink aggregation - exactly the workload the MPC8270VVUPEA's CPM was designed for. With three FCCs supporting HDLC and UART, the device terminates DSL framing on multiple subscriber lines while presenting a single Ethernet or ATM uplink. Operating at 0 to 105C junction, it tolerates the thermal envelope of sealed outdoor enclosures and central-office rack chassis. The 16 KB instruction and 16 KB data L1 caches keep protocol-state access latency under 10 ns, which is critical for meeting DSL interleaving and latency budgets. The 480-TBGA footprint provides ample I/O for parallel DSL chipset glue-logic interfacing while the 60x system bus maintains 66 MHz throughput to companion framing ICs.
推荐
Wireless Base Station Controller
In 2G/3G wireless base-station controller cards, the MPC8270VVUPEA manages E1/T1 trunks, Abis signalling, and backhaul Ethernet concurrently. The PowerPC G2_LE core at 450 MHz handles O&M, while the CPM terminates HDLC framing on multiple T1/E1 links via the FCCs. USB 1.1 host connects to local storage or diagnostics, and PCI exposes the device to a baseband card for I/Q data path. The 0 to 105C operating range is essential for outdoor cabinet installations. Industrial-grade reliability, combined with hardware ECC on internal SRAM and a watchdog timer, supports the five-9 availability targets telecom operators require. Field-deployed units with this processor have demonstrated multi-year uptime in service-provider networks.
推荐
Industrial Embedded Controller
The MPC8270VVUPEA suits industrial embedded controllers requiring deterministic real-time response plus multi-protocol industrial I/O. Its PCI 2.2 interface accepts motion-control daughtercards; the FCCs drive RS-485 multi-drop industrial buses; SPI connects to ADC/DAC peripherals; and the 60x bus links to external SDRAM for large control-loop tables. At 885 MIPS the core sustains PID loops on dozens of axes while the CPM handles deterministic serial traffic without jitter. The 0 to 105C thermal envelope and BGA package reliability suit factory-floor controllers deployed in harsh environments. Industrial users value the long-term firmware stability of the PowerQUICC II architecture, where boot ROM and driver stacks have been hardened across multiple product generations.
推荐
Network Attached Storage Controller
The MPC8270VVUPEA can serve as the main controller in small-form-factor NAS appliances, where the dual Ethernet MACs handle LAN-side bonding and the PCI bus attaches to a SATA RAID controller. At 450 MHz, the G2_LE core runs the embedded NAS stack (typically Linux or VxWorks) while the CPM offloads iSCSI or NDMP protocol termination. USB 1.1 supports external backup drives or front-panel user interfaces. The 32-bit data bus and large address space accommodate up to 512 MB of attached SDRAM for filesystem caching. End-of-life status means new NAS designs should evaluate QorIQ or ARM-based successors, but the MPC8270 remains a viable drop-in for sustaining existing installed bases and contract-manufactured spares pools.
推荐
Print Imaging and Multi-Function Controller
High-end multi-function printers and production print engines historically used PowerQUICC II processors to manage scanner imaging pipelines, page rendering, and network protocol stacks. The MPC8270VVUPEA's PCI 2.2 interface accepts scanner ASIC front-ends, the FCCs drive serial control buses to the print engine, and dual Ethernet ports separate office LAN from service-network traffic. The 450 MHz core sustains 600 dpi image processing at rated engine speeds while the CPM handles background network protocol processing. Although newer designs use ARM SoCs, field-deployed enterprise MFPs continue to depend on MPC8270-class processors for spare-part replacement, justifying its retention in service depot inventory through 2026.
推荐
推荐产品汇总
工程参考数据： MPC8270VVUPEA ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC8270CVVUPEA | MPC8280VVUPEA | MPC8275VVUPEA | MPC8265AVVPIBC | MPC8250AVVPIBC |
|---|---|---|---|---|---|---|
| Package | 480-TBGA (37.5x37.5) | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA - same family | 480-TBGA - same family |
| Brand | NXP Semiconductors | NXP Semiconductors (Freescale legacy) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock Frequency | 450 MHz | 450 MHz | 450 MHz | 450 MHz | 300 MHz (-33%) | 300 MHz (-33%) |
| Performance (MIPS) | 885 MIPS | 885 MIPS | 885 MIPS | 885 MIPS | ~600 MIPS | ~600 MIPS |
| Ethernet MACs | Dual 10/100 | Dual 10/100 | Dual 10/100 | Dual 10/100 | Dual 10/100 | Single/Dual 10/100 |
| PCI Interface | PCI 2.2, 32-bit, 66 MHz | PCI 2.2, 32-bit, 66 MHz | PCI 2.2, 32-bit, 66 MHz | PCI 2.2, 32-bit, 66 MHz | PCI 2.2, 32-bit, 66 MHz | PCI 2.2, 32-bit, 66 MHz |
| ATM/UTOPIA Support | No | No | Yes (MPC8280 adds ATM) | No | Optional | No |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
关键差异点
- Highest available speed grade in the MPC8270 family （对比 MPC8265AVVPIBC)
- Cost-optimized vs MPC8280 for Ethernet-centric designs （对比 MPC8280VVUPEA)
- Integrated dual Ethernet MAC eliminates external bridge ICs （对比 Generic MPU without integrated MACs)
设计说明
The 480-TBGA package requires a minimum 4-layer PCB stack-up with continuous power and ground planes beneath the device. Estimated: with 1 oz copper outer layers and 0.5 oz inner planes, allocate at least 2 internal layers dedicated to GND plus 1 for VDDCORE to maintain power integrity at 450 MHz switching. Use a microvia or via-in-pad process if BGA pitch is below 1.0 mm; always follow the manufacturer recommended land pattern in the datasheet mechanical section.
Power dissipation at 450 MHz with both Ethernet ports active and three FCCs running reaches approximately 2.5 W typical. The 480-TBGA has a theta_JA in the 15-20 C/W range depending on PCB layout; estimated junction rise above 70C ambient is 50C, which exceeds the 105C max if airflow is absent. For sealed enclosures, add a heat spreader or thermal interface material bonded to the BGA top, or de-rate to a lower speed grade such as 333 MHz.
Route the 60x system bus with controlled impedance (typically 50 ohm single-ended to ground) and length-match data, address, and control signals within the timing skew budgets in the AC characteristics chapter. The PCI bus at 66 MHz demands similar treatment; Ethernet MII signals should be length-matched within 50 mils. Place series termination resistors as close as possible to the driver pin per the IBIS model recommendations in the manufacturer datasheet.
Do not assume MPC8270 family members are software-compatible without verification - the MPC8280 adds ATM registers that can confuse firmware written strictly for MPC8270 silicon. Also, the boot ROM configuration words differ between the C and V ordering codes; double-check the hardware reset configuration table in the reference manual before swapping a known-good board with an alternate MPN. End-of-Life parts often have hidden date-code variants; always verify against the manufacturer PCN history.
合规信息
RoHS, REACH, and lead-free status were not confirmed in the verified web data; consult NXP product compliance documentation directly. AEC-Q100 is not applicable as this is a communications processor, not an automotive-qualified IC.