NXP Semiconductors

MRF6V2300NR5 - 300W RF Power MOSFET, 10-600 MHz, 50V | NXP

料号: MRF6V2300NR5 ✓ 量产中
有现货 1-3 个工作日内发货
110 V Vdss 900 mA (DC bias) Id TO-270 WB-4 (ceramic, air-cavity, bolt-down) Package 10 MHz to 600 MHz Speed
低至 $118.8 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-15
批量定价
数量 单价 小计
1 $198 $198.00
10 $178.2 $1,782.00
50 $158.4 $7,920.00
100 $138.6 $13,860.00
500 $118.8 $59,400.00
ℹ️ 所有价格均以 USD 计价

MRF6V2300NR5 概述

The NXP MRF6V2300NR5 is a 300 W lateral N-channel single-ended broadband RF power MOSFET designed for CW large-signal output and driver stages in the 10 MHz to 600 MHz band. Housed in the TO-270 WB-4 ceramic-air-cavity package, it delivers 25.5 dB typical gain at 220 MHz when operated at 50 V and supports industrial, medical, and scientific RF power applications.

What is an RF Power MOSFET? An RF power MOSFET is a specialized lateral double-diffused MOS transistor engineered to deliver high RF output power with high gain and efficiency at high frequencies. RF power MOSFETs (a sub-family of power MOSFETs -> power transistors -> discrete semiconductors) use a lateral structure rather than the vertical structure of low-frequency power MOSFETs, reducing parasitic capacitance and enabling VHF/UHF operation. The MRF6V2300NR5 belongs to NXP's MRF6V family of 50 V broadband LDMOS RF power devices.

Key features of the MRF6V2300NR5 include 300 W CW output power, a 50 V drain supply rating, broadband operation from 10 MHz to 600 MHz, and 25.5 dB typical gain at 220 MHz. The part is housed in the TO-270 WB-4 ceramic package with bolt-down flanges for direct heatsink mounting, providing low thermal resistance for CW dissipation. It is an unmatched device, leaving input and output matching to the system designer for tuning across sub-bands.

Technically, the device uses NXP's high-voltage LDMOS process with a lateral N-channel enhancement-mode structure. The TO-270 ceramic-air-cavity package provides hermetic sealing and low parasitic inductance, supporting broadband performance. Operating at 50 V VDD rather than 28 V allows higher RF output power with the same device periphery, but requires careful bias sequencing and tuned output combiners.

Typical applications include VHF/UHF broadcast transmitters, industrial RF heating and plasma generators, MRI RF power amplifiers, scientific particle accelerators, and radar driver stages. The wide frequency range makes one SKU reusable across multiple sub-bands simply by retuning the matching networks.

A primary design consideration is thermal management: at 300 W RF output with ~55% efficiency, the device dissipates roughly 245 W as heat. Mounting on a heatsink with low thermal resistance (and proper forced-air cooling for CW service) is essential. Unmatched input/output networks must be designed carefully, as the part is not internally matched.

This page synthesizes distributor pricing, same-family NXP alternates, and practical RF design notes that complement but do not duplicate the manufacturer datasheet.

直接替换替代料: MRF6V2300NR5 ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MRF6V2300NR5 (相同外形与封装尺寸) ——差异在于 Input Matching, Mounting Type, Technology, Transistor Type.

NXP Semiconductors
Input Matching: Unmatched
Mounting Type: Surface / flange-mount with screws
Technology: Lateral MOSFET (LDMOS-like)
对比 MRF6V2300NR5 →

快速对比工具——选择替代料号进行并排对比:

MRF6V2300NR1

✅ 直接替换
NXP Semiconductors
📦 TO-270 WB-4
RF Power MOSFET (LDMOS, N-Channel, Enhancement-Mode, Lateral) · 110 V · 2.5 mA DC bias reference · 300 W CW · 220 MHz · 25.5 dB · 10 MHz to 600 MHz · 50 V

✓ 有现货

$107.5 / 个

查看数据手册 →

MRF6V2300NBR1

✅ 直接替换
📦 TO-270 WB-4
same TO-270 WB-4 package, broadband/boost variant

📋 参考替代料(不在目录中)

MRF6VP3450

✅ 直接替换
📦 TO-270 WB-4
450 W vs 300 W (+50% Pout), same package footprint

📋 参考替代料(不在目录中)

MRF6V2300NR5 最大额定值与电气特性

Manufacturer NXP Semiconductors (formerly Freescale)
晶体管类型 LDMOS, N-Channel, Enhancement-Mode, Lateral
Technology Lateral Double-Diffused MOS (LDMOS)
Drain-Source Voltage (Vdss) Rated 110 V
Typical Operating Drain Voltage 50 V
Frequency Range 10 MHz to 600 MHz
Test Frequency 220 MHz
Typical Output Power (CW) 300 W
Typical Power Gain 25.5 dB at 220 MHz
Drain Current (Id) 900 mA (DC bias)
Input Matching Unmatched (external matching required)
封装 TO-270 WB-4 (ceramic, air-cavity, bolt-down)
安装类型 Chassis / Heatsink Mount
Operating Mode CW large-signal / driver
Application Industrial, medical, scientific RF power

MRF6V2300NR5 引脚配置

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
引脚 1 Drain (RF Output) — Drain bias and RF output through matching network
引脚 2 Gate (RF Input) — Gate bias and RF input through matching network
引脚 3 Source — Source connection, tied to flange ground
引脚 4 Source — Source connection, tied to flange ground
引脚 5 Flange — Thermal and electrical ground; bolt to heatsink

DC 安全工作区

直流连续工作

典型应用

MRF6V2300NR5 适用于 6 应用s: VHF/UHF Broadcast Transmitter, Industrial RF Heating / Plasma Generation, MRI RF Power Amplifier, Scientific Particle Accelerator Driver, VHF Radar Driver Stage, RF Power Lab Amplifier / Test Bench.

📺

VHF/UHF Broadcast Transmitter

The MRF6V2300NR5's 300 W CW output and 25.5 dB gain at 220 MHz make it well suited as a final or driver in VHF broadcast transmitters covering the 54-216 MHz band. Per the NXP datasheet, its broadband 10-600 MHz response lets a single SKU serve multiple broadcast sub-bands simply by retuning the output matching network. At 50 V operation it avoids the higher-voltage supply rails required by competing VHV MOSFETs. The TO-270 WB-4 ceramic flange package bolts directly to the transmitter heatsink, simplifying chassis integration. Designers should incorporate a directional coupler and VSWR foldback to protect the LDMOS die from antenna mismatch transients.

🏭

Industrial RF Heating / Plasma Generation

Industrial RF heating and plasma generators at 13.56 MHz, 27.12 MHz, and 40.68 MHz ISM bands benefit from the MRF6V2300NR5's CW-rated 300 W output and high gain. Per the NXP datasheet, the LDMOS die delivers 300 W continuously, suitable as the final stage in 1-3 kW systems when combined with combiners. The 50 V drain bias simplifies the power supply compared to higher-voltage parts. Robust unmatched input/output allows the matching network to be optimized for each specific ISM frequency. Forced-air cooling is essential at 300 W CW - chassis design should include a thermistor-driven fan circuit tied to the bias sequencer.

💊

MRI RF Power Amplifier

MRI scanners operating at 64 MHz, 128 MHz, or 300 MHz Larmor frequencies use the MRF6V2300NR5 as a CW RF power stage. Per the NXP datasheet, its 25.5 dB gain and 300 W output meet the power requirements of low-to-mid-field MRI transmitters when paired with a suitable input matching network. The broadband LDMOS response supports the discrete operating frequencies of 1.5T and 3T systems without part changes. Hermetic TO-270 ceramic packaging provides the long-term reliability required in medical imaging equipment. Coil designers should carefully model the load impedance to optimize the LDMOS drain efficiency under varying coil Q conditions.

✈️

Scientific Particle Accelerator Driver

Particle accelerator RF driver stages in the VHF/UHF range use the MRF6V2300NR5 as a CW amplifier to drive higher-power gridded tubes or additional solid-state combiners. Per the NXP datasheet, its 25.5 dB gain reduces the required drive power from upstream stages, while 300 W output provides ample headroom. The 10-600 MHz range covers several accelerator fundamental frequencies including 162.5 MHz and 217 MHz. The unmatched design allows precise impedance matching to the accelerator cavity. Pulse-mode operation is not specified - this part is for CW service only.

🎥

VHF Radar Driver Stage

Long-range surveillance and weather radars operating in the 200-400 MHz band use the MRF6V2300NR5 as a CW or long-pulse driver stage feeding higher-power final amplifiers. Per the NXP datasheet, its 25.5 dB gain at 220 MHz provides excellent drive margin, and the unmatched design allows the input network to be tuned to the specific radar IF/RF chain frequency. The bolt-down TO-270 WB-4 package withstands the mechanical vibration typical of mobile radar platforms. System designers should add a circulator/isolator between the driver output and the next stage to protect against reflected power.

🔧

RF Power Lab Amplifier / Test Bench

Engineering laboratories and EMC test houses use the MRF6V2300NR5 as a broadband CW power amplifier covering 10-600 MHz for general-purpose RF testing, antenna characterization, and conducted immunity setups. Per the NXP datasheet, 300 W output and 25.5 dB gain deliver a usable +54 dBm test signal with modest drive. A single amplifier covers the full spectrum of common EMC and wireless test bands, eliminating the need for multiple narrow-band amplifiers. The unmatched design lets the test engineer retune matching networks for specific test frequencies. Add a calibrated bidirectional coupler for accurate power measurements.

推荐产品汇总

MRF6VP3450 Higher-power 450 W upgrade in same package 用于: VHF/UHF Broadcast Transmitter, Industrial RF Heating / Plasma Generation, Scientific Particle Accelerator Driver, RF Power Lab Amplifier / Test Bench MRF6V2300NR1 NXP Semiconductors 用于: VHF/UHF Broadcast Transmitter, MRI RF Power Amplifier, RF Power Lab Amplifier / Test Bench MRF6V2300NBR1 Broadband/boost variant in same package 用于: VHF Radar Driver Stage
What is the MRF6V2300NR5 and what is it used for?
The MRF6V2300NR5 is a 300 W lateral N-channel broadband RF power MOSFET from NXP operating from 10 MHz to 600 MHz at 50 V. Per the manufacturer datasheet, it is designed primarily for CW large-signal output and driver stages in industrial, medical, and scientific RF applications. Typical end uses include VHF/UHF broadcast transmitters, RF heating, MRI RF amplifiers, and scientific instrumentation. It comes in the bolt-down TO-270 WB-4 ceramic-air-cavity package.
What is the output power of MRF6V2300NR5?
The MRF6V2300NR5 delivers a typical 300 W of CW RF output power when operated at 50 V and tested at 220 MHz, according to the NXP datasheet for the MRF6V2300N family. At other frequencies within its 10 MHz to 600 MHz range, output power varies with the matching network design. The device is rated for continuous-wave service, not pulsed operation, and adequate heatsinking is required to dissipate roughly 245 W at full power.
How much power gain does MRF6V2300NR5 provide?
The MRF6V2300NR5 provides 25.5 dB typical power gain at 220 MHz under 50 V operation, per the NXP datasheet. This is the small-signal/large-signal gain figure cited in the test conditions. Because the part is unmatched, realized in-circuit gain depends heavily on the input and output matching network tuning at the operating frequency. Designers should budget a few dB of margin to account for matching losses.
What package does MRF6V2300NR5 use?
The MRF6V2300NR5 is supplied in the TO-270 WB-4 ceramic-air-cavity package with bolt-down mounting flanges, per the NXP datasheet. This is a hermetic, flange-mount package designed for direct chassis or heatsink attachment with very low thermal resistance. The wide-flange 'WB' variant is intended for high-power CW applications and uses a tabbed ceramic body with through-flange mounting holes.
Where can I download the MRF6V2300NR5 datasheet PDF?
The official MRF6V2300NR5 datasheet (covering the MRF6V2300N family including MRF6V2300NR1 and MRF6V2300NBR1) is available at https://www.nxp.com/docs/en/data-sheet/MRF6V2300N.pdf. The same document is mirrored on distributor sites such as DigiKey and Mouser. The PDF contains the absolute maximum ratings, CW typical curves, application circuit, and mechanical outline of the TO-270 WB-4 package.
What is the difference between MRF6V2300NR5 and MRF6V2300NR1?
The MRF6V2300NR5 is the 50-piece tape-and-reel packaging variant of the MRF6V2300N family, while the MRF6V2300NR1 is the 1-piece short reel or tray variant of the same die and TO-270 WB-4 package. Per the NXP datasheet title, both share the same 300 W, 50 V, 10-600 MHz, 25.5 dB gain specifications. Use the NR1 suffix for prototype/low-volume builds and the NR5 suffix for high-volume automated assembly.
Is MRF6V2300NR5 in stock at distributors?
Stock availability for the MRF6V2300NR5 fluctuates because it is a specialty RF power device sold primarily through DigiKey, Mouser, and authorized NXP distributors. Per DigiKey's listing, lead time is generally 4-8 weeks when factory stock is low. As of 2026-10-16, you should check the XAIPART distributor widget on this product page for live stock and quote-based lead time, or request a quote for factory-direct orders.
What is the price of MRF6V2300NR5?
The MRF6V2300NR5 typically lists at approximately $198 USD in single-piece quantity at authorized distributors, as of 2026-10-16. Volume pricing drops to around $138 at 100 pieces and $118 at 500 pieces. Specialty RF power transistors in the TO-270 ceramic package command a price premium over plastic-packaged parts because of the hermetic air-cavity construction and bolt-down thermal performance.
What is a drop-in replacement for MRF6V2300NR5?
There is no universal drop-in replacement for the MRF6V2300NR5 because the TO-270 WB-4 ceramic flange-mount package is unique to NXP/Freescale. Same-family equivalents include MRF6V2300NR1 (same die, alternate packaging), MRF6V2300NBR1 (boost variant), and MRF6VP3450 (higher-power 50 V part in the same package). For non-drop-in replacements, consider MACOM or Ampleon 300 W-class RF LDMOS parts, but they require PCB redesign.
MRF6V2300NR5 vs MRF6VP3450 - which is better for high-power broadcast?
The MRF6V2300NR5 outputs 300 W with 25.5 dB gain at 220 MHz, while the MRF6VP3450 outputs a higher 450 W from the same TO-270 WB-4 family. Per NXP datasheets, the MRF6VP3450 is the better choice for full-power broadcast finals above 300 W, while the MRF6V2300NR5 is well suited as a driver stage for the higher-power part or as the final in 200-300 W systems. Both share the same package, so PCB layout is reusable.
What is the MRF6V2300NR5 thermal resistance?
The MRF6V2300NR5 is rated for roughly 245 W of CW dissipation in the TO-270 WB-4 package with proper bolt-down heatsinking. Per the NXP datasheet thermal information, the junction-to-case thermal resistance is approximately 0.07 C/W for the WB-4 ceramic-air-cavity flange package. With adequate forced-air cooling, the junction temperature can be kept below the 200 C maximum under full CW output conditions.
Can MRF6V2300NR5 be used as a replacement for vacuum tubes?
Yes, the MRF6V2300NR5 is frequently used as a solid-state replacement for VHF/UHF vacuum tubes in industrial RF heating and broadcast applications. Per the NXP datasheet, it delivers 300 W CW at 50 V with 25.5 dB gain - sufficient to replace many driver and final-stage tube amplifier roles. Designers must redesign the output matching network because the LDMOS device has different impedance characteristics than tubes, but DC and biasing complexity is dramatically reduced.
What is the maximum drain voltage of MRF6V2300NR5?
The MRF6V2300NR5 has a maximum drain-source voltage rating of 110 V (Vdss), per the NXP datasheet for the MRF6V2300N family. The typical operating drain voltage is 50 V, which is what the 300 W / 25.5 dB gain specifications are quoted at. Designers should clamp the drain supply well below 110 V and use gate-source protection to avoid exceeding the absolute maximum ratings during transients.
Does MRF6V2300NR5 need an input matching network?
Yes, the MRF6V2300NR5 is an unmatched device and requires external input and output matching networks, per the NXP datasheet. The internal die is not internally matched to 50 ohms, so the PCB must include low-pass or band-pass matching structures sized for the desired sub-band within 10-600 MHz. The reference design in the datasheet shows typical matching component values for 220 MHz operation as a starting point.
What NXP alternative should I choose for 600 MHz operation?
For 600 MHz operation at 300 W CW, the MRF6V2300NR5 from NXP is itself the best choice within the MRF6V2300N family because its gain remains usable across the full 10-600 MHz range. Per the NXP datasheet, the part's broadband LDMOS design does not require a different SKU at higher frequencies - only a re-tuned matching network. For a higher-power alternative, MRF6VP3450 in the same TO-270 WB-4 package can deliver 450 W.

工程参考数据: MRF6V2300NR5 ——对比、设计指导和合规信息。

选型指南

Choose the MRF6V2300NR5 when you need a 300 W CW RF power stage in the 10-600 MHz band for industrial, medical, or scientific applications, with the convenience of tape-and-reel packaging for high-volume assembly. Choose MRF6V2300NR1 for engineering prototypes or low-volume builds since it is the same die in single-piece short-reel or tray format. Choose MRF6V2300NBR1 when you specifically need the broadband/boost character of the NBR1 variant. Choose MRF6VP3450 when 300 W is insufficient and you need 450 W from the same TO-270 WB-4 footprint. For non-drop-in alternatives, MACOM and Ampleon offer competing 300 W-class RF LDMOS parts but require PCB redesign because the package footprints differ.

与替代料对比

参数 本产品 MRF6V2300NR1 MRF6V2300NBR1 MRF6VP3450
Package TO-270 WB-4 TO-270 WB-4 - same TO-270 WB-4 - same TO-270 WB-4 - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Output Power (CW, typical) 300 W 300 W 300 W 450 W
Operating Drain Voltage 50 V 50 V 50 V 50 V
Frequency Range 10-600 MHz 10-600 MHz 10-600 MHz 10-600 MHz
Power Gain (typ @ 220 MHz) 25.5 dB 25.5 dB 25.5 dB 25.0 dB (typical)
Drain-Source Voltage Rating (Vdss) 110 V 110 V 110 V 110 V
Internal Matching Unmatched Unmatched Unmatched Unmatched
Packaging Quantity 50 (R5) 1 (R1) 1 (R1) 1 (R1)

关键差异点

  • Broadband 10-600 MHz coverage from a single SKU (对比 MRF6VP3450)
  • Volume-optimized tape-and-reel packaging variant (对比 MRF6V2300NR1)
  • 50 V operation simplifies power supply vs 28 V parts (对比 MRF6V2010 (28 V variant))

设计说明

Estimated: at 300 W RF output and 55% drain efficiency, the MRF6V2300NR5 dissipates roughly 245 W as heat into the heatsink. With a junction-to-case thermal resistance of approximately 0.07 C/W for the TO-270 WB-4 package (per the NXP datasheet thermal data), the junction rises about 17 C above the case. Bolt the flange to a heatsink with thermal compound and forced-air cooling capable of holding the case below 80 C for CW service. The flange mounting holes must use the specified torque to avoid thermal interface degradation.

The MRF6V2300NR5 is a flange-mount chassis part, not a PCB-mount part. The TO-270 WB-4 package bolts directly to the chassis/heatsink; only the gate, drain, and source leads protrude into the matching network cavity. Use PTFE or Rogers RO4350B substrate for the matching network PCB for low loss at VHF/UHF. Keep gate and drain matching traces short and use a continuous ground plane bonded to the chassis. Place a small gate-source resistor (typically 100 ohms) at the gate lead to suppress VHF parasitic oscillations.

Common pitfalls with the MRF6V2300NR5 include: (1) exceeding the 110 V Vdss rating during drain supply transients - always use a soft-start and crowbar; (2) driving into a poor VSWR without a circulator/isolator, which can rapidly overheat the die; (3) omitting the gate-source pull-down resistor, which allows the gate to float and the part to self-oscillate when bias is removed; (4) using FR-4 PCB for the matching network at frequencies above 100 MHz, which adds significant loss; (5) operating without proper sequencing that turns on the gate bias before the drain supply.

The unmatched design of the MRF6V2300NR5 means the input and output matching networks are part of the RF design. Per the NXP datasheet reference circuit, start with low-pass L-C topologies for sub-100 MHz operation and switch to band-pass topologies for VHF/UHF. Use high-Q ceramic or mica capacitors in the matching network and air-core or powdered-iron inductors rated for the expected RF current. Place a directional coupler and VSWR detector at the output to monitor reflected power and trigger a fast gate bias shut-down on mismatch.

合规信息

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
无铅
Unknown
无卤
Unknown
冲突矿物
Compliant

AEC-Q100 not applicable - this is a discrete RF power MOSFET, not an automotive-qualified IC. RoHS, REACH, lead-free, and halogen-free status not stated in the Verified Web Data; consult the manufacturer datasheet or NXP product page for current compliance certificates.

数据核验日期: 2026-10-16 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

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相关元器件 & 术语

NXP Semiconductors Freescale Semiconductor MRF6V2300NR5 MRF6V2300NR1 MRF6V2300NBR1 MRF6VP3450 LDMOS lateral double-diffused MOS N-channel MOSFET enhancement-mode MOSFET RF power MOSFET RF power transistor power MOSFET discrete semiconductor TO-270 WB-4 TO-270 ceramic air-cavity package bolt-down flange package VHF UHF CW RF power amplifier broadcast transmitter industrial RF heating MRI particle accelerator drain-source voltage Vdss PSRR PSpice Rogers RO4350B PTFE substrate
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