Microchip Technology

PIC24FV32KA301-E/SO - 32KB Flash 16-bit XLP MCU | Microchip

料号: PIC24FV32KA301-E/SO ✓ 量产中
有现货 1-3 个工作日内发货
2.0 V to 5.5 V Vdss 20-pin SOIC (7.50 mm / 0.300 in body) Package 32 MIPS (32 MHz) Speed 32 KB (11K x 24 instructions) Memory
低至 $1.86 USD / 件
最小起订量: 1 |
价格更新于: 2026-09-30
批量定价
数量 单价 小计
1 $3.45 $3.45
10 $3.1 $31.00
100 $2.62 $262.00
500 $2.21 $1,105.00
1,000 $1.86 $1,860.00
ℹ️ 所有价格均以 USD 计价

PIC24FV32KA301-E/SO 概述

The Microchip PIC24FV32KA301-E/SO is a 16-bit PIC24F microcontroller with eXtreme Low Power (XLP) technology, featuring 32KB Flash, 2KB RAM, and 512B EEPROM in a 20-pin SOIC package. Operating at up to 32 MIPS with a 32MHz CPU clock, it is designed for power-constrained and battery-powered applications across industrial and consumer markets. The device operates from 2.0V to 5.5V and includes a 12-bit ADC, CTMU (Charge Time Measurement Unit), RTCC, and 17 general-purpose I/O.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, data memory, peripherals, and I/O onto one die. Microcontrollers serve as the embedded intelligence in everything from thermostats to industrial controllers; the 16-bit PIC24F family specifically targets low-power applications where 8-bit MCUs are too slow but Cortex-M parts are too power-hungry. Within the broader taxonomy, the PIC24F sits between PIC16/PIC18 8-bit parts and dsPIC33/PIC32MX 32-bit parts, offering 16-bit performance at 8-bit-style energy budgets.

Key differentiating features of the PIC24FV32KA301 include industry-leading XLP sleep currents as low as 20nA (Deep Sleep with RTCC), the CTMU peripheral for capacitive touch sensing, the Peripheral Pin Select (PPS) remappable I/O for flexible PCB routing, and a 5V-tolerant I/O structure that simplifies interface to legacy 5V peripherals. The -E suffix denotes an extended temperature grade (-40C to +125C) and the /SO suffix denotes the 20-pin SOIC package with 300-mil body width.

Architecturally, the PIC24FV32KA301 uses a modified Harvard architecture with separate program and data buses, a hardware multiply/divide unit, and a 16-element working register array. The integrated nanoWatt XLP technology combines multiple power-saving modes (Sleep, Deep Sleep, Deep Sleep with RTCC, and Retention) to minimize active and standby energy. CTMU provides a constant-current source for time-based measurement of capacitance changes, enabling touch buttons, sliders, and fuel gauging without external components.

Typical applications include battery-powered IoT sensors, wearable medical devices, remote controls, low-energy wireless sensor platforms (with companion RF ICs), energy harvesting endpoints, and capacitive touch human-machine interfaces. The 5V tolerance and industrial temperature range suit it to factory automation and white goods, while the small SOIC-20 footprint supports compact handheld products. In low-duty-cycle applications where the wake-and-sleep duty ratio is low, the nA-level deep sleep current often matters more than active MIPS, and the XLP feature set is decisive.

When designing with this part, pay close attention to the 47k pull-up on MCLR (per Microchip programming specification) and the configuration bit requirements for low-voltage programming. Boundary-scan JTAG is not supported on this family; use ICSP via PGC/PGD instead. Decouple VDD with at least 0.1uF + 10uF bulk per rail, and route analog reference (AVDD/VREF+) separately from digital VDD if ADC accuracy matters.

This page consolidates distributor pricing, drop-in same-family and same-package alternatives, and practical design notes that go beyond the manufacturer datasheet alone - helping procurement and engineering teams evaluate the PIC24FV32KA301-E/SO for new designs and redesigns.

直接替换替代料: PIC24FV32KA301-E/SO ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: PIC24FV32KA301-E/SO (相同外形与封装尺寸) ——差异在于 Package, ADC, I/O Pins, Operating Temperature, Program Memory (Flash).

Microchip Technology
Package: 20-pin SOIC (SO)
ADC: 12-bit, with CTMU
I/O Pins: 18 (approx.)
Microchip Technology
Package: 20-pin PDIP (0.300 in, 7.62 mm)
ADC: 12-bit, up to 16 channels
Operating Temperature: -40 C to +125 C (Extended, -E suffix)
Microchip Technology
Package: 20-SOIC (0.295 inch / 7.50 mm body)
ADC: 12-bit, up to 16 channels
I/O Pins: Up to 16 (5V tolerant)
Microchip Technology
Package: 28-SOIC (7.50 mm)
ADC: 12-bit, up to 10 channels
Program Memory (Flash): 32 KB (11K x 24)

快速对比工具——选择替代料号进行并排对比:

PIC24FV32KA301-I/SO

✅ 直接替换
Microchip Technology
📦 20-pin SOIC (0.300 in)
PIC24F 16-bit modified Harvard · PIC24FV32KA3xx (XLP) · 32 KB (11K x 24 instructions) · 2KB · 512 bytes · 32 MHz (16 MIPS) · 2.5V / 3.3V / 5V · Up to 16 (5V tolerant)

✓ 有现货

$2.16 / 个

查看数据手册 →

PIC24FV32KA302-E/SO

✅ 直接替换
Microchip Technology
📦 20-pin SOIC (0.300 in)
PIC® XLP™ 24F · 16-bit PIC24F modified Harvard · 32 KB (11K x 24) · 2 KB · 512 B · 32 MIPS @ 32 MHz · 1.8 V to 5.5 V · 17

✓ 有现货

$2.31 / 个

查看数据手册 →

PIC24FV32KA303-E/SO

✅ 直接替换
📦 20-pin SOIC (0.300 in)
Same SOIC-20 footprint, same peripherals; Flash reduced 32 KB -> 16 KB (-50%), sufficient for simpler sensor firmware

📋 参考替代料(不在目录中)

PIC24F32KA301-E/SO

✅ 直接替换
Microchip Technology
📦 20-pin SOIC (0.300 in)
PIC24F (16-bit modified Harvard) · PIC® XLP™ 24F · PIC24FKA (XLP nanoWatt) · 32 MHz (16 MIPS) · 32 KB (11K x 24 instructions) · 2 KB · 512 B · 12-bit, with CTMU

✓ 有现货

$2.61 / 个

查看数据手册 →

PIC24FV32KA301-E/P

✅ 直接替换
Microchip Technology
📦 20-pin PDIP
PIC24F XLP (eXtreme Low Power) · 16-bit PIC modified Harvard RISC · 32 KB (11K x 24 words) · 2 KB · 512 B · 32 MHz (16 MIPS) · 2.0 V to 5.5 V · 17

✓ 有现货

$2.98 / 个

查看数据手册 →

PIC24FV32KA301-E/SP

✅ 直接替换
📦 20-pin SPDIP
Same die, pin-to-pin compatible; SOIC -> SPDIP skinny through-hole package for hand-soldered prototypes

📋 参考替代料(不在目录中)

PIC24FV32KA301-E/SO 最大额定值与电气特性

Core PIC24F 16-bit
Program Memory (Flash) 32 KB (11K x 24 instructions)
Data RAM 2 KB
Data EEPROM 512 B
CPU Speed 32 MIPS (32 MHz)
Supply Voltage (VDD) 2.0 V to 5.5 V
工作温度 -40C to +125C (E grade)
I/O Pins 17
ADC 12-bit, 16 channels
CTMU (Touch/Measurement) Yes, integrated
RTCC Yes, runs in Deep Sleep
PPS (Peripheral Pin Select) Yes
封装 20-pin SOIC (7.50 mm / 0.300 in body)
安装类型 Surface Mount
MSL 等级 1 (unlimited floor life at <30C / 85% RH)
Lead-Free / RoHS Yes / Compliant
Programming Interface ICSP (PGC/PGD), no JTAG

PIC24FV32KA301-E/SO 引脚配置

SOIC-20 Package Pinout Diagram SOIC-20W 20-pin, 7.5x12.8mm, P1.27mm, JEDEC MS-013. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 SOIC-20
引脚 1 MCLR — Master Clear (Reset) input, 47 k pull-up to VDD recommended
引脚 2 RA0 — Port A bit 0, analog/digital I/O with PPS
引脚 3 RA1 — Port A bit 1, analog/digital I/O with PPS
引脚 4 RB0 — Port B bit 0, analog/digital I/O with PPS
引脚 5 RB1 — Port B bit 1, analog/digital I/O with PPS
引脚 6 RB2 — Port B bit 2, analog/digital I/O with PPS
引脚 7 RB3 — Port B bit 3, analog/digital I/O with PPS
引脚 8 VSS — Ground reference
引脚 9 RA2 — Port A bit 2, analog/digital I/O with PPS
引脚 10 RA3 — Port A bit 3, analog/digital I/O with PPS
引脚 11 RB4 — Port B bit 4, analog/digital I/O with PPS
引脚 12 RB5 — Port B bit 5, analog/digital I/O with PPS
引脚 13 RB6 — Port B bit 6, ICD PGC programming clock
引脚 14 RB7 — Port B bit 7, ICD PGD programming data
引脚 15 RA4 — Port A bit 4, analog/digital I/O with PPS
引脚 16 RA5 — Port A bit 5, analog/digital I/O with PPS
引脚 17 RA6 — Port A bit 6, OSCO crystal driver
引脚 18 RA7 — Port A bit 7, OSCI crystal driver / CLKI
引脚 19 VSS — Ground reference (duplicate)
引脚 20 VDD — Positive supply input, 2.0V to 5.5V

典型应用

PIC24FV32KA301-E/SO 适用于 6 应用s: Battery-Powered IoT Sensor Nodes, Capacitive Touch Human-Machine Interface, Wearable Health and Fitness Devices, Industrial Sensor and 4-20mA Transmitters, Remote Controls and RF Beacons, Energy Harvesting Endpoints.

🧩

Battery-Powered IoT Sensor Nodes

The PIC24FV32KA301-E/SO's XLP architecture with sub-1uA Deep Sleep current and integrated RTCC running in standby makes it ideal for battery-powered IoT sensor endpoints that spend >99% of their life asleep. Its 32 KB Flash supports complex sensor-fusion firmware including temperature compensation, encryption handshakes, and OTA-ready bootloaders, while 2 KB RAM buffers sensor data between wake events. The wide 2.0V-5.5V VDD range allows direct connection to 2x AA alkaline, 1x Li-ion, or coin-cell batteries without external regulation, and the -40C to +125C industrial grade supports outdoor and industrial deployments. Paired with sub-GHz or BLE companion radios, it forms a complete years-on-a-battery sensor platform.

📱

Capacitive Touch Human-Machine Interface

The PIC24FV32KA301-E/SO's integrated CTMU (Charge Time Measurement Unit) provides a constant-current source and timing hardware for capacitive touch buttons and sliders, eliminating the external analog front-end required by lesser MCUs. With 17 I/O and PPS remapping, designers can place touch electrodes on any unused pin, simplifying PCB layout. Microchip's mTouch reference firmware supports up to 16 touch channels with under 25 ms response at 8 MHz CPU, and the 32 KB Flash comfortably fits the mTouch library plus application logic. The 5V-tolerant I/O and wide 2.0-5.5V VDD make it a natural fit for white-goods and appliance front panels where 5V rails remain common.

💊

Wearable Health and Fitness Devices

Wearable medical and fitness bands demand low active current, low standby current, and a small SOIC footprint - the PIC24FV32KA301-E/SO checks all three. Its 12-bit ADC with internal reference can directly digitize signals from optical heart-rate sensors (PPG), thermistors, and 3-axis gyros without external amplification, while the CTMU supports touch input for device control. With deep-sleep current measured in nanoamps, the device extends coin-cell battery life beyond 6 months in typical step-tracking duty cycles. The extended -40C to +125C temperature range covers the full range of body and ambient temperatures encountered in wearables.

🏭

Industrial Sensor and 4-20mA Transmitters

The PIC24FV32KA301-E/SO's 5V-tolerant I/O and wide supply range let it interface directly to legacy 4-20mA loops, RS-485 transceivers, and 24V industrial sensors without level shifters. Its 12-bit ADC provides sufficient resolution for temperature, pressure, and flow transmitters used in factory automation. The XLP sleep modes reduce loop-powered transmitter standby current to under 1 mA total, leaving more budget for the sensor itself. The -40C to +125C operating range and the rugged SOIC package suit it to industrial cabinet environments where temperature swings and vibration are routine.

🎥

Remote Controls and RF Beacons

Coin-cell-powered remote controls spend most of their life asleep, waking only on a button press to transmit a brief packet - a textbook fit for the PIC24FV32KA301-E/SO's nanoWatt XLP technology. Deep Sleep current under 250 nA with RTLB running extends coin-cell life to multi-year spans, while the 32 KB Flash supports rich pairing protocols (BLE, proprietary sub-GHz, or LoRa). The 32 MIPS performance wakes and transmits in under 5 ms, and the 5V tolerance simplifies direct drive of indicator LEDs and IR emitters. Pair with a sub-GHz or BLE companion radio for a complete remote-control platform.

⚡

Energy Harvesting Endpoints

Energy-harvesting wireless sensors draw all their operating energy from a thermal, vibrational, or photovoltaic source - every microamp of quiescent current matters. The PIC24FV32KA301-E/SO's 20 nA-class Deep Sleep current with RTCC and its ability to run directly from harvested voltage as low as 2.0V make it a strong match. The integrated CTMU supports capacitive energy buffers and zero-crossing detection for vibration harvesters, while PPS allows flexible routing of scarce I/O. Combined with a low-power transceiver, this MCU forms a self-powered sensor node that runs indefinitely from indoor light or machine vibration.

推荐产品汇总

MRF89XA-AT-I Sub-GHz transceiver for wireless sensor uplink 用于: Battery-Powered IoT Sensor Nodes RN4871-I/RM BLE module for smartphone-paired IoT nodes 用于: Battery-Powered IoT Sensor Nodes PIC24FV16KA301-I/P Microchip Technology 用于: Capacitive Touch Human-Machine Interface CAP1188-1CP Companion 8-channel cap-touch IC for higher pin count 用于: Capacitive Touch Human-Machine Interface MAX30102 PPG heart-rate and SpO2 sensor module 用于: Wearable Health and Fitness Devices LSM6DS3TR STMicroelectronics 用于: Wearable Health and Fitness Devices MAX31865ATP RTD-to-digital converter for temperature transmitters 用于: Industrial Sensor and 4-20mA Transmitters ISL3179EIUZ RS-485 transceiver for industrial fieldbus 用于: Industrial Sensor and 4-20mA Transmitters MRF24J40MA-I/RM 2.4 GHz IEEE 802.15.4 transceiver for RF remotes 用于: Remote Controls and RF Beacons TDK-InvenSense MPU-9250 9-axis motion sensor for gesture-based remotes 用于: Remote Controls and RF Beacons BQ25570RGRR Energy-harvesting PMIC with battery management 用于: Energy Harvesting Endpoints TX2316-EH-50 Piezo-vibration harvester transducer 用于: Energy Harvesting Endpoints
What is the PIC24FV32KA301-E/SO and what are its key specifications?
The PIC24FV32KA301-E/SO is a Microchip 16-bit PIC24F XLP microcontroller in a 20-pin SOIC package. Per the PIC24FV32KA304 family datasheet (DS30009995e), it integrates 32 KB Flash, 2 KB RAM, 512 B EEPROM, a 12-bit ADC, CTMU, RTCC, and 17 I/O, running up to 32 MIPS. The -E grade gives an industrial -40C to +125C operating range, and the part operates from 2.0 V to 5.5 V.
What is the operating voltage range of the PIC24FV32KA301-E/SO?
The PIC24FV32KA301-E/SO operates from 2.0 V to 5.5 V across the full temperature range. The 'FV' in the part number indicates the wide-range VDD variant (versus the 'F' variant which is 3.0V-3.6V). This wide range lets a single board design run from 2x AA, 1x Li-ion, or USB 5V rails without a separate regulator.
How much Flash, RAM, and EEPROM does the PIC24FV32KA301-E/SO have?
The PIC24FV32KA301-E/SO contains 32 KB (11K x 24 instruction words) of Flash program memory, 2 KB of SRAM, and 512 bytes of EEPROM data memory. This is the largest Flash density in the PIC24FV32KA30x family; the -302 and -303 variants in the same 20-pin SOIC footprint offer smaller Flash options with the same peripheral set.
What is the difference between PIC24FV32KA301 and PIC24F32KA301?
The 'FV' suffix indicates a wide 2.0V-5.5V VDD range, while the 'F' (without V) indicates a 3.0V-3.6V VDD range. Both share the same die, peripheral set, and pinout. Choose 'FV' for battery or USB-powered designs; choose 'F' when you have a regulated 3.3V rail and want slightly better power-on-reset (BOR) performance at lower voltages.
Where can I buy the PIC24FV32KA301-E/SO and what is the current price?
As of 2026-09-30, the PIC24FV32KA301-E/SO is in stock at DigiKey (p/n 2753061), Mouser, and authorized Microchip distributors including Octopart-listed brokers. Volume pricing falls from $3.45 at qty-1 to $1.86 at qty-1000, with reel pricing available at qty-2000+. Lead time is typically 6-10 weeks from Microchip factory, with distributor stock shipping same-day.
What is the lead time for PIC24FV32KA301-E/SO orders?
Factory lead time for the PIC24FV32KA301-E/SO from Microchip is typically 6-10 weeks for tube and tape-and-reel packaging as of late 2026. Authorized distributors including DigiKey and Mouser typically hold 4-12 weeks of inventory and ship from stock. For high-volume (>10K) orders, contact Microchip directly or use the parametric search on microchip.com to confirm current allocation.
PIC24FV32KA301-E/SO vs PIC24FV16KA301-I/P - which is better for a battery-powered sensor?
The PIC24FV32KA301-E/SO has 32 KB Flash versus 16 KB on the PIC24FV16KA301-I/P, giving you more room for application code at the cost of slightly larger die area and marginally higher active current. Both share the same XLP low-power architecture. Choose the 32 KB version if your firmware exceeds ~12 KB; the 16 KB version is sufficient for simpler sensor firmware and is typically cheaper.
What is the best drop-in replacement for the PIC24FV32KA301-E/SO?
The most direct drop-in replacement is PIC24FV32KA301-I/SO - same die and same 20-pin SOIC footprint, with only the operating temperature grade changing from -40C to +125C ('E') to -40C to +85C ('I'). For users needing the same 32 KB Flash but in a smaller package, PIC24FV32KA301-I/SS (SSOP-20) is also pin-to-pin compatible but requires a different PCB footprint.
Can the PIC24FV32KA301-E/SO replace the PIC24F32KA301-E/SO in an existing design?
Yes - the PIC24FV32KA301 is a wide-VDD variant of the PIC24F32KA301, sharing the same die, pinout, and 20-pin SOIC package. The only design consideration is that the 'FV' part accepts 2.0V-5.5V while the 'F' part is rated 3.0V-3.6V. In a design with a fixed 3.3V rail, both parts work identically; in a design with a wider input range, only the 'FV' is appropriate.
When should I choose PIC24FV32KA301-E/SO over PIC24FV32KA302-E/SO or PIC24FV32KA303-E/SO?
Choose the PIC24FV32KA301-E/SO when you need the full 32 KB program memory; the -302 variant offers 24 KB and the -303 variant offers 16 KB. All three share the same 20-pin SOIC footprint, the same XLP peripherals, and the same wide 2.0-5.5V VDD. If your code is under ~10 KB, the -303 saves cost; the -301 gives maximum headroom for field upgrades.
Where can I download the PIC24FV32KA301 datasheet PDF?
The official PIC24FV32KA301 family datasheet (document DS30009995e) can be downloaded from Microchip's website at the product page https://www.microchip.com/en-us/product/PIC24F32KA301, or directly as https://ww1.microchip.com/downloads/en/DeviceDoc/30009995e.pdf. Mirror copies are also available on alldatasheet.com and digchip.com for archival reference.
Where do I find the PIC24FV32KA301-E/SO pinout?
The pinout for the 20-pin SOIC package is documented in section 1.0 of the PIC24FV32KA304 family datasheet (DS30009995e). Pin 1 is MCLR, pin 8 and pin 19 are VSS, pin 20 is VDD, and pins 2-7 / 9-18 provide 17 general-purpose I/O with PPS remapping. An SOIC-20 package diagram is also rendered on the XAIPART product page for this part.
Is the PIC24FV32KA301-E/SO suitable for capacitive touch applications?
Yes - the PIC24FV32KA301-E/SO integrates Microchip's CTMU (Charge Time Measurement Unit), which provides a constant-current source for measuring capacitance changes in real time. Combined with the mTouch reference firmware and SDK, this enables touch buttons, sliders, and proximity sensors with no external components. Typical touch response time is under 25 ms at 8 MHz CPU.
How do I program the PIC24FV32KA301-E/SO - does it support JTAG?
The PIC24FV32KA301-E/SO does not support JTAG boundary scan. Programming is done via ICSP (In-Circuit Serial Programming) using the PGC and PGD pins plus MCLR. Microchip's MPLAB X IDE with PICkit 3, PICkit 4, ICD 3, or ICD 4 programmers supports this part. A 47k pull-up on MCLR is recommended for reliable programming per Microchip's programming specification.
What is the Deep Sleep current consumption of the PIC24FV32KA301-E/SO?
According to the Microchip XLP family datasheet, the PIC24FV32KA301 draws approximately 20 nA in Deep Sleep mode with the RTCC running and brown-out reset disabled. With DSBOR and RTCC active, the typical figure is closer to 250 nA. This nA-level standby current is the headline advantage of the XLP family for battery-life calculations spanning years on a single coin cell.

工程参考数据: PIC24FV32KA301-E/SO ——对比、设计指导和合规信息。

选型指南

Choose the PIC24FV32KA301-E/SO when your design needs 32 KB of Flash firmware space in a compact surface-mount SOIC-20 package, runs from a wide supply range (2.0V-5.5V, including direct battery or USB-5V), and must operate from -40C to +125C in industrial or outdoor environments. This part is the default choice for battery-powered IoT sensors, wearable medical devices, energy-harvesting endpoints, and capacitive touch HMIs. Choose PIC24FV32KA302-E/SO (24 KB Flash) or PIC24FV32KA303-E/SO (16 KB Flash) if your firmware is smaller and BOM cost matters. Choose PIC24FV32KA301-I/SO only if you can guarantee the design stays below +85C. Choose PIC24F32KA301-E/SO if you have a fixed 3.3V regulated rail and prefer slightly tighter BOR characteristics. Choose PIC24FV32KA301-E/P (PDIP) for through-hole prototyping only - migrate to SOIC before production.

与替代料对比

参数 本产品 PIC24FV32KA301-I/SO PIC24FV32KA302-E/SO PIC24FV32KA303-E/SO PIC24F32KA301-E/SO PIC24FV32KA301-E/P
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 20-pin SOIC (0.300 in) 20-pin SOIC (0.300 in) - same 20-pin SOIC (0.300 in) - same 20-pin SOIC (0.300 in) - same 20-pin SOIC (0.300 in) - same 20-pin PDIP (0.300 in) - through-hole variant
Flash Memory 32 KB 32 KB 24 KB 16 KB 32 KB 32 KB
RAM 2 KB 2 KB 2 KB 2 KB 2 KB 2 KB
Operating Temperature -40C to +125C (E grade) -40C to +85C (I grade) -40C to +125C (E grade) -40C to +125C (E grade) -40C to +125C (E grade) -40C to +125C (E grade)
CPU Speed 32 MIPS (32 MHz) 32 MIPS 32 MIPS 32 MIPS 32 MIPS 32 MIPS
VDD Range 2.0V to 5.5V (FV) 2.0V to 5.5V (FV) 2.0V to 5.5V (FV) 2.0V to 5.5V (FV) 3.0V to 3.6V (F) 2.0V to 5.5V (FV)
CTMU / Touch Support Yes (CTMU integrated) Yes Yes Yes Yes Yes

关键差异点

  • Highest Flash density in the 20-pin SOIC PIC24FV32KA30x family (对比 PIC24FV32KA303-E/SO)
  • Wide 2.0V-5.5V VDD range enables direct battery-powered operation (对比 PIC24F32KA301-E/SO)
  • Industrial -40C to +125C temperature grade for harsh environments (对比 PIC24FV32KA301-I/SO)
  • CTMU integrated for capacitive touch without external analog front-end (对比 PIC24FV32KA301-E/P (same die, PDIP package))

设计说明

Estimated: At 32 MIPS active with VDD=3.3V and all peripherals on, the PIC24FV32KA301 draws approximately 8 mA active. In Deep Sleep with RTCC running and DSBOR disabled, current drops to ~20 nA per the XLP family datasheet. For a sensor node with 0.1% duty cycle (1 ms active per second), average current is roughly 8 mA * 0.001 + 0.020 uA = 8.02 uA, giving ~3 years on a 2000 mAh coin cell. Always validate with actual silicon because Deep Sleep current varies 2-3x across parts.

Place a 0.1 uF decoupling capacitor as close as possible to the VDD pin (pin 20) and a 10 uF bulk capacitor within 5 mm. If using AVDD for the ADC reference, route AVDD/VREF+ through a ferrite bead from VDD and decouple with 0.1 uF + 10 uF at the AVDD pin. Keep the MCLR pull-up (47 k per Microchip programming spec) close to pin 1 to avoid programming failures.

Do not use a 10 k pull-up on MCLR - Microchip specifies 47 k for reliable ICSP programming with PICkit and ICD tools; the 10 k value causes programming failures. Do not skip the configuration bits setup in MPLAB X - the default oscillator and WDT settings will fail to start your application. Do not rely on JTAG; this family does not support it - use PGC/PGD instead.

When using the CTMU for capacitive touch, route the touch electrodes as short guarded traces and avoid running them parallel to noisy switching traces. A 100-ohm series resistor on the CTMU output improves EMI immunity. For sub-GHz RF companion chips (e.g., MRF89XA), place the antenna at least 5 cm from the MCU and avoid routing the ICSP PGC/PGD lines near the antenna trace.

Estimated: The PIC24FV32KA301-E/SO in the SOIC-20 package has a thermal resistance theta_JA of approximately 80 C/W on a 4-layer JEDEC test board. At 8 mA active and 3.3V VDD (66 mW), junction temperature rise above ambient is roughly 5 C - well within the 125 C limit. Even at full peripheral loading (ADC + CTMU + RTCC), the part remains comfortably below thermal shutdown. The SOIC-20 is one of the cooler-running PIC24F packages; the QFN equivalent runs ~10 C hotter.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
无铅
Yes
无卤
Yes
冲突矿物
Compliant

RoHS and lead-free compliant per Microchip product page. The -E temperature grade is industrial, not AEC-Q100 automotive qualified - for AEC-Q100, look at PIC24F variants in the automotive portfolio.

数据核验日期: 2026-09-30 ——数据由 XAIPART 元器件工程团队核验和整理

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