Microchip Technology

PIC24FV32KA301-I/SO - 16-bit 32MHz 32KB XLP MCU | Microchip

MPN: PIC24FV32KA301-I/SO ✓ Active
In Stock Ships in 1-3 business days
2.5V / 3.3V / 5V Vdss 20-SOIC (0.295 inch / 7.50 mm body) Package 32 MHz (16 MIPS) Speed 32 KB (11K x 24 instructions) Memory
From $2.16 USD / Unit
MOQ: 1 |
Price updated: 2026-09-30
Volume Pricing
Qty Unit Price Extended
1 $3.42 $3.42
10 $3.07 $30.70
100 $2.72 $272.00
500 $2.43 $1,215.00
1,000 $2.16 $2,160.00
ℹ️ All prices are in USD

PIC24FV32KA301-I/SO Overview

The Microchip Technology PIC24FV32KA301-I/SO is a 16-bit PIC microcontroller from the PIC24F XLP (eXtreme Low Power) family, featuring 32KB of Flash program memory and a 32 MHz maximum operating speed in a 20-pin SOIC wide-body package. It is built around the PIC24F CPU core with a modified Harvard architecture and supports operation from 2.5V, 3.3V, or 5V supplies, making it pin-compatible with both 3.3V and 5V system rails.

An XLP (eXtreme Low Power) microcontroller is a class of MCU specifically engineered to minimize active and sleep-mode current consumption for battery-powered and energy-harvesting applications. The PIC24FV32KA3xx family adds peripherals such as Deep Sleep Brown-Out Reset (DSBOR), Deep Sleep Watchdog Timer (DSWDT), and a Real-Time Clock Calendar (RTCC) that continue to operate while the CPU is in Deep Sleep, delivering industry-leading nanoamp-range standby currents that extend coin-cell and lithium battery life by months or years.

Key features include 32KB (11K x 24 instructions) Flash program memory, 2KB SRAM, 512 bytes EEPROM, an integrated 12-bit ADC with up to 16 input channels, a CTMU (Charge Time Measurement Unit) for capacitive touch sensing, and multiple 16-bit timers. The device provides rich connectivity through UART, SPI, I2C, and PMP interfaces, and supports 5V tolerant I/O. Peripherals continue to run in Deep Sleep, drawing nanoamp-level currents, which is the primary differentiator versus general-purpose PIC24F parts.

The PIC24FV32KA301 architecture is a 16-bit modified Harvard design with a hardware multiply/divide unit and a 24-bit instruction word, achieving 16 MIPS performance at 32 MHz. The 12-bit ADC, CTMU, RTCC, and comparator modules are tightly integrated with the XLP power-management unit, allowing autonomous sensor sampling and timekeeping without waking the CPU, which is critical for always-on IoT edge nodes.

Typical applications include battery-powered IoT devices, wearable health and fitness electronics, smart sensors with capacitive touch, home automation controllers, industrial remote monitoring nodes, and consumer handheld products where Deep Sleep mode is used for the majority of the operational duty cycle. The 5V tolerance also enables direct interfacing to legacy 5V peripherals without level shifters.

When designing with this device, always place 0.1 uF decoupling capacitors adjacent to each VDD pin and a bulk capacitor on the regulator output. Follow Microchip's MPLAB X IDE and the PIC24F peripheral library examples for ADC calibration and Deep Sleep mode entry/exit sequences to achieve the lowest quiescent current.

This page synthesizes distributor stock data, parametric drop-in alternatives, and practical XLP design notes not available in the manufacturer datasheet alone, enabling engineers to evaluate the PIC24FV32KA301-I/SO for next-generation low-power embedded designs.

Drop-in alternatives for PIC24FV32KA301-I/SO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC24FV32KA301-I/SO (same form factor and footprint) — differing in ADC, Operating Temperature, Maximum CPU Speed, Package, Core.

Microchip Technology
ADC: 12-bit, 1 (or 2 in 20/28 pin variants)
Operating Temperature: -40 C to +125 C (E grade = Extended)
Maximum CPU Speed: 32 MHz / 16 MIPS
Microchip Technology
ADC: 12-bit, 16 channels
Operating Temperature: -40C to +125C (E grade)
Package: 20-pin SOIC (7.50 mm / 0.300 in body)
Microchip Technology
ADC: 12-bit, multi-channel
Operating Temperature: -40 C to +85 C (Industrial)
Maximum CPU Speed: 32 MIPS at 32 MHz
Microchip Technology
Operating Temperature: -40 C to +85 C (Industrial)
Maximum CPU Speed: 32 MHz (16 MIPS @ 3.3V)
Package: 28-pin SOIC (wide-body, 7.50 mm)

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC24FV32KA301-I/SS

✅ Drop-In
📦 20-SSOP
SSOP shrink-package variant, same die and pinout logic, identical 32KB Flash / 32 MHz specs

📋 Reference alternative (not in catalog)

PIC24FV32KA301-E/SO

✅ Drop-In
Microchip Technology
📦 20-SOIC
PIC24F 16-bit · 32 KB (11K x 24 instructions) · 2 KB · 512 B · 32 MIPS (32 MHz) · 2.0 V to 5.5 V · -40C to +125C (E grade) · 17

✓ In Stock

$1.86 / Unit

View Datasheet →

PIC24FV32KA301-I/P

✅ Drop-In
📦 20-PDIP
Through-hole PDIP package, same die and pinout, identical electrical characteristics

📋 Reference alternative (not in catalog)

PIC24FV32KA302-I/SO

✅ Drop-In
Microchip Technology
📦 20-SOIC
PIC24F · PIC24FV32KA302 · 16-bit PIC RISC · 32 KB (11K x 24 instructions) · 2 KB · 512 bytes · 32 MHz (16 MIPS @ 3.3V) · 2.0 V to 5.5 V

✓ In Stock

$2.14 / Unit

View Datasheet →

PIC24FV16KA301-I/SO

✅ Drop-In
📦 20-SOIC
16KB Flash vs 32KB Flash (-50%), same 20-SOIC footprint, same XLP peripherals

📋 Reference alternative (not in catalog)

PIC24FV32KA301-I/SO Maximum Ratings & Electrical Characteristics

Core Architecture PIC24F 16-bit modified Harvard
Family PIC24FV32KA3xx (XLP)
Program Memory (Flash) 32 KB (11K x 24 instructions)
Data SRAM 2KB
EEPROM 512 bytes
Maximum CPU Speed 32 MHz (16 MIPS)
Operating Voltage 2.5V / 3.3V / 5V
I/O Pins Up to 16 (5V tolerant)
ADC 12-bit, up to 16 channels
CTMU Yes (Charge Time Measurement Unit)
Timers Multiple 16-bit timers
Communication UART, SPI, I2C, PMP
Deep Sleep Peripherals DSBOR, DSWDT, RTCC
Package 20-SOIC (0.295 inch / 7.50 mm body)
Mounting Type Surface Mount
Operating Temperature -40C to +85C (industrial, 'I' suffix)
RoHS Status Compliant
Lead-Free Yes

PIC24FV32KA301-I/SO Pin Configuration

SOIC-20 Package Pinout Diagram SOIC-20W 20-pin, 7.5x12.8mm, P1.27mm, JEDEC MS-013. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 SOIC-20
Pin 1 MCLR/VPP/RE3 — Master Clear (reset) input / programming voltage
Pin 2 RA0 — Digital I/O / analog input AN0
Pin 3 RA1 — Digital I/O / analog input AN1
Pin 4 RB0 — Digital I/O / programming PGD
Pin 5 RB1 — Digital I/O / programming PGC
Pin 6 RB2 — Digital I/O / analog input AN2
Pin 7 RB3 — Digital I/O / analog input AN3
Pin 8 VSS — Ground reference
Pin 9 OSC1/CLKI — Crystal oscillator input / external clock
Pin 10 OSC2/CLKO — Crystal oscillator output
Pin 11 RB4 — Digital I/O / analog input AN4
Pin 12 RB5 — Digital I/O / analog input AN5
Pin 13 RB6 — Digital I/O / analog input AN6
Pin 14 RB7 — Digital I/O / analog input AN7
Pin 15 RA2 — Digital I/O / analog input AN8
Pin 16 RA3 — Digital I/O / analog input AN9
Pin 17 RA4 — Digital I/O / analog input AN10
Pin 18 RA5 — Digital I/O / analog input AN11
Pin 19 VDD — Positive power supply
Pin 20 VSS — Ground reference

Typical Applications

PIC24FV32KA301-I/SO is suitable for 6 applications: Battery-Powered IoT Sensor Node, Wearable Health and Fitness Device, Smart Home Touch Control Panel, Industrial Remote Monitoring Node, Consumer Handheld Product, Capacitive Touch User Interface.

🧩

Battery-Powered IoT Sensor Node

The PIC24FV32KA301-I/SO is well matched to battery-powered IoT sensor nodes because its XLP architecture with DSBOR, DSWDT, and RTCC continues to operate in Deep Sleep at nanoamp-level currents, while the integrated 12-bit ADC and CTMU handle analog and capacitive sensor reading autonomously. The 32KB Flash accommodates small BLE/Zigbee stacks or LoRa drivers, and the 2KB SRAM provides headroom for sensor data buffering. With 2.5V to 5V operation the MCU can run directly from a single CR2032 coin cell (with boost) or a 3.3V regulated Li-ion supply. Place a 0.1uF decoupling cap adjacent to VDD and use MPLAB X IDE low-power application libraries to enter Deep Sleep between sensor reads, extending battery life by months versus general-purpose PIC24F parts.

📱

Wearable Health and Fitness Device

Wearable health and fitness devices benefit from the PIC24FV32KA301-I/SO's Deep Sleep RTCC that keeps real-time clock accuracy while the CPU is asleep, plus the CTMU for touch-based user interfaces and the 12-bit ADC for heart-rate or temperature sensor signal conditioning. The 32KB Flash accommodates BLE stack fragments, sensor-fusion firmware, and OTA bootloader stubs needed for wristband-class products. The 5V-tolerant I/O simplifies interfacing to legacy analog front-end ICs, and the 20-SOIC wide-body package is easy to assemble on flexible and rigid PCBs typical of wearables. Use MPLAB X IDE with the PIC24F peripheral library for power optimization and follow Microchip AN1416 for low-power touch sensing.

🏠

Smart Home Touch Control Panel

Smart home touch control panels benefit from the PIC24FV32KA301-I/SO's CTMU peripheral, which supports reliable capacitive touch sensing for buttons, sliders, and proximity wake functions on wall-mounted panels. The 32KB Flash stores touch-sensing libraries and connectivity stacks (Zigbee, Thread, or Matter bridges), while the 2KB SRAM handles transient touch-event buffers. The 5V-tolerant I/O allows direct interfacing to LED drivers and triac control lines. Its 20-SOIC wide-body package is well suited to the through-hole-friendly board outlines common in retrofit smart-switch products. Use Microchip's mTouch capacitive sensing design guides and follow AN1171 for robust touch UI performance.

🏭

Industrial Remote Monitoring Node

Industrial remote monitoring nodes rely on the PIC24FV32KA301-I/SO's industrial -40C to +85C temperature range and Deep Sleep RTCC for timestamped logging over years of battery life. The 12-bit ADC with up to 16 input channels accepts signals from pressure, flow, temperature, and 4-20mA current-loop transducers common in process plants. The 32KB Flash holds Modbus RTU or proprietary protocol stacks, while 2KB SRAM accommodates telemetry buffers before wireless transmission. Its wide 2.5V to 5V operating range supports both 3.3V regulated and 5V battery-powered field deployments. Use Microchip application note AN1345 for industrial sensor conditioning and follow IEC 61000 ESD layout practices.

🎮

Consumer Handheld Product

Consumer handheld products like remote controls, gaming peripherals, and personal care devices gain long battery life from the PIC24FV32KA301-I/SO's XLP Deep Sleep mode and 5V tolerance for direct alkaline-battery operation. The 32KB Flash supports user-interface state machines and simple wireless protocols (BLE, sub-GHz RF), while the 12-bit ADC handles battery monitoring and analog sensors. The 20-SOIC wide-body package accommodates both automated and hand-soldered assembly typical of consumer-electronics production lines. Use Microchip's low-power design checklist (AN1416) and follow USB-to-UART bridge recommendations for field firmware updates.

💡

Capacitive Touch User Interface

Capacitive touch interfaces benefit from the PIC24FV32KA301-I/SO's dedicated CTMU hardware block, which provides hardware-timed charge measurement for reliable touch detection across buttons, wheels, and sliders. The 32KB Flash supports Microchip's mTouch libraries, while the 5V-tolerant I/O simplifies interfacing to LED indicators and piezo buzzers. The integrated 12-bit ADC can monitor supply voltage for brown-out detection, and the RTCC keeps timing data during Deep Sleep periods between user interactions. The 20-SOIC wide-body package is ideal for both hand-soldered prototypes and automated SMT production. Follow Microchip application note AN1171 and the mTouch design guide for PCB layout and sensor-pattern recommendations.

What is the PIC24FV32KA301-I/SO?
The PIC24FV32KA301-I/SO is a 16-bit Microchip PIC24F microcontroller from the XLP (eXtreme Low Power) family, integrating 32KB of Flash, 2KB SRAM, 512 bytes of EEPROM, and Deep Sleep-capable peripherals such as DSBOR, DSWDT, and RTCC. It comes in a 20-pin SOIC wide-body package and operates from 2.5V, 3.3V, or 5V supplies up to 32 MHz.
What is the operating voltage of PIC24FV32KA301-I/SO?
The PIC24FV32KA301-I/SO operates from 2.5V, 3.3V, or 5V supplies, allowing the same part to drop into 3.3V and 5V designs. This wide VDD range plus 5V-tolerant I/O makes it a flexible choice when targeting both modern low-voltage MCUs and legacy 5V peripherals in a single hardware design.
Where can I buy PIC24FV32KA301-I/SO online?
The PIC24FV32KA301-I/SO is in stock at authorized distributors including DigiKey, Mouser, Arrow, and MicrochipDirect. Pricing tiers as of 2026-09-30 start around $3.42 for qty-1 with significant volume breaks at 100, 500, and 1000 units, and ships today from most authorized channels.
What is the price of PIC24FV32KA301-I/SO?
The PIC24FV32KA301-I/SO lists at approximately $3.42 per unit at qty-1, falling to around $2.72 at qty-100 and $2.16 at qty-1000 as of 2026-09-30. Volume pricing makes this XLP MCU very competitive for cost-sensitive battery-powered products that still require 32KB Flash and Deep Sleep operation.
What is the lead time for PIC24FV32KA301-I/SO?
Authorized distributors including DigiKey and Mouser typically list the PIC24FV32KA301-I/SO with same-day shipping for in-stock inventory as of 2026-09-30. When factory lead times apply, expect 8-14 weeks for large orders; this part is in active production and is not currently designated obsolete.
PIC24FV32KA301 vs PIC24F32KA301 - what is the difference?
The PIC24FV32KA301 supports a wider operating voltage range of 2.5V to 5V, while the PIC24F32KA301 is optimized for 3.3V-only operation. The 'FV' prefix denotes the wide-VDD variant; otherwise both parts share identical 32KB Flash, 32 MHz speed, 20-pin SOIC footprint, and XLP peripherals per the Microchip PIC24F KA3xx datasheet family.
When should I choose PIC24FV32KA301-I/SO over PIC24FV16KA302-I/SO?
Choose PIC24FV32KA301-I/SO when you need 32KB Flash instead of 16KB for firmware-intensive applications such as graphics libraries, BLE stacks, or over-the-air bootloaders. Choose PIC24FV16KA302-I/SO for cost-optimized designs where 16KB Flash is sufficient and you want a slightly lower unit cost while keeping the same 20-SOIC footprint.
What is the best drop-in replacement for PIC24FV32KA301-I/SO?
Same-package drop-in replacements in the 20-SOIC footprint include PIC24FV32KA301-I/SS (SSOP package, pin-to-pin compatible logic), PIC24FV32KA301-I/P (PDIP through-hole variant), and PIC24FV32KA301-E/SO (extended temperature grade). For higher memory, PIC24FV32KA302-I/SO adds peripherals while keeping the same 32KB Flash and pinout.
Can PIC24FV32KA302-I/SO replace PIC24FV32KA301-I/SO?
Yes, PIC24FV32KA302-I/SO is a member of the same PIC24FV32KA3xx family and shares the 20-SOIC footprint, 32KB Flash, and 32 MHz speed. The KA302 variant offers additional peripheral options; per Microchip family documentation it is functionally compatible for most applications, making it a valid drop-in upgrade path within the same footprint.
Where can I download the PIC24FV32KA301-I/SO datasheet PDF?
The official Microchip datasheet for the PIC24FV32KA301-I/SO is available as the PIC24F KA3xx Family Data Sheet (DS30009995) at https://ww1.microchip.com/downloads/en/DeviceDoc/30009995e.pdf. This document covers electrical characteristics, pin descriptions, ADC peripheral details, and XLP Deep Sleep behavior for the entire family.
What is the pinout of the PIC24FV32KA301-I/SO?
The PIC24FV32KA301-I/SO uses a 20-pin SOIC wide-body package with pin 1 marked at the dot. Key pins include VDD (1), OSC1/CLKI (9), OSC2/CLKO (10), MCLR (1), VSS (20), and a mix of analog (ANx), digital I/O, and peripheral pins (UART, SPI, I2C) on the remaining pins per the family datasheet pin diagram.
What are the key specifications of PIC24FV32KA301-I/SO that engineers should know?
Engineers should know: 32KB Flash, 2KB SRAM, 512 bytes EEPROM, 32 MHz CPU (16 MIPS), 12-bit ADC up to 16 channels, CTMU for capacitive touch, RTCC that runs in Deep Sleep, 5V-tolerant I/O, 20-SOIC package, and operating voltage of 2.5V/3.3V/5V. Together these specs define a low-power 16-bit MCU for battery-powered IoT.
Is the PIC24FV32KA301-I/SO the same as PIC24FV32KA301-I/SS?
Both PIC24FV32KA301-I/SO and PIC24FV32KA301-I/SO share the same silicon die, 32KB Flash, peripherals, and electrical characteristics; the difference is the package. SO is the 20-SOIC wide-body surface-mount package, while SS is the 20-SSOP shrink-package. Pin-to-pin compatibility is preserved on the same 0.1-inch pitch, but PCB layout must be updated for the SSOP body width.
What are the XLP power-saving features of PIC24FV32KA301?
The PIC24FV32KA301 integrates XLP peripherals - DSBOR (Deep Sleep Brown-Out Reset), DSWDT (Deep Sleep Watchdog Timer), and RTCC (Real-Time Clock Calendar) - that remain active in Deep Sleep mode, drawing nanoamp-level currents. This allows always-on timekeeping and watchdog supervision while the CPU is asleep, extending battery life by months in IoT sensor applications.

Engineering reference data for PIC24FV32KA301-I/SO — comparison, design guidance, and compliance information.

Selection Guide

Choose PIC24FV32KA301-I/SO when you need a 16-bit PIC24F XLP microcontroller with 32KB Flash, 2KB SRAM, Deep Sleep RTCC, and 5V tolerance in a 20-SOIC wide-body package for hand-solderable or standard SMT assembly. Choose PIC24FV32KA301-I/SS for the same silicon in a smaller 20-SSOP footprint for compact PCB designs. Choose PIC24FV32KA301-I/P for through-hole DIP prototypes. Choose PIC24FV32KA301-E/SO for extended -40C to +125C temperature environments. Choose PIC24FV16KA301-I/SO if 16KB Flash is sufficient and you want lower cost. All five options share the same PIC24F KA3xx XLP peripherals, so the choice is largely driven by package and temperature grade rather than silicon differences.

Comparison with Alternatives

Parameter This Product PIC24FV32KA301-I/SS PIC24FV32KA301-E/SO PIC24FV32KA301-I/P PIC24FV32KA302-I/SO PIC24FV16KA301-I/SO
Package 20-SOIC (7.50mm body) 20-SSOP - same pitch 20-SOIC - same 20-PDIP (through-hole) 20-SOIC - same 20-SOIC - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Program Memory (Flash) 32 KB 32 KB 32 KB 32 KB 32 KB 16 KB
Maximum CPU Speed 32 MHz (16 MIPS) 32 MHz (16 MIPS) 32 MHz (16 MIPS) 32 MHz (16 MIPS) 32 MHz (16 MIPS) 32 MHz (16 MIPS)
Operating Voltage 2.5V / 3.3V / 5V 2.5V / 3.3V / 5V 2.5V / 3.3V / 5V 2.5V / 3.3V / 5V 2.5V / 3.3V / 5V 2.5V / 3.3V / 5V
Operating Temperature -40C to +85C (industrial) -40C to +85C (industrial) -40C to +125C (extended) -40C to +85C (industrial) -40C to +85C (industrial) -40C to +85C (industrial)
ADC 12-bit, up to 16 channels 12-bit, up to 16 channels 12-bit, up to 16 channels 12-bit, up to 16 channels 12-bit, up to 16 channels 12-bit, up to 16 channels
XLP Deep Sleep Peripherals DSBOR, DSWDT, RTCC DSBOR, DSWDT, RTCC DSBOR, DSWDT, RTCC DSBOR, DSWDT, RTCC DSBOR, DSWDT, RTCC DSBOR, DSWDT, RTCC

Key Differentiators

  • Wider operating voltage than PIC24F32KA301 (vs PIC24F32KA301)
  • 20-SOIC wide-body vs narrower 20-SSOP (vs PIC24FV32KA301-I/SS)
  • Industrial vs extended temperature grade (vs PIC24FV32KA301-E/SO)

Design Notes

To achieve the lowest Deep Sleep current on the PIC24FV32KA301-I/SO, disable unused peripherals via PMD registers before entering Sleep, and use the DSBOR and DSWDT instead of the regular BOR/WDT whenever Deep Sleep is required. Estimated: typical Deep Sleep current at 25C is in the nanoamp range when the RTCC is the only active peripheral; this was not measured by us and should be confirmed against the Microchip datasheet DS30009995 typical characteristics table for the specific operating voltage.

Place a 0.1 uF decoupling capacitor between VDD (pin 19) and VSS (pin 20) as close as possible to the package, ideally within 3 mm of the pins. Add a bulk capacitor (1-10 uF) on the regulator output near the MCU. Keep the OSC1/OSC2 traces short and shield them from digital switching lines to avoid jitter on the crystal or external clock. Follow Microchip's PCB layout guidelines in the PIC24F KA3xx family datasheet section on oscillator design.

The MCLR pin (1) must have a pull-up to VDD for the MCU to operate; leaving it floating prevents startup. The PGC and PGD pins (RB1, RB0) used for ICSP must not be pulled low at reset or programming will fail. When migrating from PIC24F32KA301 (3.3V only) to PIC24FV32KA301 (2.5V to 5V), verify that any external 5V peripherals do not back-power the I/O pins above VDD + 0.3V. Use the MPLAB X IDE configuration bits to set the oscillator, watchdog, and code-protection options correctly before programming.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliance per Microchip product page. Not AEC-Q100 qualified; for automotive applications select the AEC-Q100-qualified PIC24F KA3xx variants if available. Lead-free reflow-compatible.

Data verified on: 2026-09-30 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology PIC24FV32KA301-I/SO PIC24FV32KA301-I/SS PIC24FV32KA301-E/SO PIC24FV32KA301-I/P PIC24FV32KA302-I/SO PIC24FV16KA301-I/SO PIC24F PIC microcontroller XLP eXtreme Low Power 16-bit MCU modified Harvard architecture CTMU DSBOR DSWDT RTCC MPLAB X IDE 20-SOIC RoHS AEC-Q100 battery-powered IoT capacitive touch sensing Deep Sleep mode
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