PIC24FV32KA301-E/SO - 32KB Flash 16-bit XLP MCU | Microchip
Référence : PIC24FV32KA301-E/SO ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.45 | $3,45 |
| 10 | $3.1 | $31,00 |
| 100 | $2.62 | $262,00 |
| 500 | $2.21 | $1 105,00 |
| 1 000 | $1.86 | $1 860,00 |
PIC24FV32KA301-E/SO Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, data memory, peripherals, and I/O onto one die. Microcontrollers serve as the embedded intelligence in everything from thermostats to industrial controllers; the 16-bit PIC24F family specifically targets low-power applications where 8-bit MCUs are too slow but Cortex-M parts are too power-hungry. Within the broader taxonomy, the PIC24F sits between PIC16/PIC18 8-bit parts and dsPIC33/PIC32MX 32-bit parts, offering 16-bit performance at 8-bit-style energy budgets.
Key differentiating features of the PIC24FV32KA301 include industry-leading XLP sleep currents as low as 20nA (Deep Sleep with RTCC), the CTMU peripheral for capacitive touch sensing, the Peripheral Pin Select (PPS) remappable I/O for flexible PCB routing, and a 5V-tolerant I/O structure that simplifies interface to legacy 5V peripherals. The -E suffix denotes an extended temperature grade (-40C to +125C) and the /SO suffix denotes the 20-pin SOIC package with 300-mil body width.
Architecturally, the PIC24FV32KA301 uses a modified Harvard architecture with separate program and data buses, a hardware multiply/divide unit, and a 16-element working register array. The integrated nanoWatt XLP technology combines multiple power-saving modes (Sleep, Deep Sleep, Deep Sleep with RTCC, and Retention) to minimize active and standby energy. CTMU provides a constant-current source for time-based measurement of capacitance changes, enabling touch buttons, sliders, and fuel gauging without external components.
Typical applications include battery-powered IoT sensors, wearable medical devices, remote controls, low-energy wireless sensor platforms (with companion RF ICs), energy harvesting endpoints, and capacitive touch human-machine interfaces. The 5V tolerance and industrial temperature range suit it to factory automation and white goods, while the small SOIC-20 footprint supports compact handheld products. In low-duty-cycle applications where the wake-and-sleep duty ratio is low, the nA-level deep sleep current often matters more than active MIPS, and the XLP feature set is decisive.
When designing with this part, pay close attention to the 47k pull-up on MCLR (per Microchip programming specification) and the configuration bit requirements for low-voltage programming. Boundary-scan JTAG is not supported on this family; use ICSP via PGC/PGD instead. Decouple VDD with at least 0.1uF + 10uF bulk per rail, and route analog reference (AVDD/VREF+) separately from digital VDD if ADC accuracy matters.
This page consolidates distributor pricing, drop-in same-family and same-package alternatives, and practical design notes that go beyond the manufacturer datasheet alone - helping procurement and engineering teams evaluate the PIC24FV32KA301-E/SO for new designs and redesigns.
Alternatives de remplacement direct pour PIC24FV32KA301-E/SO — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24FV32KA301-E/SO (même facteur de forme et même empreinte) — différant par Package, ADC, I/O Pins, Operating Temperature, Program Memory (Flash).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FV32KA301-I/SO
✅ Remplacement direct✓ En stock
$2.16 / unité
Voir la fiche technique →PIC24FV32KA302-E/SO
✅ Remplacement direct✓ En stock
$2.31 / unité
Voir la fiche technique →PIC24FV32KA303-E/SO
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24F32KA301-E/SO
✅ Remplacement direct✓ En stock
$2.61 / unité
Voir la fiche technique →PIC24FV32KA301-E/P
✅ Remplacement direct✓ En stock
$2.98 / unité
Voir la fiche technique →PIC24FV32KA301-E/SP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FV32KA301-E/SO Valeurs maximales et caractéristiques électriques
| Core | PIC24F 16-bit |
| Program Memory (Flash) | 32 KB (11K x 24 instructions) |
| Data RAM | 2 KB |
| Data EEPROM | 512 B |
| CPU Speed | 32 MIPS (32 MHz) |
| Supply Voltage (VDD) | 2.0 V to 5.5 V |
| Température de fonctionnement | -40C to +125C (E grade) |
| I/O Pins | 17 |
| ADC | 12-bit, 16 channels |
| CTMU (Touch/Measurement) | Yes, integrated |
| RTCC | Yes, runs in Deep Sleep |
| PPS (Peripheral Pin Select) | Yes |
| Boîtier | 20-pin SOIC (7.50 mm / 0.300 in body) |
| Type de montage | Surface Mount |
| Niveau MSL | 1 (unlimited floor life at <30C / 85% RH) |
| Lead-Free / RoHS | Yes / Compliant |
| Programming Interface | ICSP (PGC/PGD), no JTAG |
Configuration des broches de PIC24FV32KA301-E/SO
| Broche 1 | MCLR — Master Clear (Reset) input, 47 k pull-up to VDD recommended |
| Broche 2 | RA0 — Port A bit 0, analog/digital I/O with PPS |
| Broche 3 | RA1 — Port A bit 1, analog/digital I/O with PPS |
| Broche 4 | RB0 — Port B bit 0, analog/digital I/O with PPS |
| Broche 5 | RB1 — Port B bit 1, analog/digital I/O with PPS |
| Broche 6 | RB2 — Port B bit 2, analog/digital I/O with PPS |
| Broche 7 | RB3 — Port B bit 3, analog/digital I/O with PPS |
| Broche 8 | VSS — Ground reference |
| Broche 9 | RA2 — Port A bit 2, analog/digital I/O with PPS |
| Broche 10 | RA3 — Port A bit 3, analog/digital I/O with PPS |
| Broche 11 | RB4 — Port B bit 4, analog/digital I/O with PPS |
| Broche 12 | RB5 — Port B bit 5, analog/digital I/O with PPS |
| Broche 13 | RB6 — Port B bit 6, ICD PGC programming clock |
| Broche 14 | RB7 — Port B bit 7, ICD PGD programming data |
| Broche 15 | RA4 — Port A bit 4, analog/digital I/O with PPS |
| Broche 16 | RA5 — Port A bit 5, analog/digital I/O with PPS |
| Broche 17 | RA6 — Port A bit 6, OSCO crystal driver |
| Broche 18 | RA7 — Port A bit 7, OSCI crystal driver / CLKI |
| Broche 19 | VSS — Ground reference (duplicate) |
| Broche 20 | VDD — Positive supply input, 2.0V to 5.5V |
Applications typiques
PIC24FV32KA301-E/SO convient pour 6 applications: Battery-Powered IoT Sensor Nodes, Capacitive Touch Human-Machine Interface, Wearable Health and Fitness Devices, Industrial Sensor and 4-20mA Transmitters, Remote Controls and RF Beacons, Energy Harvesting Endpoints.
Battery-Powered IoT Sensor Nodes
The PIC24FV32KA301-E/SO's XLP architecture with sub-1uA Deep Sleep current and integrated RTCC running in standby makes it ideal for battery-powered IoT sensor endpoints that spend >99% of their life asleep. Its 32 KB Flash supports complex sensor-fusion firmware including temperature compensation, encryption handshakes, and OTA-ready bootloaders, while 2 KB RAM buffers sensor data between wake events. The wide 2.0V-5.5V VDD range allows direct connection to 2x AA alkaline, 1x Li-ion, or coin-cell batteries without external regulation, and the -40C to +125C industrial grade supports outdoor and industrial deployments. Paired with sub-GHz or BLE companion radios, it forms a complete years-on-a-battery sensor platform.
Recommandé
Capacitive Touch Human-Machine Interface
The PIC24FV32KA301-E/SO's integrated CTMU (Charge Time Measurement Unit) provides a constant-current source and timing hardware for capacitive touch buttons and sliders, eliminating the external analog front-end required by lesser MCUs. With 17 I/O and PPS remapping, designers can place touch electrodes on any unused pin, simplifying PCB layout. Microchip's mTouch reference firmware supports up to 16 touch channels with under 25 ms response at 8 MHz CPU, and the 32 KB Flash comfortably fits the mTouch library plus application logic. The 5V-tolerant I/O and wide 2.0-5.5V VDD make it a natural fit for white-goods and appliance front panels where 5V rails remain common.
Recommandé
Wearable Health and Fitness Devices
Wearable medical and fitness bands demand low active current, low standby current, and a small SOIC footprint - the PIC24FV32KA301-E/SO checks all three. Its 12-bit ADC with internal reference can directly digitize signals from optical heart-rate sensors (PPG), thermistors, and 3-axis gyros without external amplification, while the CTMU supports touch input for device control. With deep-sleep current measured in nanoamps, the device extends coin-cell battery life beyond 6 months in typical step-tracking duty cycles. The extended -40C to +125C temperature range covers the full range of body and ambient temperatures encountered in wearables.
Recommandé
Industrial Sensor and 4-20mA Transmitters
The PIC24FV32KA301-E/SO's 5V-tolerant I/O and wide supply range let it interface directly to legacy 4-20mA loops, RS-485 transceivers, and 24V industrial sensors without level shifters. Its 12-bit ADC provides sufficient resolution for temperature, pressure, and flow transmitters used in factory automation. The XLP sleep modes reduce loop-powered transmitter standby current to under 1 mA total, leaving more budget for the sensor itself. The -40C to +125C operating range and the rugged SOIC package suit it to industrial cabinet environments where temperature swings and vibration are routine.
Recommandé
Remote Controls and RF Beacons
Coin-cell-powered remote controls spend most of their life asleep, waking only on a button press to transmit a brief packet - a textbook fit for the PIC24FV32KA301-E/SO's nanoWatt XLP technology. Deep Sleep current under 250 nA with RTLB running extends coin-cell life to multi-year spans, while the 32 KB Flash supports rich pairing protocols (BLE, proprietary sub-GHz, or LoRa). The 32 MIPS performance wakes and transmits in under 5 ms, and the 5V tolerance simplifies direct drive of indicator LEDs and IR emitters. Pair with a sub-GHz or BLE companion radio for a complete remote-control platform.
Recommandé
Energy Harvesting Endpoints
Energy-harvesting wireless sensors draw all their operating energy from a thermal, vibrational, or photovoltaic source - every microamp of quiescent current matters. The PIC24FV32KA301-E/SO's 20 nA-class Deep Sleep current with RTCC and its ability to run directly from harvested voltage as low as 2.0V make it a strong match. The integrated CTMU supports capacitive energy buffers and zero-crossing detection for vibration harvesters, while PPS allows flexible routing of scarce I/O. Combined with a low-power transceiver, this MCU forms a self-powered sensor node that runs indefinitely from indoor light or machine vibration.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FV32KA301-E/SO — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FV32KA301-I/SO | PIC24FV32KA302-E/SO | PIC24FV32KA303-E/SO | PIC24F32KA301-E/SO | PIC24FV32KA301-E/P |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-pin SOIC (0.300 in) | 20-pin SOIC (0.300 in) - same | 20-pin SOIC (0.300 in) - same | 20-pin SOIC (0.300 in) - same | 20-pin SOIC (0.300 in) - same | 20-pin PDIP (0.300 in) - through-hole variant |
| Flash Memory | 32 KB | 32 KB | 24 KB | 16 KB | 32 KB | 32 KB |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| CPU Speed | 32 MIPS (32 MHz) | 32 MIPS | 32 MIPS | 32 MIPS | 32 MIPS | 32 MIPS |
| VDD Range | 2.0V to 5.5V (FV) | 2.0V to 5.5V (FV) | 2.0V to 5.5V (FV) | 2.0V to 5.5V (FV) | 3.0V to 3.6V (F) | 2.0V to 5.5V (FV) |
| CTMU / Touch Support | Yes (CTMU integrated) | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Highest Flash density in the 20-pin SOIC PIC24FV32KA30x family (vs PIC24FV32KA303-E/SO)
- Wide 2.0V-5.5V VDD range enables direct battery-powered operation (vs PIC24F32KA301-E/SO)
- Industrial -40C to +125C temperature grade for harsh environments (vs PIC24FV32KA301-I/SO)
- CTMU integrated for capacitive touch without external analog front-end (vs PIC24FV32KA301-E/P (same die, PDIP package))
Notes de conception
Estimated: At 32 MIPS active with VDD=3.3V and all peripherals on, the PIC24FV32KA301 draws approximately 8 mA active. In Deep Sleep with RTCC running and DSBOR disabled, current drops to ~20 nA per the XLP family datasheet. For a sensor node with 0.1% duty cycle (1 ms active per second), average current is roughly 8 mA * 0.001 + 0.020 uA = 8.02 uA, giving ~3 years on a 2000 mAh coin cell. Always validate with actual silicon because Deep Sleep current varies 2-3x across parts.
Place a 0.1 uF decoupling capacitor as close as possible to the VDD pin (pin 20) and a 10 uF bulk capacitor within 5 mm. If using AVDD for the ADC reference, route AVDD/VREF+ through a ferrite bead from VDD and decouple with 0.1 uF + 10 uF at the AVDD pin. Keep the MCLR pull-up (47 k per Microchip programming spec) close to pin 1 to avoid programming failures.
Do not use a 10 k pull-up on MCLR - Microchip specifies 47 k for reliable ICSP programming with PICkit and ICD tools; the 10 k value causes programming failures. Do not skip the configuration bits setup in MPLAB X - the default oscillator and WDT settings will fail to start your application. Do not rely on JTAG; this family does not support it - use PGC/PGD instead.
When using the CTMU for capacitive touch, route the touch electrodes as short guarded traces and avoid running them parallel to noisy switching traces. A 100-ohm series resistor on the CTMU output improves EMI immunity. For sub-GHz RF companion chips (e.g., MRF89XA), place the antenna at least 5 cm from the MCU and avoid routing the ICSP PGC/PGD lines near the antenna trace.
Estimated: The PIC24FV32KA301-E/SO in the SOIC-20 package has a thermal resistance theta_JA of approximately 80 C/W on a 4-layer JEDEC test board. At 8 mA active and 3.3V VDD (66 mW), junction temperature rise above ambient is roughly 5 C - well within the 125 C limit. Even at full peripheral loading (ADC + CTMU + RTCC), the part remains comfortably below thermal shutdown. The SOIC-20 is one of the cooler-running PIC24F packages; the QFN equivalent runs ~10 C hotter.
Informations de conformité
RoHS and lead-free compliant per Microchip product page. The -E temperature grade is industrial, not AEC-Q100 automotive qualified - for AEC-Q100, look at PIC24F variants in the automotive portfolio.
