PIC32MM0064GPM028T-I/M6 - 32-Bit 25MHz 64KB Flash MCU | Microchip
MPN: PIC32MM0064GPM028T-I/M6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.52 | $25.20 |
| 100 | $2.18 | $218.00 |
| 500 | $1.92 | $960.00 |
| 1,000 | $1.74 | $1,740.00 |
PIC32MM0064GPM028T-I/M6 Overview
A 32-bit microcontroller (MCU) is an integrated circuit that combines a CPU, memory (Flash for code, SRAM for data), and peripherals on a single die. The PIC32MM GPM family uses the MIPS32 microAptiv UC core, which executes 32-bit instructions while supporting 16-bit instructions for code density. These MCUs sit in the hierarchy microcontroller -> embedded processor -> semiconductor and are designed for low-power, cost-sensitive embedded applications.
Key features include 64 KB ECC Flash, 16 KB SRAM, USB 2.0 Full-Speed device/host/OTG, 12-bit 1.1 Msps ADC, multiple timer/counters, and I2C/SPI/UART interfaces. The operating voltage is 2.0V to 3.6V with industrial temperature range -40C to +125C. Power-saving modes support sleep currents down to 500 nA for battery-powered designs.
The microAptiv UC core uses a Harvard architecture with separate Flash and SRAM buses, enabling single-cycle Flash access and zero-wait-state operation up to 25 MHz. ECC on Flash protects against bit flips in noisy or harsh environments. The 28-UQFN 4x4 mm package has an exposed thermal pad and is one of the smallest packages in the family, enabling space-constrained designs.
Typical applications include USB peripherals, IoT sensor nodes, low-power wearables, industrial control, and consumer devices requiring USB connectivity with low standby current. The combination of USB, ECC Flash, and a small footprint makes this part well-suited for cost-effective, battery-aware products.
When designing, ensure proper decoupling on VDD and use the exposed pad for thermal dissipation. The USB transceiver requires a 48 MHz clock source from the on-chip PLL; configure the OSCCON and SPLLCON registers correctly for USB operation. The part is functionally equivalent to PIC32MM0064GPM028-I/M6 in tray packaging.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations not aggregated in the manufacturer datasheet alone.
Drop-in alternatives for PIC32MM0064GPM028T-I/M6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MM0064GPM028T-I/M6 (same form factor and footprint) — differing in ADC, Package, Program Memory (Flash), MSL Level, Timers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MM0064GPM028-I/M6
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MM0064GPM028-I/ML
✅ Drop-In✓ In Stock
$1.85 / Unit
View Datasheet →PIC32MM0064GPM028-I/SS
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.55 / Unit
View Datasheet →PIC32MM0032GPM028-I/M6
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC32MM0128GPM028-I/M6
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC32MM0064GPL028-I/ML
✅ Drop-In✓ In Stock
$2.25 / Unit
View Datasheet →PIC32MM0064GPM028T-I/M6 Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 microAptiv UC |
| Data Bus Width | 32-bit |
| Maximum Clock Frequency | 25 MHz |
| Program Memory Size | 64 KB Flash (64K x 8) |
| RAM Size | 16 KB |
| Supply Voltage | 2.0 V to 3.6 V |
| Operating Temperature Range | -40C to +125C (Industrial) |
| Package | 28-UQFN (M6) 4x4 mm with exposed pad |
| Mounting Type | Surface Mount |
| USB Interface | USB 2.0 Full-Speed Device/Host/OTG |
| ADC | 12-bit, up to 1.1 Msps |
| Flash ECC | Yes |
| Sleep Current | 500 nA (typical lowest power mode) |
| MSL Level | 1 (unlimited floor life at <=30C/85% RH) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
PIC32MM0064GPM028T-I/M6 Pin Configuration
| Pin 1 | RPB0/AN0/USBID/RB0 — Remappable I/O, ADC input, port B |
| Pin 2 | RPB1/AN1/RB1 — Remappable I/O, ADC input, port B |
| Pin 3 | RPB2/AN2/RB2 — Remappable I/O, ADC input, port B |
| Pin 4 | RPB3/AN3/RB3 — Remappable I/O, ADC input, port B |
| Pin 5 | VDD — Positive supply voltage |
| Pin 6 | VSS — Ground reference |
| Pin 7 | RPF4/PMA4/RF4 — Remappable I/O, port F |
| Pin 8 | RPF5/RF5 — Remappable I/O, port F |
| Pin 9 | USBID/RPB4/RB4 — USB ID or remappable I/O |
| Pin 10 | VBUS — USB VBUS sense |
| Pin 11 | D- — USB D- data line |
| Pin 12 | D+ — USB D+ data line |
| Pin 13 | OSC1/CLKI/RA0 — Crystal oscillator input or clock input |
| Pin 14 | OSC2/CLKO/RA1 — Crystal oscillator output |
| Pin 15 | RPB5/PMD5/RB5 — Remappable I/O, PMP data line |
| Pin 16 | RPB6/PMD6/RB6 — Remappable I/O, PMP data line |
| Pin 17 | RPB7/PMD7/RB7 — Remappable I/O, PMP data line |
| Pin 18 | RPC0/PMD8/RC0 — Remappable I/O, PMP data line, port C |
| Pin 19 | RPC1/PMD9/RC1 — Remappable I/O, PMP data line, port C |
| Pin 20 | RPC2/PMD10/RC2 — Remappable I/O, PMP data line, port C |
| Pin 21 | RPC3/PMD11/RC3 — Remappable I/O, PMP data line, port C |
| Pin 22 | RPC4/RC4 — Remappable I/O, port C |
| Pin 23 | RPC5/RC5 — Remappable I/O, port C |
| Pin 24 | RPC6/RC6 — Remappable I/O, port C |
| Pin 25 | RPC7/RC7 — Remappable I/O, port C |
| Pin 26 | RPB8/RB8 — Remappable I/O, port B |
| Pin 27 | RPB9/RB9 — Remappable I/O, port B |
| Pin 28 | VSS — Ground (also exposed thermal pad) |
Typical Applications
PIC32MM0064GPM028T-I/M6 is suitable for 6 applications: USB Human Interface Devices (HID), Battery-Powered IoT Sensor Nodes, Industrial Control and Monitoring, Low-Power Wearable Devices, Consumer USB Peripherals and Dongles, Smart Home and Building Automation.
USB Human Interface Devices (HID)
The PIC32MM0064GPM028T-I/M6's integrated USB 2.0 Full-Speed device/host/OTG transceiver makes it a natural fit for USB HID peripherals such as keyboards, mice, game controllers, and custom input devices. Its 25 MHz microAptiv UC core executes USB stack polling and HID report generation without offloading to a secondary controller, reducing BOM cost. With 64 KB ECC Flash it accommodates the full USB HID boot/report descriptor plus application logic, and 16 KB SRAM provides the HID report buffer and stack scratch. The 28-UQFN 4x4 mm footprint lets designers place the MCU directly under the USB connector, minimizing PCB area in compact peripherals.
Recommended
Battery-Powered IoT Sensor Nodes
The PIC32MM0064GPM028T-I/M6's 500 nA lowest sleep current per the Microchip PIC32MM GPM family datasheet makes it ideal for coin-cell or Li-ion powered IoT sensor nodes. The 2.0V to 3.6V supply range allows direct connection to a single Li-ion cell or two AA cells without boost regulation. The 12-bit 1.1 Msps ADC samples temperature, humidity, or analog sensor outputs while the microAptiv core remains idle, and on-chip peripherals (I2C, SPI, UART) interface to common digital sensors. ECC Flash protects against bit flips in extended outdoor deployments where temperature swings can stress the silicon.
Recommended
Industrial Control and Monitoring
Industrial control modules benefit from the PIC32MM0064GPM028T-I/M6's -40C to +125C industrial temperature range and ECC Flash protection. The 12-bit 1.1 Msps ADC handles fast analog sampling of process variables, while hardware timers trigger deterministic control loops at the 25 MHz core clock. The 28-UQFN 4x4 mm footprint with exposed pad enables placement near field wiring without thermal concerns at moderate ambient temperatures. ECC Flash detects and corrects single-bit errors that can occur in electrically noisy industrial environments, increasing MTBF for long-life installations.
Recommended
Low-Power Wearable Devices
Wearable designs leverage the PIC32MM0064GPM028T-I/M6's 500 nA sleep modes and 4x4 mm UQFN footprint to fit inside wristbands, fitness patches, and smart jewelry. The 2.0V to 3.6V supply range matches rechargeable Li-Po cells directly, eliminating boost converters. USB integration on the same die enables charging and firmware update via a standard micro-USB or USB-C connector without an external bridge. The 16 KB SRAM holds sensor fusion buffers while the ECC Flash stores fitness algorithms and BLE/BT proxy data.
Recommended
Consumer USB Peripherals and Dongles
USB dongles, headsets, and consumer peripherals commonly use the PIC32MM0064GPM028T-I/M6 to integrate USB device interface directly with application logic in a single chip. The on-chip Full-Speed USB transceiver with internal pull-up resistors reduces external BOM, and the 25 MHz core handles USB enumeration plus custom HID/vendor classes. The 4x4 mm UQFN package fits inside USB-A and USB-C connector shells, enabling single-sided PCB assemblies that drop straight into plastic enclosures.
Recommended
Smart Home and Building Automation
Smart-home sensors and controllers benefit from the PIC32MM0064GPM028T-I/M6's mix of USB for commissioning, low sleep current for battery-operated wireless nodes, and ECC Flash for reliability over multi-year deployment. Z-Wave, Zigbee, or LoRa daughter modules connect over UART/SPI while the MCU handles local logic and sensor fusion. The -40C to +125C rating supports outdoor weather sensors, and the 28-UQFN 4x4 mm package allows placement inside small enclosures such as wall switches or PIR sensor housings.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MM0064GPM028T-I/M6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MM0064GPM028-I/M6 | PIC32MM0064GPM028-I/ML | PIC32MM0064GPL028-I/ML |
|---|---|---|---|---|
| Package | 28-UQFN (M6) 4x4 mm | 28-UQFN (M6) 4x4 mm - same | 28-QFN (ML) - same die | 28-QFN (ML) - same family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | MIPS32 microAptiv UC, 25 MHz | MIPS32 microAptiv UC, 25 MHz | MIPS32 microAptiv UC, 25 MHz | MIPS32 microAptiv UC, 25 MHz |
| Flash | 64 KB ECC | 64 KB ECC | 64 KB ECC | 64 KB ECC |
| SRAM | 16 KB | 16 KB | 16 KB | 8 KB |
| USB | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | No USB |
| Operating Voltage | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Packaging Media | Tape & Reel | Tray | Tube | Tube |
Key Differentiators
- Integrated USB 2.0 Full-Speed with device/host/OTG (vs PIC32MM0064GPL028-I/ML)
- Tape-and-reel packaging for high-volume SMT assembly (vs PIC32MM0064GPM028-I/M6)
- 4x4 mm UQFN-28 package for ultra-compact designs (vs PIC32MM0064GPM028-I/SS (SSOP-28))
Design Notes
Decouple VDD with a 100 nF ceramic capacitor placed within 2 mm of the supply pin, plus a bulk 4.7 uF tantalum or ceramic. The exposed thermal pad must be soldered to a ground plane to provide thermal dissipation and a low-inductance ground return. Estimated: at 25 MHz active current of approximately 8 mA and VDD=3.3V, power dissipation is around 26 mW - the exposed pad is sufficient without an external heatsink.
Place the 28-UQFN 4x4 mm package on a 4-layer PCB with a continuous ground plane under the chip. Keep USB D+ and D- traces short, matched within 2 mm, and routed with 90-ohm differential impedance. Use 22-ohm series resistors on D+ and D- close to the MCU per Microchip PIC32MM GPM family datasheet recommendations. Maintain at least 4 mm keep-out around the crystal oscillator to minimize noise coupling.
Configuration mismatch on the OSCCON/SPLLCON registers will prevent USB enumeration: the USB module requires a precisely tuned 48 MHz PLL reference. Confirmed by Microchip errata - default configuration bits must select the correct oscillator mode. Also ensure firmware initializes the PMD (peripheral module disable) registers correctly; uninitialized peripherals waste current. Do not connect USB VBUS directly to VDD - the VBUS pin is for sensing only and lacks internal regulator protection.
Compliance Information
RoHS and REACH compliant per Microchip product page. Standard industrial grade; not AEC-Q100 qualified for automotive - choose a Q100-graded variant if required. Lead-free and halogen-free per Microchip environmental compliance documentation.
