PIC32MX564F064LT-I/BG - 80MHz 32-bit MCU, 64KB Flash | Microchip
料号： PIC32MX564F064LT-I/BG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $7.16 | $7.16 |
| 10 | $6.45 | $64.50 |
| 100 | $5.73 | $573.00 |
| 500 | $5.12 | $2,560.00 |
| 1,000 | $4.58 | $4,580.00 |
| 3,000 | $4.1 | $12,300.00 |
PIC32MX564F064LT-I/BG 概述
Background: A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash), data memory (RAM), and integrated peripherals such as timers, communication interfaces, and analog converters. The PIC32MX family sits in the hierarchy: 32-bit MCU -> MIPS M4K core MCU -> PIC32MX sub-family -> Microchip PIC microcontrollers -> microcontrollers -> semiconductors. USB OTG enables the device to act as both USB host and device without an external PHY.
Key features include 80 MHz core with 1.56 DMIPS/MHz performance, 64 KB Flash (32K x 8 organization), 32 KB SRAM, USB 2.0 full-speed OTG, two CAN 2.0B modules, four DMA channels (for offloading data movement from the CPU), and a 10-bit 1 Msps ADC with up to 16 channels. The 121-pin TFBGA package supports a wide peripheral pinout while keeping the PCB footprint compact (10x10 mm).
The M4K core implements the MIPS32 instruction set with hardware multiply/divide and a 5-stage pipeline. The peripheral set is mapped via a dedicated peripheral bus with bus matrix arbitration, allowing simultaneous DMA-driven peripheral activity and CPU execution. The 121-ball BGA exposes nearly every signal, enabling parallel bus interfaces and large pin-count designs.
Typical applications include USB peripherals (HID, CDC, MSD), CAN-based industrial nodes, embedded graphics with PMP-driven TFT displays, motor control, and multi-protocol gateway devices. Industrial and consumer segments favor the part because of the integrated USB and CAN.
When designing, ensure the 121-ball TFBGA PCB layout uses the recommended Microchip land pattern with via-in-pad or standard dog-bone fan-out, and respect the thermal pad connection for ground. The 2.5V/3.3V core rail and I/O rail must be decoupled with low-ESR ceramic capacitors placed close to each power ball.
This page synthesizes distributor pricing, drop-in alternatives sourced from the Microchip PIC32MX5xx family, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： PIC32MX564F064LT-I/BG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MX564F064LT-I/BG （相同外形与封装尺寸） ——差异在于 ADC, Core Architecture, Operating Voltage, Operating Temperature, USB.
快速对比工具——选择替代料号进行并排对比：
PIC32MX564F064L-I/BG
✅ 直接替换✓ 有现货
$4.45 / 个
查看数据手册 →PIC32MX564F128LT-I/BG
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MX564F128L-I/BG
✅ 直接替换✓ 有现货
$5.7 / 个
查看数据手册 →PIC32MX564F064LT-V/BG
✅ 直接替换✓ 有现货
$6.08 / 个
查看数据手册 →PIC32MX564F064LT-I/BG 最大额定值与电气特性
| Core | MIPS32 M4K |
| Core Architecture | MIPS32 |
| Core Frequency | 80 MHz |
| Performance | 1.56 DMIPS/MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| SRAM | 32 KB |
| Operating Voltage | 2.5 V / 3.3 V |
| ADC | 10-bit, up to 16 channels |
| DMA Channels | 4 |
| USB | USB 2.0 Full-Speed OTG |
| CAN | 2x CAN 2.0B |
| Parallel Master Port (PMP) | Yes (16-bit) |
| 封装 | 121-TFBGA (10x10 mm) |
| 工作温度 | -40C to +85C (Industrial, 'I') |
| 安装类型 | Surface Mount (BGA) |
| MSL 等级 | 3 (per JEDEC J-STD-020, 168 hours) |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
PIC32MX564F064LT-I/BG 121-tfbga (10x10 mm) 引脚配置指南
PIC32MX564F064LT-I/BG（121-tfbga (10x10 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC32MX564F064LT-I/BG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC32MX564F064LT-I/BG 适用于 7 应用s: USB Human Interface Device (HID), CAN-based Industrial Node, TFT Display Controller with PMP, Motor Control and BLDC Driver, Multi-Protocol Gateway (USB/CAN/UART), Data Acquisition and Logging Module, Audio Playback Device with USB Streaming.
USB Human Interface Device (HID)
The PIC32MX564F064LT-I/BG's integrated USB 2.0 Full-Speed OTG controller (no external PHY required) and 64 KB Flash with Microchip's USB Framework library make it ideal for HID peripherals such as keyboards, mice, game controllers, and custom input devices. The 80 MHz M4K core delivers 1.56 DMIPS/MHz, more than sufficient for HID polling and report descriptor processing. 32 KB SRAM comfortably holds USB endpoint buffers plus HID report FIFOs. Compared to MCUs requiring an external PHY, the integrated USB saves PCB area and BOM cost. The 121-TFBGA package exposes enough pins for matrix-scanned key arrays and indicator LEDs while staying compact.
推荐
CAN-based Industrial Node
The PIC32MX564F064LT-I/BG integrates two independent CAN 2.0B modules alongside USB OTG, a rare combination in the 32-bit MCU class. This makes it well-suited to industrial nodes that bridge CAN-bus sensors/actuators to USB for configuration or data upload. The 4-channel DMA offloads CAN message movement from the CPU, freeing the M4K core for protocol translation. The 10-bit ADC at up to 16 channels handles analog sensor inputs, while the 80 MHz core runs CANopen or DeviceNet stacks within 64 KB Flash. Industrial grade -40C to +85C supports factory floor deployment.
推荐
TFT Display Controller with PMP
The 16-bit Parallel Master Port (PMP) integrated on the PIC32MX564F064LT-I/BG drives TFT LCDs in 8-bit and 16-bit parallel modes, enabling graphical HMIs without an external display controller. The 121-TFBGA package exposes the full PMP bus plus additional GPIO for touch sensing, backlight control, and SD card interfaces. At 80 MHz the M4K core delivers enough throughput to refresh QVGA/WQVGA TFTs and run a lightweight UI library (e.g., Microchip MLA graphics) within 64 KB Flash. The PMP timing registers provide flexible setup/hold configuration to match most parallel TFT panels.
推荐
Motor Control and BLDC Driver
The 80 MHz MIPS32 M4K core, four DMA channels, and 10-bit ADC on the PIC32MX564F064LT-I/BG support sensorless and sensored BLDC/PMSM motor control loops. The DMA offloads ADC sample transfers, leaving the core to execute PI control and commutation logic at deterministic intervals. The MCPWM/OC/PWM outputs and 121-TFBGA pin count accommodate three-phase gate driver interfaces plus encoder feedback. Compared to discrete DSP solutions, PIC32MX564F064LT-I/BG saves PCB area and cost for sub-100W motor applications such as small pumps, fans, and e-bike auxiliaries.
推荐
Multi-Protocol Gateway (USB/CAN/UART)
The PIC32MX564F064LT-I/BG combines USB OTG, dual CAN 2.0B, multiple UARTs, I2C, and SPI on a single die, making it an efficient multi-protocol gateway for industrial automation and automotive diagnostics. Routing between USB host/device, CAN, and serial buses is handled by the 80 MHz M4K core with DMA acceleration, while 32 KB SRAM holds message buffers. The 121-TFBGA exposes every peripheral simultaneously, enabling standalone gateway designs without external bus switches. Industrial -40C to +85C operation supports factory and vehicle cabin use.
推荐
Data Acquisition and Logging Module
The 10-bit ADC (up to 16 channels), four DMA channels, and USB 2.0 Full-Speed on the PIC32MX564F064LT-I/BG make it suitable for USB-attached data acquisition modules that stream ADC samples to a host PC. DMA moves ADC samples into SRAM buffers without CPU intervention, while the USB CDC class provides a virtual COM port for real-time data streaming. The 64 KB Flash fits lightweight acquisition firmware, and 32 KB SRAM holds dual-buffer ping-pong acquisition streams. The 121-TFBGA exposes analog and digital I/O simultaneously for hybrid signal modules.
推荐
Audio Playback Device with USB Streaming
The PIC32MX564F064LT-I/BG integrates USB OTG, DMA, and an 80 MHz core capable of decoding compressed audio (ADPCM, WAV) over USB streaming into an external DAC via I2S or PWM. DMA keeps the audio buffer primed while the CPU services the USB stack. The 121-TFBGA exposes I2S, PWM, and GPIO for amplifier control and headphone jack sensing. Compared to MCUs without USB OTG, PIC32MX564F064LT-I/BG eliminates the need for an external USB codec chip, simplifying the BOM for low-cost consumer audio accessories.
推荐
推荐产品汇总
工程参考数据： PIC32MX564F064LT-I/BG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MX564F064L-I/BG | PIC32MX564F128LT-I/BG | PIC32MX564F128L-I/BG | PIC32MX564F064LT-V/BG |
|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | MIPS32 M4K 80 MHz | MIPS32 M4K 80 MHz | MIPS32 M4K 80 MHz | MIPS32 M4K 80 MHz | MIPS32 M4K 80 MHz |
| Flash | 64 KB | 64 KB | 128 KB | 128 KB | 64 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| CAN | 2x CAN 2.0B | 2x CAN 2.0B | 2x CAN 2.0B | 2x CAN 2.0B | 2x CAN 2.0B |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +105C (Extended) |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tray | Tape & Reel |
关键差异点
- Integrated USB OTG + Dual CAN in a 121-ball TFBGA （对比 PIC32MX564F064L-I/BG)
- Industrial temperature grade with same 64 KB Flash （对比 PIC32MX564F064LT-V/BG)
- Higher Flash upgrade path on identical footprint （对比 PIC32MX564F128LT-I/BG)
设计说明
Estimated: a 121-ball TFBGA at 0.8 mm pitch typically uses either via-in-pad with filled/capped vias or standard dog-bone fan-out to escape the inner ball grid. Use Microchip's recommended land pattern with NSMD pads to improve solder joint reliability. Maintain a continuous ground plane on the layer directly beneath the BGA to provide a low-impedance reference for high-speed signals and a thermal spreading path.
Route the USB DP/DM pair as a 90-ohm differential impedance with length matching within 150 mils. Keep total trace length under 50 mm to meet USB 2.0 Full-Speed signal integrity. Place the 15 kohm pull-down on D+ and the 1 kohm pull-up on D- (or D+) for device detection. For CAN, route TX/RX as 120-ohm differential and add common-mode chokes if the bus is exposed to ESD events.
Decouple each power ball with a 0.1 uF X7R ceramic capacitor placed within 2 mm of the pad. Add a bulk 10 uF ceramic on the main 3.3V rail. The PIC32MX564 has separate VDDCORE and VDDIO rails; both must be tied together for single-rail designs but should each have local decoupling. Hold the RESET line low until all rails are stable to avoid partial-state code execution.
Do not confuse the "L" suffix (low-power variant with USB/CAN) with the "H" suffix (high-performance variant) - they are NOT drop-in for the same package. The "I" suffix is industrial (-40C to +85C) while "V" is extended (-40C to +105C). Mismatching temperature grades in automotive under-hood applications is a common mistake. Also ensure the JTAG/TRACE pin mapping matches your debugger (e.g., PICkit 5) before laying out the board.
合规信息
RoHS and lead-free compliance per Microchip product page and Verified Web Data distributor listings. AEC-Q100 is not qualified on this part family; for automotive applications requiring AEC-Q100, look at PIC32MX-specific automotive grade variants. Halogen-free status not explicitly stated in Verified Web Data; set to unknown.
