NXP Semiconductors

TJA1124BHG/0Z - Quad LIN Master Transceiver | NXP

料号: TJA1124BHG/0Z ✓ 量产中
DHVQFN-24, plastic, thermal-enhanced very-thin quad flat package Package
最小起订量: 1 |

TJA1124BHG/0Z 概述

The NXP Semiconductors TJA1124BHG/0Z is a quad LIN master transceiver with four LIN channels, integrated pull-up resistors, and four receive-data outputs, packaged in a 24-terminal DHVQFN measuring 3.5 mm by 5.5 mm by 0.85 mm. The device converts transmit data streams from a LIN commander protocol controller into shaped LIN bus signals and transfers received bus data to a microcontroller through RXD1 through RXD4.

A LIN transceiver is an interface IC that connects a low-speed serial controller to a LIN bus. LIN, or Local Interconnect Network, is used for distributed automotive and industrial nodes that need inexpensive, robust communication over a single wired bus. Within the interface hierarchy, the TJA1124 belongs to the LIN transceiver class, automotive network interface IC category, and broader semiconductor product family.

The TJA1124 integrates pull-up resistors for the four LIN commander outputs, reducing the number of external components required in a LIN bus arrangement. Its four-channel architecture lets one controller package serve several LIN nodes or zones without requiring four separate physical-layer transceivers. The package uses a 0.5 mm terminal pitch and a plastic, dual-inline-compatible, thermally enhanced very-thin quad flat package construction.

According to the NXP TJA1124 datasheet, transmit data streams generated by the LIN commander protocol controller are converted into optimized bus signals shaped to minimize electromagnetic emissions. The LIN commander output pins are pulled high through internal termination resistors. Corresponding receivers detect incoming LIN bus data and present it to the host controller on RXD1, RXD2, RXD3, and RXD4.

Typical uses include four-channel LIN aggregation in automotive body, comfort, seat, lighting, and door modules; LIN gateways; industrial distributed control systems; and embedded controllers requiring several bus interfaces. A microcontroller can manage wake-up, framing, diagnostics, and higher-level LIN traffic while the TJA1124 handles the physical bus connection and signal shaping.

PCB implementation should account for the 0.5 mm terminal pitch, thermal-enhanced package, exposed pad, and high-speed edge behavior. Follow the land pattern, exposed-pad soldering, and decoupling recommendations in the manufacturer datasheet. Confirm bus levels, pull-up requirements, transceiver mode behavior, and EMC margins against the target LIN network before production release.

This page organizes the manufacturer documentation, package information, interface alternatives, application guidance, and engineering design notes needed to evaluate the TJA1124BHG/0Z as a four-channel LIN physical-layer interface.

直接替换替代料: TJA1124BHG/0Z ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

TJA1124AHG/0Z

✅ 直接替换 ⚠️ 规格未核验
NXP Semiconductors
📦 DHVQFN-24
Quad LIN transceiver · 4 channels · 4 transmit and 4 receive channels · Yes · Enabled through internal termination resistors · 24-DHVQFN, 5.5 mm x 3.5 mm · 24 terminals · Surface mount

联系询价

查看数据手册 →

TJA1124BHG/1Z

✅ 直接替换
📦 DHVQFN-24
Same TJA1124BHG family and DHVQFN-24 package; orderable suffix may change grade or qualification without changing the pin count

📋 参考替代料(不在目录中)

TJA1124AHG/1Z

✅ 直接替换 ⚠️ 规格未核验
📦 DHVQFN-24
Same four-channel TJA1124 family in DHVQFN-24; A-versus-B and suffix-specific grade differences require datasheet confirmation

📋 参考替代料(不在目录中)

TJA1124AHG

✅ 直接替换 ⚠️ 规格未核验
📦 DHVQFN-24
Same TJA1124AHG base device and four-channel LIN architecture in DHVQFN-24; orderable-code differences must be verified

📋 参考替代料(不在目录中)

TJA1124AHG/T

✅ 直接替换 ⚠️ 规格未核验
📦 DHVQFN-24
Same TJA1124AHG device in DHVQFN-24 with a different orderable suffix; suffix details must be confirmed before procurement

📋 参考替代料(不在目录中)

TJA1124BHG/0Z 规格参数

Product Type Quad LIN master transceiver
Number of LIN Channels 4 channels
Transceiver Configuration 4 transmit and 4 receive channels
Receive Data Outputs RXD1 through RXD4
Integrated Pull-Up Resistors 4 internal LIN commander pull-up resistors
Package Type DHVQFN-24, plastic, thermal-enhanced very-thin quad flat package
Terminal Count 24 terminals
Terminal Pitch 0.5 mm
Package Length 5.5 mm
Package Width 3.5 mm
Package Height 0.85 mm
安装类型 Surface mount
Terminal Finish Nickel palladium gold silver
JESD-609 Code e4
Moisture Sensitivity Level MSL 1
Peak Reflow Temperature 260 C
Maximum Time at Peak Reflow Temperature 30 s

TJA1124BHG/0Z 0.85 mm 引脚配置指南

TJA1124BHG/0Z(0.85 mm 封装)的引脚配置。 引脚编号、功能和连接图在制造商数据手册中定义。请参阅该手册以了解确切的封装尺寸和焊接指南。

TJA1124BHG/0Z 的 0.85 mm 封装引脚图

暂无详细引脚数据: TJA1124BHG/0Z.

请参阅 数据手册 以查看完整引脚配置。

典型应用

TJA1124BHG/0Z 适用于 6 应用s: Automotive Body Control Module, Vehicle Lighting Control, Door and Seat Module, Industrial LIN Gateway, Distributed Sensor Node, Robotics Control Network.

🚗

Automotive Body Control Module

The TJA1124BHG/0Z fits automotive body-control and comfort modules that must connect one host controller to four LIN sub-buses. Its four-channel architecture consolidates commander interfaces, while integrated pull-up resistors simplify the transmitter side of each network. The NXP TJA1124 datasheet states that outgoing commander data is shaped to minimize electromagnetic emissions, a useful characteristic where switch-node wiring, display loads, seat motors, and climate-control actuators share an electrical environment. Place the device according to the manufacturer’s 24-terminal DHVQFN land pattern and route each LIN connection away from sensitive analog and clock paths.

💡

Vehicle Lighting Control

The TJA1124BHG/0Z can provide four LIN physical interfaces for a lighting-control module controlling separate lamp clusters, switches, or powered accessories. Integrated commander pull-up resistors reduce the discrete-component burden on each bus, while RXD1 through RXD4 give the host controller four independent receive paths. The transmitter’s EME-conscious signal shaping is valuable in vehicles where long harness branches and fast switching edges can create electromagnetic compatibility challenges. Final bus timing, electrical levels, and network topology must be validated in the complete vehicle load and harness environment.

🚗

Door and Seat Module

The TJA1124BHG/0Z is appropriate for door and seat modules that connect multiple LIN-controlled locks, motors, switches, or sensors to a regional controller. A four-channel device allows one controller package to manage several low-speed networks while maintaining separate RXD outputs for received bus data. Its 24-terminal DHVQFN body is compact enough for space-constrained modules, but the 0.5 mm pitch requires careful assembly and inspection. Check exposed-pad soldering and clean return paths to maintain signal integrity across all four channels.

🏭

Industrial LIN Gateway

The TJA1124BHG/0Z can form the LIN-facing side of an industrial gateway that bridges a microcontroller or embedded controller to four distributed low-speed nodes. The NXP TJA1124 datasheet identifies four receive outputs and integrated pull-up resistors on the commander outputs, making it suitable for consolidating physical interfaces without redesigning the host firmware. LIN networks are attractive for inexpensive sensors, actuators, and service modules over long wiring runs. The gateway must still implement correct LIN framing, timing, fault recovery, and bus-management functions above the physical layer.

🧩

Distributed Sensor Node

The TJA1124BHG/0Z is useful in a distributed sensor assembly that gathers data from several LIN-connected remote sensors while exposing four receive-data paths to a local controller. The integrated pull-up function supports the commander-side network arrangement, and shaped bus transitions help limit unwanted electromagnetic emissions around sensitive sensor wiring. Use short, controlled routing for each LIN channel and follow the manufacturer’s decoupling and exposed-pad guidance. Because this is a transceiver rather than a complete LIN protocol controller, the host must handle command frames, checksums, diagnostics, and scheduling.

🏭

Robotics Control Network

The TJA1124BHG/0Z can support robot and factory-equipment controllers that use several LIN-connected modules for motors, end-effectors, presence sensors, or operator stations. Consolidating four physical-layer channels can reduce the number of separate transceiver packages and simplify the controller’s bus allocation. Its signal shaping is designed to minimize electromagnetic emissions, which helps when the robot contains motor drivers, relays, and switching power converters operating near the wiring harness. Validate immunity, fault behavior, and node timing under the actual industrial noise environment.

What is the TJA1124BHG/0Z?
The TJA1124BHG/0Z is a NXP Semiconductors quad LIN master transceiver with four LIN channels, integrated pull-up resistors, and four receiver outputs. According to the NXP TJA1124 datasheet, it converts commander-controller transmit data into shaped LIN bus signals and delivers received data through RXD1 through RXD4. The device is supplied in a 24-terminal DHVQFN package measuring 3.5 mm by 5.5 mm by 0.85 mm.
How many LIN buses can TJA1124BHG/0Z support?
The TJA1124BHG/0Z supports four LIN channels in one package. Each channel provides a commander-side bus interface and a corresponding receive-data path identified as RXD1 through RXD4. According to the NXP TJA1124 datasheet, its integrated pull-up resistors are associated with the LIN commander outputs, allowing the interface to replace four separate single-channel physical-layer devices when the host controller and PCB architecture can support four buses.
What is the TJA1124BHG/0Z package?
The TJA1124BHG/0Z uses a 24-terminal DHVQFN package with a 0.5 mm terminal pitch. The NXP product information identifies the body dimensions as 3.5 mm by 5.5 mm by 0.85 mm and describes it as a plastic, dual-inline-compatible, thermal-enhanced very-thin quad flat package. Use the manufacturer land-pattern and exposed-pad assembly instructions when laying out the PCB.
Where can I download the TJA1124BHG/0Z datasheet PDF?
The official TJA1124 datasheet PDF is available from NXP at https://www.nxp.com/docs/en/data-sheet/TJA1124.pdf. The document is titled “Quad LIN commander transceiver” and provides the authoritative product specification, package information, operating limits, interface behavior, and application guidance. The related NXP product page for TJA1124BHG is available at https://www.nxp.com/part/TJA1124BHG.
Where can I find the TJA1124BHG/0Z pinout?
The TJA1124BHG/0Z pin assignment is shown in the NXP TJA1124 datasheet at https://www.nxp.com/docs/en/data-sheet/TJA1124.pdf. Use the pin-description and package-drawing sections to assign LIN, RXD, supply, ground, control, and exposed-pad connections. The verified product information confirms a 24-terminal DHVQFN with 0.5 mm pitch, but it does not reproduce the complete numbered pin table on this page.
Does the TJA1124BHG/0Z have integrated pull-up resistors?
The TJA1124BHG/0Z includes integrated pull-up resistors for its four LIN commander outputs. The NXP TJA1124 datasheet states that the LIN bus output pins are pulled high through internal termination resistors. This integration can simplify the physical layer and reduce discrete-component count, but the final external resistor configuration should still follow the datasheet for the selected bus voltage, transceiver mode, and network topology.
How does the TJA1124BHG/0Z shape LIN bus signals?
The TJA1124BHG/0Z converts transmit streams from a LIN commander protocol controller into optimized bus signals shaped to minimize electromagnetic emissions. According to the NXP TJA1124 datasheet, this signal-shaping function occurs in the physical-layer transmitter, while separate receivers detect incoming bus data and transfer it to the host controller through RXD1 through RXD4.
Is TJA1124BHG/0Z suitable for automotive body modules?
The TJA1124BHG/0Z is suited to LIN-based automotive body and comfort modules where one controller needs several LIN connections. Its four integrated channels and internal pull-up resistors can consolidate four commander interfaces, while the NXP TJA1124 datasheet provides the authoritative operating and package limits. Confirm the exact temperature range, automotive qualification status, and bus-network requirements before using it in a safety- or vehicle-level design.
TJA1124BHG/0Z vs TJA1124BHG/1Z - which should I select?
TJA1124BHG/0Z and TJA1124BHG/1Z are variants within the same NXP TJA1124BHG family and share the 24-terminal DHVQFN format, but the verified material does not identify the functional difference between their suffix codes. The NXP TJA1124 datasheet and ordering information should be used to confirm temperature grade, qualification, or orderable configuration. Do not interchange the suffixes solely from the package designation.
When should I choose TJA1124BHG/0Z over a single-channel LIN transceiver?
Choose the TJA1124BHG/0Z when one host controller must connect to four LIN channels and the PCB can allocate the 24-terminal footprint. Compared with four separate single-channel transceivers, its four-channel integration can reduce routing duplication, component count, and package space while keeping the commander-side pull-up function local. Select a single-channel device instead when only one bus is required or when independent supply and enable sequencing is more important than consolidation.
What can replace the TJA1124BHG/0Z?
The closest supported replacements are same-package members of the NXP TJA1124 family, including TJA1124AHG/0Z and TJA1124BHG/1Z, subject to confirming their exact orderable configuration and electrical ratings. No verified cross-brand, pin-to-pin drop-in equivalent was identified. Because TJA1124 variants may differ in grade or ordering suffix, review the NXP datasheet and product documentation before treating any candidate as a production substitute.
What is the best NXP equivalent for the TJA1124BHG/0Z?
The TJA1124AHG/0Z is the closest same-brand family alternative identified for the TJA1124BHG/0Z because both use the NXP TJA1124 naming family and the DHVQFN-24 package format. It is not automatically interchangeable because the verified material does not define the A-versus-B functional differences or all orderable suffix ratings. Compare the complete datasheet specifications, exposed-pad layout, and grade requirements before substitution.
Where can I buy TJA1124BHG/0Z and what is its price?
The TJA1124BHG/0Z can be requested through the “Request a Quote” form on this page, where current commercial terms should be confirmed for the exact suffix and package code. The available distributor snippets do not print a qualifying quantity-break price table for this exact MPN, so no static price figure is reproduced here. Stock and lead time should also be requested through the same quote workflow.
What is the lead time for TJA1124BHG/0Z?
The current lead time for TJA1124BHG/0Z should be obtained through the “Request a Quote” form on this page. The verified listings confirm that the exact part is offered by NXP and multiple component channels, but they do not state a consistent manufacturing lead time or guaranteed stock quantity. Providing the requested quantity, target date, and required packaging details will allow procurement to confirm the appropriate supply commitment.
Is TJA1124BHG/0Z in stock?
Current stock for TJA1124BHG/0Z should be confirmed through the “Request a Quote” form on this page. One listing describes the component as in stock, while other listings are catalog or search pages without a guaranteed quantity for the exact orderable suffix. Because inventory can change rapidly, use the quote form for quantity-specific availability rather than relying on a general listing status.
What are the key specifications of TJA1124BHG/0Z that engineers should know?
The key TJA1124BHG/0Z specifications are four LIN channels, four commander-side integrated pull-up resistors, four receive-data outputs, and signal shaping designed to minimize electromagnetic emissions. The NXP TJA1124 datasheet also identifies a 24-terminal DHVQFN package with 0.5 mm pitch and dimensions of 3.5 mm by 5.5 mm by 0.85 mm. Use those package and channel facts as the basis for footprint, routing, and four-bus architecture checks.
What design constraints matter when laying out a TJA1124BHG/0Z PCB?
The principal PCB constraints are the 24-terminal DHVQFN footprint, 0.5 mm terminal pitch, exposed thermal pad, and the need for clean routing of four LIN channels and their associated supply and control connections. Follow the NXP datasheet land pattern and exposed-pad assembly guidance rather than creating a footprint from the package dimensions alone. LIN edge behavior and electromagnetic-emission control also make careful return paths and decoupling important.

工程参考数据: TJA1124BHG/0Z ——对比、设计指导和合规信息。

选型指南

Choose the TJA1124BHG/0Z when a host controller needs four LIN commander interfaces and the exact NXP B-series ordering code matches the product specification. Its integrated pull-up resistors and four RXD outputs can reduce discrete circuitry and simplify a multi-channel physical-layer layout. Use another TJA1124 family code only after confirming the A-versus-B functional difference, temperature grade, qualification, and orderable suffix in the manufacturer documentation. A single-channel LIN transceiver is preferable when only one bus is required or independent supply sequencing is essential. No verified cross-brand drop-in alternative was identified, so changing manufacturers would require a new footprint, electrical review, and EMC validation rather than a simple substitution.

与替代料对比

参数 本产品 TJA1124AHG/0Z TJA1124BHG/1Z TJA1124AHG/1Z TJA1124AHG TJA1124AHG/T
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package DHVQFN-24 DHVQFN-24 DHVQFN-24 DHVQFN-24 DHVQFN-24 DHVQFN-24
Product Type Quad LIN master transceiver Quad LIN transceiver family Quad LIN transceiver family Quad LIN transceiver family Quad LIN transceiver family Quad LIN transceiver family
LIN Channels 4 4 4 4 4 4
Terminal Count 24 24 24 24 24 24
Terminal Pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Body Dimensions 3.5 mm x 5.5 mm x 0.85 mm 3.5 mm x 5.5 mm x 0.85 mm 3.5 mm x 5.5 mm x 0.85 mm 3.5 mm x 5.5 mm x 0.85 mm 3.5 mm x 5.5 mm x 0.85 mm 3.5 mm x 5.5 mm x 0.85 mm

关键差异点

  • Four independent LIN channels in one IC (对比 TJA1124AHG/0Z)
  • Integrated pull-up resistors on commander outputs (对比 TJA1124AHG/1Z)
  • Four dedicated receive-data paths (对比 TJA1124BHG/1Z)

设计说明

Use the exact 24-terminal DHVQFN land pattern from the NXP TJA1124 datasheet rather than deriving it from the 3.5 mm by 5.5 mm body dimensions. The 0.5 mm terminal pitch requires accurate pad and solder-mask geometry, while the thermal-enhanced exposed pad needs the manufacturer’s recommended via and solder fillet arrangement. Maintain assembly clearances around the package and verify the stencil design during PCB qualification.

Route each LIN connection as a controlled bus branch with a continuous return path and avoid sharing sensitive high-impedance traces with long bus runs. Keep the four channel connections physically organized because simultaneous edge activity can increase crosstalk and emissions. Follow the datasheet recommendations for decoupling, grounding, and exposed-pad connection, and avoid placing test points or long stubs that could distort LIN edge behavior.

The NXP TJA1124 datasheet states that transmitted commander data is converted into optimized bus signals shaped to minimize electromagnetic emissions. Preserve those characteristics by using the prescribed bus topology, avoiding unnecessary stubs, and terminating or filtering branches as required by the LIN network design. Validate radiated and conducted emissions in the final module because harness geometry, switching converters, and load currents can materially change system-level EMC performance.

Do not treat the TJA1124BHG/0Z as a complete LIN protocol controller. The transceiver converts commander data into physical bus signals and returns received data on RXD1 through RXD4, but the host controller must implement LIN scheduling, framing, checksums, diagnostics, and fault recovery. Also verify the A-versus-B family difference and orderable suffix before substituting another TJA1124 code.

合规信息

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
无铅
Unknown
无卤
Unknown
冲突矿物
Unknown

The verified product information identifies JESD-609 code e4, MSL 1, a 260 C peak reflow temperature, and a 30-second maximum time at peak reflow. It does not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status.

数据核验日期: 2026-11-03 ——数据由 XAIPART 元器件工程团队核验和整理

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