TJA1124BHG/0Z - Quad LIN Master Transceiver | NXP
MPN: TJA1124BHG/0Z ✓ ActiveTJA1124BHG/0Z Overview
A LIN transceiver is an interface IC that connects a low-speed serial controller to a LIN bus. LIN, or Local Interconnect Network, is used for distributed automotive and industrial nodes that need inexpensive, robust communication over a single wired bus. Within the interface hierarchy, the TJA1124 belongs to the LIN transceiver class, automotive network interface IC category, and broader semiconductor product family.
The TJA1124 integrates pull-up resistors for the four LIN commander outputs, reducing the number of external components required in a LIN bus arrangement. Its four-channel architecture lets one controller package serve several LIN nodes or zones without requiring four separate physical-layer transceivers. The package uses a 0.5 mm terminal pitch and a plastic, dual-inline-compatible, thermally enhanced very-thin quad flat package construction.
According to the NXP TJA1124 datasheet, transmit data streams generated by the LIN commander protocol controller are converted into optimized bus signals shaped to minimize electromagnetic emissions. The LIN commander output pins are pulled high through internal termination resistors. Corresponding receivers detect incoming LIN bus data and present it to the host controller on RXD1, RXD2, RXD3, and RXD4.
Typical uses include four-channel LIN aggregation in automotive body, comfort, seat, lighting, and door modules; LIN gateways; industrial distributed control systems; and embedded controllers requiring several bus interfaces. A microcontroller can manage wake-up, framing, diagnostics, and higher-level LIN traffic while the TJA1124 handles the physical bus connection and signal shaping.
PCB implementation should account for the 0.5 mm terminal pitch, thermal-enhanced package, exposed pad, and high-speed edge behavior. Follow the land pattern, exposed-pad soldering, and decoupling recommendations in the manufacturer datasheet. Confirm bus levels, pull-up requirements, transceiver mode behavior, and EMC margins against the target LIN network before production release.
This page organizes the manufacturer documentation, package information, interface alternatives, application guidance, and engineering design notes needed to evaluate the TJA1124BHG/0Z as a four-channel LIN physical-layer interface.
Drop-in alternatives for TJA1124BHG/0Z — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
TJA1124AHG/0Z
✅ Drop-In ⚠️ Specs UnverifiedContact for price
View Datasheet →TJA1124BHG/1Z
✅ Drop-In📋 Reference alternative (not in catalog)
TJA1124AHG/1Z
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
TJA1124AHG
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
TJA1124AHG/T
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
TJA1124BHG/0Z Specifications
| Product Type | Quad LIN master transceiver |
| Number of LIN Channels | 4 channels |
| Transceiver Configuration | 4 transmit and 4 receive channels |
| Receive Data Outputs | RXD1 through RXD4 |
| Integrated Pull-Up Resistors | 4 internal LIN commander pull-up resistors |
| Package Type | DHVQFN-24, plastic, thermal-enhanced very-thin quad flat package |
| Terminal Count | 24 terminals |
| Terminal Pitch | 0.5 mm |
| Package Length | 5.5 mm |
| Package Width | 3.5 mm |
| Package Height | 0.85 mm |
| Mounting Type | Surface mount |
| Terminal Finish | Nickel palladium gold silver |
| JESD-609 Code | e4 |
| Moisture Sensitivity Level | MSL 1 |
| Peak Reflow Temperature | 260 C |
| Maximum Time at Peak Reflow Temperature | 30 s |
TJA1124BHG/0Z 0.85 mm Pin Configuration Guide
Pin configuration for TJA1124BHG/0Z (0.85 mm package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for TJA1124BHG/0Z.
Refer to the datasheet for full pin configuration.
Typical Applications
TJA1124BHG/0Z is suitable for 6 applications: Automotive Body Control Module, Vehicle Lighting Control, Door and Seat Module, Industrial LIN Gateway, Distributed Sensor Node, Robotics Control Network.
Automotive Body Control Module
The TJA1124BHG/0Z fits automotive body-control and comfort modules that must connect one host controller to four LIN sub-buses. Its four-channel architecture consolidates commander interfaces, while integrated pull-up resistors simplify the transmitter side of each network. The NXP TJA1124 datasheet states that outgoing commander data is shaped to minimize electromagnetic emissions, a useful characteristic where switch-node wiring, display loads, seat motors, and climate-control actuators share an electrical environment. Place the device according to the manufacturer’s 24-terminal DHVQFN land pattern and route each LIN connection away from sensitive analog and clock paths.
Recommended
Vehicle Lighting Control
The TJA1124BHG/0Z can provide four LIN physical interfaces for a lighting-control module controlling separate lamp clusters, switches, or powered accessories. Integrated commander pull-up resistors reduce the discrete-component burden on each bus, while RXD1 through RXD4 give the host controller four independent receive paths. The transmitter’s EME-conscious signal shaping is valuable in vehicles where long harness branches and fast switching edges can create electromagnetic compatibility challenges. Final bus timing, electrical levels, and network topology must be validated in the complete vehicle load and harness environment.
Recommended
Door and Seat Module
The TJA1124BHG/0Z is appropriate for door and seat modules that connect multiple LIN-controlled locks, motors, switches, or sensors to a regional controller. A four-channel device allows one controller package to manage several low-speed networks while maintaining separate RXD outputs for received bus data. Its 24-terminal DHVQFN body is compact enough for space-constrained modules, but the 0.5 mm pitch requires careful assembly and inspection. Check exposed-pad soldering and clean return paths to maintain signal integrity across all four channels.
Recommended
Industrial LIN Gateway
The TJA1124BHG/0Z can form the LIN-facing side of an industrial gateway that bridges a microcontroller or embedded controller to four distributed low-speed nodes. The NXP TJA1124 datasheet identifies four receive outputs and integrated pull-up resistors on the commander outputs, making it suitable for consolidating physical interfaces without redesigning the host firmware. LIN networks are attractive for inexpensive sensors, actuators, and service modules over long wiring runs. The gateway must still implement correct LIN framing, timing, fault recovery, and bus-management functions above the physical layer.
Recommended
Distributed Sensor Node
The TJA1124BHG/0Z is useful in a distributed sensor assembly that gathers data from several LIN-connected remote sensors while exposing four receive-data paths to a local controller. The integrated pull-up function supports the commander-side network arrangement, and shaped bus transitions help limit unwanted electromagnetic emissions around sensitive sensor wiring. Use short, controlled routing for each LIN channel and follow the manufacturer’s decoupling and exposed-pad guidance. Because this is a transceiver rather than a complete LIN protocol controller, the host must handle command frames, checksums, diagnostics, and scheduling.
Recommended
Robotics Control Network
The TJA1124BHG/0Z can support robot and factory-equipment controllers that use several LIN-connected modules for motors, end-effectors, presence sensors, or operator stations. Consolidating four physical-layer channels can reduce the number of separate transceiver packages and simplify the controller’s bus allocation. Its signal shaping is designed to minimize electromagnetic emissions, which helps when the robot contains motor drivers, relays, and switching power converters operating near the wiring harness. Validate immunity, fault behavior, and node timing under the actual industrial noise environment.
Recommended
Recommended Products Summary
Engineering reference data for TJA1124BHG/0Z — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TJA1124AHG/0Z | TJA1124BHG/1Z | TJA1124AHG/1Z | TJA1124AHG | TJA1124AHG/T |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | DHVQFN-24 | DHVQFN-24 | DHVQFN-24 | DHVQFN-24 | DHVQFN-24 | DHVQFN-24 |
| Product Type | Quad LIN master transceiver | Quad LIN transceiver family | Quad LIN transceiver family | Quad LIN transceiver family | Quad LIN transceiver family | Quad LIN transceiver family |
| LIN Channels | 4 | 4 | 4 | 4 | 4 | 4 |
| Terminal Count | 24 | 24 | 24 | 24 | 24 | 24 |
| Terminal Pitch | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| Body Dimensions | 3.5 mm x 5.5 mm x 0.85 mm | 3.5 mm x 5.5 mm x 0.85 mm | 3.5 mm x 5.5 mm x 0.85 mm | 3.5 mm x 5.5 mm x 0.85 mm | 3.5 mm x 5.5 mm x 0.85 mm | 3.5 mm x 5.5 mm x 0.85 mm |
Key Differentiators
- Four independent LIN channels in one IC (vs TJA1124AHG/0Z)
- Integrated pull-up resistors on commander outputs (vs TJA1124AHG/1Z)
- Four dedicated receive-data paths (vs TJA1124BHG/1Z)
Design Notes
Use the exact 24-terminal DHVQFN land pattern from the NXP TJA1124 datasheet rather than deriving it from the 3.5 mm by 5.5 mm body dimensions. The 0.5 mm terminal pitch requires accurate pad and solder-mask geometry, while the thermal-enhanced exposed pad needs the manufacturer’s recommended via and solder fillet arrangement. Maintain assembly clearances around the package and verify the stencil design during PCB qualification.
Route each LIN connection as a controlled bus branch with a continuous return path and avoid sharing sensitive high-impedance traces with long bus runs. Keep the four channel connections physically organized because simultaneous edge activity can increase crosstalk and emissions. Follow the datasheet recommendations for decoupling, grounding, and exposed-pad connection, and avoid placing test points or long stubs that could distort LIN edge behavior.
The NXP TJA1124 datasheet states that transmitted commander data is converted into optimized bus signals shaped to minimize electromagnetic emissions. Preserve those characteristics by using the prescribed bus topology, avoiding unnecessary stubs, and terminating or filtering branches as required by the LIN network design. Validate radiated and conducted emissions in the final module because harness geometry, switching converters, and load currents can materially change system-level EMC performance.
Do not treat the TJA1124BHG/0Z as a complete LIN protocol controller. The transceiver converts commander data into physical bus signals and returns received data on RXD1 through RXD4, but the host controller must implement LIN scheduling, framing, checksums, diagnostics, and fault recovery. Also verify the A-versus-B family difference and orderable suffix before substituting another TJA1124 code.
Compliance Information
The verified product information identifies JESD-609 code e4, MSL 1, a 260 C peak reflow temperature, and a 30-second maximum time at peak reflow. It does not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status.
