TPSM82866A - 6A Step-Down Power Module | Texas Instruments
料号： TPSM82866AA0SRDJR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $5.2 | $5.20 |
| 10 | $4.68 | $46.80 |
| 100 | $4.16 | $416.00 |
| 500 | $3.75 | $1,875.00 |
| 1,000 | $3.4 | $3,400.00 |
TPSM82866AA0SRDJR 概述
A step-down power module is a complete DC-DC converter solution that integrates the controller, power FETs, and inductor into a single package. Belonging to the power management IC family of non-isolated point-of-load (PoL) converters, such modules reduce design complexity, minimize PCB area, and improve thermal performance compared to discrete buck converter designs, which is essential for powering modern digital loads.
Key features include 6A continuous output current, high efficiency, and DCS-Control topology for fast transient response and stable operation. The integrated 220nH shielded inductor (±20% tolerance in RDJ/RDM packages) provides excellent EMI performance. The module offers power-good output, enable pin, and adjustable switching frequency for flexible power sequencing and design optimization.
Technically, the TPSM8286xA family uses the DCS-Control (Direct Control with Seamless transition into energy saving mode) architecture, delivering fixed-frequency operation with excellent load and line regulation. The TPSM82864A and TPSM82866A in RDJ and RDM packages are pin-to-pin and BOM-to-BOM compatible, allowing a 4A option on the same footprint. The TPSM8286xAA0HRDMR variants provide higher efficiency due to increased package height, and the RCF MagPack variant uses a 200nH inductor with enhanced EMI shielding.
Typical applications include core power supplies for FPGAs, CPUs, and ASICs, optical modules, and medical and industrial equipment, where board space is at a premium and high current density is required.
When designing with this module, ensure adequate input and output capacitance for stability. The integrated inductor simplifies layout, but proper grounding and thermal vias remain essential for optimal thermal performance at full 6A load.
直接替换替代料： TPSM82866AA0SRDJR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
TPSM82864AA0SRDJR
✅ 直接替换📋 参考替代料（不在目录中）
TPSM82866AA0HRDMR
✅ 直接替换📋 参考替代料（不在目录中）
TPSM82866AA0SRDJR 最大额定值与电气特性
| 拓扑 | Synchronous Step-Down (Buck) Module |
| 输入电压范围 | 2.4 V to 5.5 V |
| 输出电压范围 | 0.6 V to 5.5 V (adjustable) |
| Output Current | 6 A |
| Control Topology | DCS-Control |
| Integrated Inductor | 220 nH (RDJ/RDM), ±20% tolerance |
| 输出数量 | 1 |
| 封装 | Overmolded QFN (RDJ) 3.5 mm x 4.0 mm |
| 安装类型 | Surface Mount |
| 特性 | Enable, Power Good, Soft-Start, Integrated Inductor |
| Applications | FPGA/CPU/ASIC core supply, optical modules, medical, industrial |
| Type | Non-Isolated PoL Module |
| Isolation | Non-Isolated |
| Pin Compatibility | Pin-to-pin and BOM-to-BOM compatible with TPSM82864A (RDJ/RDM) |
| RoHS 状态 | Compliant |
TPSM82866AA0SRDJR 引脚配置
| 引脚 1 | PVIN — Power input supply (2.4V to 5.5V) |
| 引脚 2 | EN — Enable pin |
| 引脚 3 | RT/CLK — Frequency set / synchronization |
| 引脚 4 | SS/TR — Soft-start / tracking |
| 引脚 5 | VSENSE — Feedback voltage sense |
| 引脚 6 | AGND — Analog ground |
| 引脚 7 | PGND — Power ground |
| 引脚 8 | SW — Switch node (internal inductor) |
| 引脚 9 | VOUT — Regulated output (0.6V to 5.5V) |
| 引脚 10 | PGOOD — Power good indicator (open drain) |
| 引脚 11 | VIN — Analog input supply |
| 引脚 12 | NC/GND — [DATA_NEEDED: exact pin functions - consult datasheet SLUSEF1B] |
典型应用
TPSM82866AA0SRDJR 适用于 6 应用s: FPGA Core Power Supply, CPU / ASIC Point-of-Load, Optical Modules, Medical Equipment, Industrial Automation, Test and Measurement Instruments.
FPGA Core Power Supply
The TPSM82866A fits FPGA core rails (0.6V-1.0V typ) with its 6A continuous output and DCS-Control fast transient response, which handles the sharp load steps of block enable/disable events. The integrated 220nH inductor and small 3.5mm x 4.0mm footprint allow placement directly beside the FPGA power pins, reducing parasitic impedance. Place it between a 5V or 3.3V rail and the VCCINT pin with adequate ceramic output capacitance; the trade-off is verifying thermal vias under the QFN for full-load dissipation.
推荐
CPU / ASIC Point-of-Load
For processor core supplies, the TPSM82866A provides 6A from a 2.4V-5.5V bus with power-good output for sequencing supervision and an enable pin for rail ordering. DCS-Control topology delivers fast load transient response needed by bursty digital cores, while the shielded integrated inductor reduces EMI near sensitive logic. The pin-to-pin compatible 4A TPSM82864A lets one PCB serve multiple processor tiers. Design consideration: size input capacitance for the 5V rail RMS ripple current at full 6A load.
推荐
Optical Modules
Optical transceiver modules demand compact, efficient power conversion in tight form factors such as QSFP and OSFP. The TPSM82866A's 3.5mm x 4.0mm overmolded QFN with integrated inductor fits these height- and area-constrained boards, and its shielded magnetics limit EMI near high-speed serializer circuits. Operating from a 3.3V or 5V host rail, it powers laser driver and DSP cores at up to 6A. The MagPack RCF variant offers even better EMI shielding where optical link margins are tight.
推荐
Medical Equipment
Medical electronics such as patient monitors and portable diagnostics benefit from the TPSM82866A's small footprint, integrated shielding, and wide 2.4V-5.5V input that tolerates battery rail variation. The power-good flag supports safety monitoring of the supply rail, and soft-start limits inrush during power-up of sensitive front-end circuitry. Its high efficiency reduces thermal load inside sealed enclosures. Designers should confirm creepage/clearance and isolation requirements elsewhere in the chain, since the module itself is non-isolated.
推荐
Industrial Automation
In industrial control and factory automation, 24V buses are typically pre-regulated to 5V, from which the TPSM82866A generates low-voltage digital rails at 6A. Its DCS-Control architecture maintains stable operation with a wide range of output capacitor types, and the enable/power-good pins support fault handling in multi-rail systems. The integrated inductor saves board area on dense I/O and PLC boards. Consider the HRDMR variant for higher efficiency in elevated-ambient control cabinets.
推荐
Test and Measurement Instruments
Bench instruments and modular test systems need clean, high-current local rails for FPGAs, ADCs, and processors. The TPSM82866A's shielded integrated inductor and DCS-Control low-output-ripple operation minimize switching noise coupling into sensitive measurement paths, while the compact footprint supports dense multi-rail designs. Its evaluation module (TPSM82866AA0SEVM) speeds up prototyping. Pair with low-noise LDOs on the most noise-critical analog rails where ultimate PSRR matters.
推荐
推荐产品汇总
工程参考数据： TPSM82866AA0SRDJR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | TPSM82864AA0SRDJR | TPSM82866AA0HRDMR | TPSM82866AA0PRCFR | ISL8200AMIRZ |
|---|---|---|---|---|---|
| Package | Overmolded QFN (RDJ) 3.5x4.0 mm | Overmolded QFN (RDJ) 3.5x4.0 mm - same | Overmolded QFN (RDM), taller | QFN (RCF MagPack) | Renesas QFN module (different) |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Renesas Electronics |
| Output Current | 6 A | 4 A | 6 A | 6 A | 5 A class |
| Footprint Compatibility | Reference (RDJ) | Pin-to-pin, BOM-to-BOM compatible | Pin-compatible, taller body | Different (RCF footprint) | Not pin-compatible (PCB rework) |
关键差异点
- Higher current on identical footprint （对比 TPSM82864AA0SRDJR)
- Higher efficiency package option （对比 TPSM82866AA0SRDJR (this thin RDJ))
- Superior EMI shielding option （对比 TPSM82866AA0PRCFR)
设计说明
Although the TPSM82866A integrates the inductor, layout still matters. Place low-ESR ceramic input capacitors as close as possible to PVIN/PGND; follow the layout example in TI datasheet SLUSEF1B. Use solid ground planes with thermal vias under the exposed pad to conduct heat away from the 3.5mm x 4.0mm QFN at full 6A load. Keep the VSENSE feedback trace away from the SW node and route it as a Kelvin connection to the output capacitor.
At 6A output with a large VIN-VOUT difference, module dissipation rises and the small QFN package relies on PCB copper for cooling. Estimate losses from the datasheet efficiency curves for your operating point, and provide adequate copper area and via arrays to the ground plane. If ambient temperature is high or airflow is limited, consider the TPSM82866AA0HRDMR variant, which achieves higher efficiency due to its increased height and improved inductor.
Do not exceed the 5.5V maximum input rating. Size output capacitance per the datasheet stability guidelines; the DCS-Control topology is flexible with capacitor type but requires minimum effective capacitance for stability at high output current. Remember the integrated inductor is 220nH ±20% - output ripple and transient behavior depend on this value, so do not assume discrete-design ripple calculations. Use the TPSM82866AA0SEVM to validate before committing to a layout.
合规信息
RoHS compliant per TI product page. Full REACH/halogen status: consult TI quality/environmental data on ti.com.
