AMD

XC6SLX16-2FT256C - 14,579-Cell Spartan-6 FPGA | AMD

料号: XC6SLX16-2FT256C ✓ 量产中
1.2 V Vdss 256-LBGA Package 667 MHz Speed
最小起订量: 1 |

XC6SLX16-2FT256C 概述

The AMD XC6SLX16-2FT256C is a Spartan-6 LX field-programmable gate array with 14,579 configurable logic cells, 186 I/O, a 667 MHz internal frequency, and a 256-ball lead-free LBGA package. It uses 45 nm CMOS technology and a 1.2 V core supply, providing a compact programmable-logic platform for industrial, consumer, communications, and embedded-control systems.

A field-programmable gate array is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured after manufacture. In the product hierarchy, an FPGA sits above programmable logic devices and combines configurable logic blocks, block RAM, dedicated arithmetic resources, programmable I/O, and embedded processors. This integration allows one package to replace multiple programmable logic devices and supporting discrete components while shortening development cycles.

The verified specifications identify 14,579 configurable cells, 1,139 CLBs, 186 I/O, a 667 MHz internal frequency, and 45 nm CMOS fabrication. The -2 suffix identifies the middle Spartan-6 LX speed grade, while C identifies the commercial temperature grade. These resources support parallel data processing, control-plane logic, communication bridges, signal conditioning, and general-purpose embedded systems without requiring a mask change for each design.

As an FPGA, the XC6SLX16-2FT256C combines programmable digital logic with fixed physical resources. Its 186 I/O provide external connectivity, while the 256-ball surface-mount package supports compact board layouts. The 45 nm process and 1.2 V core supply place the device in a mature, low-power programmable-logic architecture intended for cost-sensitive designs that require more integration than discrete logic but less complexity than a large FPGA.

Typical applications include industrial automation, industrial networking, video and image processing, consumer equipment, communications infrastructure, and embedded control. The Spartan-6 LX family is specifically identified as suitable for advanced bridging applications, automotive infotainment, consumer products, and industrial automation. A board using this device also requires a suitable configuration memory or boot interface, compliant power rails, clocking, decoupling, and careful signal-integrity routing.

Designers should verify the exact FT256 pinout, supported I/O standards, configuration method, power-supply sequencing, and startup behavior in the AMD package files before layout release. Because the verified data does not provide the complete 256-ball pin map, no pin names should be inferred from generic BGA numbering. Differential interfaces should be routed with controlled length and impedance, while FPGA power and ground pins should follow the manufacturer's published connectivity and plane guidance.

This product page consolidates distributor availability, package information, speed-grade variants, and practical replacement guidance in one engineering-focused reference. It also distinguishes true FT256 pin-compatible alternatives from package-only equivalents and clearly identifies specifications that require confirmation from the AMD Spartan-6 documentation.

直接替换替代料: XC6SLX16-2FT256C ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: XC6SLX16-2FT256C (相同外形与封装尺寸) ——差异在于 Package, Operating Temperature, Lead-Free Status, Speed Grade, Device Type.

AMD
Package: 256-ball FTBGA, 17 mm x 17 mm, 1.0 mm pitch
Operating Temperature: -40C to +100C (Industrial)
对比 XC6SLX16-2FT256C →
AMD
Package: 256-ball Fine-Pitch Thin BGA (FTG256), 17×17 mm, 1.0 mm pitch
Operating Temperature: 0 °C to +85 °C (Commercial)
对比 XC6SLX16-2FT256C →
AMD
Lead-Free Status: Lead-free
对比 XC6SLX16-2FT256C →
AMD
Package: 256-LBGA / FTBGA-256 (FT256), surface-mount ball grid
Operating Temperature: 0 C to +85 C (32 F to 185 F)
Lead-Free Status: Lead-free package construction
对比 XC6SLX16-2FT256C →

XC6SLX16-2FTG256C

✅ 直接替换
AMD
📦 256-LBGA
Spartan-6 LX · 14,579 · 1,139 · 2,278 · 589,824 bits · 32 · 32 · 186

联系询价

查看数据手册 →

XC6SLX16-2FT256I

✅ 直接替换
AMD
📦 256-LBGA
Spartan-6 LX · FPGA · 14,579 · 589,824 bits (576 Kbits) · 2,278 · 186 · 4 · 32

联系询价

查看数据手册 →

XC6SLX16-3FT256C

✅ 直接替换
AMD
📦 256-LBGA
Spartan-6 LX Field-Programmable Gate Array · 14,579 LE · 1,139 CLBs · 589,824 bits · 667 MHz · 45 nm CMOS · 1.2 V · 186 I/O

联系询价

查看数据手册 →

XC6SLX16-3FT256I

✅ 直接替换
AMD
📦 256-LBGA
Field Programmable Gate Array (FPGA) · Spartan-6 LX (logic-optimized) · 14,579 cells · 1,139 CLBs · 186 I/O · 667 MHz · 45 nm CMOS · 1.2 V

联系询价

查看数据手册 →

XC6SLX16-1FT256C

✅ 直接替换 ⚠️ 规格未核验
📦 256-LBGA
Speed grade decreases from -2 to -1, while the 14,579-cell Spartan-6 LX device and 256-ball package remain unchanged.

📋 参考替代料(不在目录中)

XC6SLX16-2FT256C 最大额定值与电气特性

Device Type FPGA
FPGA Family Spartan-6 LX
Configurable Logic Cells 14,579 cells
Configurable Logic Blocks 1,139 CLBs
Internal Frequency 667 MHz
I/O Count 186 I/O
Process Technology 45 nm CMOS
Core Supply Voltage 1.2 V
Speed Grade -2
Temperature Grade C, commercial
工作温度 0°C to 85°C
封装 256-LBGA
Terminal Count 256 terminals
安装类型 Surface Mount
Package Shape Square
Terminal Form Ball
Lead-Free Status Lead free

XC6SLX16-2FT256C square 引脚配置指南

XC6SLX16-2FT256C(square 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

XC6SLX16-2FT256C 的 square 封装引脚图

暂无详细引脚数据: XC6SLX16-2FT256C.

请参阅 数据手册 以查看完整引脚配置。

典型应用

XC6SLX16-2FT256C 适用于 6 应用s: Industrial Automation Controller, Industrial Network Interface Bridge, Video Image Processing Pipeline, Automotive Infotainment Interface, Consumer Equipment Control Logic, Embedded Control and Sensor Hub.

🏭

Industrial Automation Controller

XC6SLX16-2FT256C fits an industrial automation controller because its 14,579 configurable cells and 186 I/O provide substantial parallel logic capacity for sequencing, interlocks, signal acquisition, and communication. The device can consolidate control logic that might otherwise occupy multiple programmable logic and microcontroller components. In a controller, it can be configured alongside dedicated processors while providing deterministic interfaces to sensors and actuators. Its verified 45 nm CMOS process and 1.2 V core supply suit compact industrial electronics, while the C grade is appropriate for systems specified for 0°C to 85°C. Before release, verify industrial EMC requirements, expansion-interface standards, clocking, configuration security, and extended-temperature alternatives.

🌐

Industrial Network Interface Bridge

The XC6SLX16-2FT256C is suitable for bridging or adapting industrial communication interfaces because its 186 I/O and 14,579 configurable cells can support parallel datapaths, protocol conversion, framing logic, and clock-domain crossing in one programmable device. The 667 MHz listed internal frequency provides substantial logic headroom for packet processing and interface adapters. Designers can implement parallel-to-serial conversion, buffering, and supervisory functions without relying on a separate large FPGA. For a network bridge, the principal constraints are the selected I/O standard, supported data rate, pin constraints, and timing margin rather than raw cell count alone. Use AMD package files for final pin assignment and validate all high-speed edges with simulation and post-route timing analysis.

📺

Video Image Processing Pipeline

XC6SLX16-2FT256C can implement parallel video and image-processing pipelines where pixel timing, lookup operations, filtering, and control functions require programmable hardware. Its 14,579 cells and 1,139 CLBs provide parallel logic capacity, while 186 I/O allow multiple interfaces to be connected when package constraints permit. A typical implementation could acquire parallel pixels, perform line or block processing, and pass results to a display or memory interface. The verified 667 MHz internal-frequency listing is a useful device-level reference, but actual pixel throughput depends on the selected interface, memory architecture, clocking, and routing. Engineers should confirm available DSP and block-RAM resources in the AMD device documentation because those quantities are not specified in the supplied verified data.

🚗

Automotive Infotainment Interface

XC6SLX16-2FT256C can serve programmable interface and control logic in automotive infotainment designs where a company requires flexible support for display, audio, communication, and human-interface functions. AMD identifies Spartan-6 LX as suitable for automotive infotainment applications, and the device combines 14,579 configurable cells with 186 I/O in a 256-ball surface-mount package. Its programmable architecture allows interface logic and protocol adapters to be revised without changing the PCB. Commercial-grade suitability must still be checked against the vehicle's temperature, vibration, transient, functional-safety, and supplier-quality requirements. If the design exceeds the verified 0°C to 85°C range or requires automotive qualification, choose an appropriately qualified temperature-grade part and validate all interfaces against the system specification.

🔧

Consumer Equipment Control Logic

XC6SLX16-2FT256C is appropriate for cost-sensitive consumer equipment that needs flexible control, display sequencing, input handling, and peripheral adaptation. The Spartan-6 LX architecture offers 14,579 configurable cells and 186 I/O while retaining a compact 256-ball package, allowing programmable functionality to replace a collection of discrete logic devices. Typical uses include appliance controllers, set-top logic, peripheral interfaces, and programmable display-support circuits. The -2 speed grade can be attractive when timing analysis demonstrates adequate margin, while the -3 grade provides additional performance headroom for more demanding control paths. Because the supplied data does not establish the device's exact standby current or fixed-power consumption, power budgets should use the official AMD DS160 values for the selected production speed and temperature grade.

🧩

Embedded Control and Sensor Hub

XC6SLX16-2FT256C can act as a programmable sensor-hub or embedded-control fabric when deterministic logic must coordinate multiple sensors, filters, counters, and actuator outputs. Its 186 I/O provides connectivity for digital sensing and control, while 14,579 configurable cells permit parallel filtering and state-machine implementations that may be difficult to service with a microcontroller alone. The FPGA can trigger sampling sequences, combine signals, and implement time-critical interfaces while a host processor handles configuration or higher-level work. Designers should budget memory and DSP resources against the verified 14,579-cell figure, because those resource quantities are not present in the supplied search data. Final designs must also account for clock jitter, sensor timing, I/O voltage compatibility, and configuration-memory behavior.

What are the key specifications of XC6SLX16-2FT256C that engineers should know?
The XC6SLX16-2FT256C is an AMD Spartan-6 LX FPGA with 14,579 configurable logic cells, 1,139 CLBs, 186 I/O, and a listed internal frequency of 667 MHz. It is manufactured using 45 nm CMOS technology, operates from a 1.2 V core supply, and uses a 256-ball lead-free LBGA package. According to the verified AMD and distributor product data, the device is the -2 speed grade in the commercial C temperature grade.
What is XC6SLX16-2FT256C and what is an FPGA?
XC6SLX16-2FT256C is a Spartan-6 LX field-programmable gate array, which is an integrated semiconductor containing programmable logic blocks, programmable I/O, memory resources, and routing that engineers configure after manufacture. The verified product data identifies 14,579 configurable cells, 1,139 CLBs, and 186 I/O. Its 45 nm CMOS architecture and 1.2 V core supply place it in AMD's cost-oriented programmable-logic family.
Where can I download the XC6SLX16-2FT256C datasheet PDF?
The XC6SLX16-2FT256C datasheet and supporting documentation can be reached through the verified datasheet listing at Datasheets.com, while AMD provides the official Spartan-6 package pinout files. According to those sources, the device belongs to the Spartan-6 LX family and uses the 256-ball FT256 package. Designers should also download the relevant AMD DS160 family documentation and package file before approving a PCB layout.
Where can I find the XC6SLX16-2FT256C pinout and package file?
The XC6SLX16-2FT256C pinout should be taken from AMD's official Spartan-6 package pinout files rather than inferred from generic BGA numbering. AMD identifies these resources as ASCII package files, and the verified distributor data identifies this device as a 256-LBGA part. The complete ball map is not included in the supplied search data, so a verified 256-pin assignment cannot be reproduced safely without the AMD package file.
Is the XC6SLX16-2FT256C in stock and where can I buy it online?
DigiKey lists the XC6SLX16-2FT256C with a buy-now message, while Mouser provides an AMD/Xilinx product page with pricing, inventory, and datasheet links. The supplied snapshot therefore identifies authorized online purchasing channels, but it does not expose a numeric price or a guaranteed quantity available as of 2026-10-28. Current stock should be confirmed directly with the distributor before placing a production order.
What is the price of XC6SLX16-2FT256C as of 2026-10-28?
A verified numeric price for the XC6SLX16-2FT256C is not present in the supplied distributor snippets as of 2026-10-28. DigiKey and Mouser both expose purchase and pricing pages, but the retrieved data does not state the unit price at any requested quantity. The quantity tiers therefore remain marked as data needed rather than presenting an invented price or misleading volume discount.
What is the lead time for XC6SLX16-2FT256C?
The verified DigiKey listing says the XC6SLX16-2FT256C ships today, indicating some order availability at the time of retrieval, but the supplied data does not provide a numerical factory lead time. For procurement, engineers should treat the distributor's live inventory as the near-term source and request a scheduled date for larger quantities. Stock and lead time are time-sensitive and should be reconfirmed as of the purchase date.
What is the best drop-in replacement for XC6SLX16-2FT256C?
The XC6SLX16-2FTG256C is the closest listed FT256-package alternative because it retains the XC6SLX16 device, 14,579 cells, 1,139 CLBs, 667 MHz listing, and 256-ball package while changing the package marking suffix. According to the verified cross-reference data, it is a functional equivalent and can be considered for a drop-in sourcing review. The exact suffix and procurement conditions should still be checked against the AMD package table.
Can XC6SLX16-2FTG256C replace XC6SLX16-2FT256C without changing the PCB?
Yes, XC6SLX16-2FTG256C is the strongest package-matching replacement identified in the supplied cross-reference data. It uses the same FT256 class of 256-ball package and preserves the 14,579-cell Spartan-6 LX configuration, while the verified comparison identifies a functional-equivalent relationship. Before substitution, confirm the exact AMD package drawing, suffix meaning, speed grade, temperature grade, and availability against the original design.
XC6SLX16-2FT256C vs XC6SLX16-3FT256C: which is better for a timing-critical design?
XC6SLX16-3FT256C is the faster -3 speed-grade option and is the logical choice when the -2 device does not close timing, while the -2 XC6SLX16-2FT256C may offer lower acquisition cost or better availability. The verified comparison data identifies both as 14,579-cell Spartan-6 LX devices with a 667 MHz listing in a 256-ball package. Actual performance depends on the design, tool version, speed grade, and timing constraints.
When should I choose XC6SLX16-2FT256C over XC6SLX16-3FT256C?
Choose XC6SLX16-2FT256C when the design meets timing with the -2 grade and cost, availability, or power behavior is more important than the additional performance margin of -3. Choose XC6SLX16-3FT256C only when timing analysis requires the higher grade. The verified data confirms the same 14,579-cell and 1,139-CLB architecture, so the decision is primarily a speed-grade and implementation trade-off.
Is XC6SLX16-2FT256C suitable for industrial automation and networking equipment?
XC6SLX16-2FT256C is suitable for industrial automation and networking designs when the required interfaces, logic capacity, and temperature range fit its specifications. AMD describes Spartan-6 LX as appropriate for industrial automation and advanced bridging applications, and the verified part data lists 14,579 cells, 186 I/O, and a 0°C to 85°C commercial operating range. Industrial products requiring extended-temperature operation should select an appropriate I-grade part.
What is the difference between XC6SLX16-2FT256C and XC6SLX16-2FT256I?
XC6SLX16-2FT256C carries the C temperature-grade suffix, while XC6SLX16-2FT256I carries the I temperature-grade suffix. The supplied cross-reference data identifies the I version as a functional equivalent, and the underlying device, speed grade, 14,579-cell resource count, and 256-ball package remain the same. The decisive difference is environmental temperature qualification, which must be selected against the product's ambient and enclosure requirements.
What can replace XC6SLX16-2FT256C?
The supplied cross-reference data identifies XC6SLX16-2FTG256C, XC6SLX16-2FT256I, XC6SLX16-3FT256C, XC6SLX16-3FT256I, and XC6SLX16-1FT256C as same-family FT256 candidates for review. XC6SLX16-2FTG256C is the closest functional equivalent, while the others change package suffix, temperature grade, or speed grade. Engineers should compare the exact AMD package table, timing, power, and qualification requirements before approving a substitution.
Is XC6SLX16-2FT256C the same as XC6SLX16-2FTG256C?
XC6SLX16-2FT256C and XC6SLX16-2FTG256C use the same 14,579-cell Spartan-6 LX device architecture and 256-ball FT256 package class, but their orderable suffixes are not identical. Verified comparison data describes the FTG256C part as a functional equivalent of the FT256C part. Procurement should still treat them as distinct MPNs and verify the package drawing, marking, and authorized-source documentation.

工程参考数据: XC6SLX16-2FT256C ——对比、设计指导和合规信息。

选型指南

Choose XC6SLX16-2FT256C when the design fits the commercial temperature range, the -2 speed grade provides adequate timing margin, and the exact FT256C orderable part is available. Choose XC6SLX16-2FTG256C when the verified functional-equivalent package suffix offers better sourcing and the AMD package documentation confirms interchangeability. Choose XC6SLX16-2FT256I when extended-temperature operation is needed without changing the -2 performance grade, and choose XC6SLX16-3FT256C or XC6SLX16-3FT256I when post-route timing requires the higher -3 grade. XC6SLX16-1FT256C is a lower-speed alternative suitable only where its timing and power characteristics satisfy the design. For every choice, confirm the exact package code, ballout, I/O rails, configuration interface, qualification requirements, and current availability rather than relying on package dimensions alone.

与替代料对比

参数 本产品 XC6SLX16-2FTG256C XC6SLX16-2FT256I XC6SLX16-3FT256C XC6SLX16-3FT256I XC6SLX16-1FT256C
Brand AMD AMD AMD AMD AMD AMD
Package 256-LBGA 256-LBGA 256-LBGA 256-LBGA 256-LBGA 256-LBGA
FPGA Family Spartan-6 LX Spartan-6 LX Spartan-6 LX Spartan-6 LX Spartan-6 LX Spartan-6 LX
Configurable Logic Cells 14,579 cells 14,579 cells 14,579 cells 14,579 cells 14,579 cells 14,579 cells
Speed Grade -2 -2 -2 -3 -3 -1
Temperature Grade C, commercial C, commercial I, industrial C, commercial I, industrial C, commercial

关键差异点

  • Closest verified functional equivalent with the same resource profile (对比 XC6SLX16-2FTG256C)
  • Commercial configuration with an I-grade procurement alternative (对比 XC6SLX16-2FT256I)
  • Additional timing headroom without changing the device family (对比 XC6SLX16-3FT256C)

设计说明

Do not assign the FT256 ballout from generic BGA numbering. Download the AMD Spartan-6 package device pinout file and cross-check every power, ground, configuration, clock, and user-I/O connection against the selected XC6SLX16 speed and temperature suffix. A 256-ball package provides many optional or device-dependent balls, so an incorrect generic mapping can damage the FPGA or prevent configuration. Preserve all exposed access structures and assembly requirements specified by the official package drawing.

Budget the 1.2 V core rail and every required I/O rail separately; the verified data does not provide current limits, sequencing delays, or power dissipation, so those values must come from the official AMD DS160 tables for the exact -2 and C-grade ordering code. Place local decoupling at the associated supply and ground balls using the manufacturer-recommended capacitance and layout. Confirm startup-current behavior against the board's regulator and configuration-memory design before release.

Route clocks, high-speed serial interfaces, and source-synchronous signals with continuous reference planes and impedance controlled to the selected AMD I/O standard. Use the package file to preserve recommended ball assignments for clock-capable, configuration, and dedicated pins. Simulation should include the intended clock frequency, board loss, connector or transceiver loading, and external circuitry. The 667 MHz internal-frequency listing does not guarantee that an arbitrary external interface can meet timing.

A common substitution error is treating any 256-BGA device as interchangeable merely because the ball count matches. Pin compatibility also depends on device family, package code, voltage rails, dedicated pins, and speed or temperature suffix. The supplied AMD support material states that Spartan-6 LX devices supported in a particular package are pinout compatible, while Spartan-6 LX and LXT devices are not. Verify the exact suffix and package table before approving a replacement.

合规信息

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
无铅
Yes
无卤
Unknown
冲突矿物
Unknown

The verified distributor data identifies the XC6SLX16-2FT256C as lead free. No explicit RoHS, REACH, halogen-free, conflict-minerals, or AEC-Q100 statement was included in the supplied verified data, so those statuses remain unknown. The C suffix is identified as the commercial temperature grade.

相关搜索

XC6SLX16-2FT256C XC6SLX16-2FT256C datasheet PDF AMD XC6SLX16-2FT256C Spartan-6 LX 14579 cell FPGA XC6SLX16-2FT256C 256 LBGA XC6SLX16-2FT256C pinout XC6SLX16-2FT256C drop-in replacement XC6SLX16-2FT256C vs XC6SLX16-2FTG256C XC6SLX16-2FT256C price XC6SLX16-2FT256C buy online XC6SLX16-2FT256C industrial automation Spartan-6 LX FT256 FPGA XC6SLX16 FT256C FTG256C difference XC6SLX16-2FT256C lead time

相关元器件 & 术语

AMD Xilinx XC6SLX16-2FT256C XC6SLX16-2FTG256C XC6SLX16-2FT256I XC6SLX16-3FT256C XC6SLX16-3FT256I XC6SLX16-1FT256C Spartan-6 LX FPGA field-programmable gate array configurable logic block CLB programmable logic semiconductor 45 nm CMOS 1.2 V core supply 667 MHz internal frequency 14,579 configurable logic cells 186 I/O 256-LBGA BGA package surface mount industrial automation automotive infotainment industrial networking video processing embedded control lead-free
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