XC7K355T-2FF901I - Kintex-7 FPGA 356K Logic Cells | AMD
料号： XC7K355T-2FF901I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1250 | $1,250.00 |
| 10 | $1150 | $11,500.00 |
| 100 | $1050 | $105,000.00 |
| 500 | $950 | $475,000.00 |
| 1,000 | $850 | $850,000.00 |
XC7K355T-2FF901I 概述
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain programmable logic blocks and interconnects that allow the hardware to be reprogrammed to implement any digital logic function. The Kintex-7 family sits between the cost-optimized Artix-7 and the high-performance Virtex-7 in the Xilinx 7-series hierarchy, offering a balance of price, performance, and power for mid-to-high-range applications.
Key features of the XC7K355T-2FF901I include 356,160 logic cells, 26,357,760 bits of block RAM, and 300 user I/O pins. The -2 speed grade indicates a mid-range performance level, while the I suffix denotes an industrial temperature range of -40°C to +100°C. The FF901 package provides 900 balls in a square BGA form factor, enabling high-density routing for complex designs.
Technically, the Kintex-7 family is built on a 28nm high-k metal gate (HKMG) process technology, offering significant power and performance improvements over previous generations. The device includes advanced DSP48E1 slices, high-speed transceivers, and integrated memory controllers, making it suitable for a wide range of applications. The 900-ball package supports multiple I/O standards and provides excellent signal integrity for high-speed interfaces.
Typical applications for the XC7K355T-2FF901I include telecommunications infrastructure, aerospace and defense systems, high-performance computing, and medical imaging. Its combination of logic density, DSP capability, and power efficiency makes it ideal for signal processing, software-defined radio, and video processing applications.
When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The 28nm process and high logic density require robust power distribution networks and adequate cooling solutions to ensure reliable operation at industrial temperatures.
直接替换替代料： XC7K355T-2FF901I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC7K355T-2FF901I （相同外形与封装尺寸） ——差异在于 Mounting Type.
快速对比工具——选择替代料号进行并排对比：
XC7K355T-2FFG901I
✅ 直接替换✓ 有现货
$990 / 个
查看数据手册 →XC7K420T-2FF901I
✅ 直接替换📋 参考替代料（不在目录中）
XC7K480T-2FF901I
✅ 直接替换📋 参考替代料（不在目录中）
XC7K355T-1FF901I
✅ 直接替换📋 参考替代料（不在目录中）
XC7K325T-2FFG900I
⚡ 相同封装 ⚠️ 规格未核验✓ 有现货
$65 / 个
查看数据手册 →XC7K355T-2FF901I 最大额定值与电气特性
| Family | Kintex-7 |
| Logic Cells | 356160 |
| Block RAM | 26357760 bits |
| User I/O | 300 |
| Number of Terminals | 900 |
| Package Code | BGA |
| Package Shape | SQUARE |
| Power Supplies | 1.0V, 1.8V, 3.3V |
| Speed Grade | -2 |
| Temperature Grade | I (Industrial) |
| 工作温度 | -40C to +100C |
| 安装类型 | Surface Mount |
| Terminal Form | BALL |
| RoHS 状态 | Compliant |
| ECCN | 3A991D |
XC7K355T-2FF901I 引脚配置
| 引脚 A1 | IO_L1P_T0 — User I/O differential pair P |
| 引脚 A2 | IO_L1N_T0 — User I/O differential pair N |
| 引脚 B1 | VCCINT — Internal core voltage 1.0V |
| 引脚 B2 | GND — Ground |
| 引脚 C1 | IO_L2P_T0 — User I/O differential pair P |
| 引脚 C2 | IO_L2N_T0 — User I/O differential pair N |
| 引脚 D1 | VCCAUX — Auxiliary voltage 1.8V |
| 引脚 D2 | GND — Ground |
| 引脚 E1 | IO_L3P_T0 — User I/O differential pair P |
| 引脚 E2 | IO_L3N_T0 — User I/O differential pair N |
| 引脚 F1 | VCCO — I/O bank voltage 3.3V |
| 引脚 F2 | GND — Ground |
典型应用
XC7K355T-2FF901I 适用于 6 应用s: Telecommunications Infrastructure, Aerospace and Defense, High-Performance Computing, Medical Imaging, Software-Defined Radio, Video Processing.
Telecommunications Infrastructure
The XC7K355T-2FF901I excels in telecommunications infrastructure due to its 356,160 logic cells and 300 I/O pins, enabling complex baseband processing and protocol handling. Its 28nm process provides the power efficiency needed for 24/7 operation in base stations and network equipment. The device supports multiple high-speed serial interfaces, making it suitable for backhaul and fronthaul applications. With industrial temperature range, it can operate in outdoor and uncontrolled environments. The FF901 package allows for dense PCB routing, essential for high-channel-count designs.
推荐
Aerospace and Defense
In aerospace and defense, the XC7K355T-2FF901I provides the logic density and DSP capability required for radar, electronic warfare, and secure communications systems. Its 26,357,760 block RAM bits support large data buffers for signal processing. The industrial temperature range (-40C to +100C) ensures reliable operation in harsh environments. The device's 300 I/O pins enable interfacing with various sensors and data converters. AMD's long-term supply commitment makes it suitable for defense programs with extended lifecycles.
推荐
High-Performance Computing
The XC7K355T-2FF901I accelerates high-performance computing workloads through its 356,160 logic cells and advanced DSP capabilities. It can implement custom arithmetic units, FFT engines, and machine learning accelerators. The 900-ball FCBGA package provides excellent power distribution and signal integrity for high-speed interfaces. With 300 user I/O, it can connect to high-bandwidth memory and network interfaces. The -2 speed grade offers a balance of performance and power consumption for compute-intensive applications.
推荐
Medical Imaging
The XC7K355T-2FF901I is ideal for medical imaging systems requiring real-time image processing. Its 356,160 logic cells can implement complex filtering, reconstruction, and enhancement algorithms. The 26,357,760 block RAM bits support large image frame buffers. The device's DSP slices accelerate convolution and correlation operations common in imaging. With industrial temperature range, it can operate in medical equipment with demanding thermal requirements. The FF901 package enables compact PCB designs for space-constrained medical devices.
推荐
Software-Defined Radio
The XC7K355T-2FF901I enables software-defined radio implementations with its high logic density and DSP capability. It can handle wideband signal processing, channelization, and modulation/demodulation in real-time. The 300 I/O pins interface with high-speed ADCs and DACs. Its 28nm process provides the power efficiency needed for portable and battery-operated SDR systems. The device supports multiple clock domains, essential for multi-channel radio designs. The FF901 package allows for compact, high-performance radio implementations.
推荐
Video Processing
The XC7K355T-2FF901I handles demanding video processing tasks including 4K/8K encoding, decoding, and transcoding. Its 356,160 logic cells implement complex video codecs and processing pipelines. The 26,357,760 block RAM bits provide sufficient buffering for video frames. The device's high-speed transceivers support HDMI, DisplayPort, and SDI interfaces. With 300 I/O pins, it can interface with multiple video sources and sinks. The industrial temperature range ensures reliable operation in broadcast environments.
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推荐产品汇总
工程参考数据： XC7K355T-2FF901I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC7K355T-2FFG901I | XC7K420T-2FF901I | XC7K480T-2FF901I |
|---|---|---|---|---|
| Package | 900-BBGA, FCBGA | 900-BBGA, FCBGA - same | 900-BBGA, FCBGA - same | 900-BBGA, FCBGA - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 356160 | 356160 | 416960 | 477760 |
| Block RAM | 26357760 bits | 26357760 bits | 30074400 bits | 38304000 bits |
| User I/O | 300 | 300 | 300 | 300 |
| Speed Grade | -2 | -2 | -2 | -2 |
| Temperature Grade | I (Industrial) | I (Industrial) | I (Industrial) | I (Industrial) |
| Lead-Free | No | Yes | No | No |
关键差异点
- Higher logic density than XC7K325T （对比 XC7K325T-2FFG900I)
- Industrial temperature grade （对比 XC7K355T-2FFG901I)
- Pin-compatible upgrade path （对比 XC7K420T-2FF901I)
设计说明
The XC7K355T-2FF901I requires three power supplies: 1.0V for VCCINT, 1.8V for VCCAUX, and 3.3V for VCCO. Use dedicated power planes for each supply and place decoupling capacitors (100nF and 10uF) close to the power pins. According to AMD's power design guidelines, use a low-impedance power distribution network to minimize voltage droop during high-speed switching.
The XC7K355T-2FF901I in the 900-ball FCBGA package can dissipate significant power under heavy utilization. Ensure adequate airflow or a heatsink is provided. The industrial temperature grade allows operation up to 100C junction temperature, but thermal management is essential for reliability. Use thermal vias under the package to improve heat transfer to the PCB.
For the 900-ball FCBGA package, use a high-layer-count PCB (12+ layers) with controlled impedance for high-speed signals. Follow AMD's PCB design guidelines in UG475 for via placement and routing. Ensure the BGA footprint matches the FF901 package exactly, and use X-ray inspection to verify solder joint quality after assembly.
合规信息
The -2FF901I variant may have lead-based solder balls. The -2FFG901I is the lead-free (RoHS-compliant) version.
