XC7K355T-2FF901I - Kintex-7 FPGA 356K Logic Cells | AMD
MPN: XC7K355T-2FF901I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1250 | $1,250.00 |
| 10 | $1150 | $11,500.00 |
| 100 | $1050 | $105,000.00 |
| 500 | $950 | $475,000.00 |
| 1,000 | $850 | $850,000.00 |
Drop-in alternatives for XC7K355T-2FF901I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7K355T-2FFG901I
β Drop-Inβ In Stock
$990 / Unit
View Datasheet βXC7K420T-2FF901I
β Drop-Inπ Reference alternative (not in catalog)
XC7K480T-2FF901I
β Drop-Inπ Reference alternative (not in catalog)
XC7K355T-1FF901I
β Drop-Inπ Reference alternative (not in catalog)
XC7K325T-2FFG900I
β‘ Same Packageβ In Stock
$65 / Unit
View Datasheet βXC7K355T-2FF901I Maximum Ratings & Electrical Characteristics
| Family | Kintex-7 |
| Logic Cells | 356160 |
| Block RAM | 26357760 bits |
| User I/O | 300 |
| Number of Terminals | 900 |
| Package Code | BGA |
| Package Shape | SQUARE |
| Power Supplies | 1.0V, 1.8V, 3.3V |
| Speed Grade | -2 |
| Temperature Grade | I (Industrial) |
| Operating Temperature | -40C to +100C |
| Mounting Type | Surface Mount |
| Terminal Form | BALL |
| RoHS Status | Compliant |
| ECCN | 3A991D |
XC7K355T-2FF901I Pin Configuration
| Pin A1 | IO_L1P_T0 β User I/O differential pair P |
| Pin A2 | IO_L1N_T0 β User I/O differential pair N |
| Pin B1 | VCCINT β Internal core voltage 1.0V |
| Pin B2 | GND β Ground |
| Pin C1 | IO_L2P_T0 β User I/O differential pair P |
| Pin C2 | IO_L2N_T0 β User I/O differential pair N |
| Pin D1 | VCCAUX β Auxiliary voltage 1.8V |
| Pin D2 | GND β Ground |
| Pin E1 | IO_L3P_T0 β User I/O differential pair P |
| Pin E2 | IO_L3N_T0 β User I/O differential pair N |
| Pin F1 | VCCO β I/O bank voltage 3.3V |
| Pin F2 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7K355T-2FF901I is suitable for 6 applications: Telecommunications Infrastructure, Aerospace and Defense, High-Performance Computing, Medical Imaging, Software-Defined Radio, Video Processing.
Telecommunications Infrastructure
The XC7K355T-2FF901I excels in telecommunications infrastructure due to its 356,160 logic cells and 300 I/O pins, enabling complex baseband processing and protocol handling. Its 28nm process provides the power efficiency needed for 24/7 operation in base stations and network equipment. The device supports multiple high-speed serial interfaces, making it suitable for backhaul and fronthaul applications. With industrial temperature range, it can operate in outdoor and uncontrolled environments. The FF901 package allows for dense PCB routing, essential for high-channel-count designs.
Recommended
Aerospace and Defense
In aerospace and defense, the XC7K355T-2FF901I provides the logic density and DSP capability required for radar, electronic warfare, and secure communications systems. Its 26,357,760 block RAM bits support large data buffers for signal processing. The industrial temperature range (-40C to +100C) ensures reliable operation in harsh environments. The device's 300 I/O pins enable interfacing with various sensors and data converters. AMD's long-term supply commitment makes it suitable for defense programs with extended lifecycles.
Recommended
High-Performance Computing
The XC7K355T-2FF901I accelerates high-performance computing workloads through its 356,160 logic cells and advanced DSP capabilities. It can implement custom arithmetic units, FFT engines, and machine learning accelerators. The 900-ball FCBGA package provides excellent power distribution and signal integrity for high-speed interfaces. With 300 user I/O, it can connect to high-bandwidth memory and network interfaces. The -2 speed grade offers a balance of performance and power consumption for compute-intensive applications.
Recommended
Medical Imaging
The XC7K355T-2FF901I is ideal for medical imaging systems requiring real-time image processing. Its 356,160 logic cells can implement complex filtering, reconstruction, and enhancement algorithms. The 26,357,760 block RAM bits support large image frame buffers. The device's DSP slices accelerate convolution and correlation operations common in imaging. With industrial temperature range, it can operate in medical equipment with demanding thermal requirements. The FF901 package enables compact PCB designs for space-constrained medical devices.
Recommended
Software-Defined Radio
The XC7K355T-2FF901I enables software-defined radio implementations with its high logic density and DSP capability. It can handle wideband signal processing, channelization, and modulation/demodulation in real-time. The 300 I/O pins interface with high-speed ADCs and DACs. Its 28nm process provides the power efficiency needed for portable and battery-operated SDR systems. The device supports multiple clock domains, essential for multi-channel radio designs. The FF901 package allows for compact, high-performance radio implementations.
Recommended
Video Processing
The XC7K355T-2FF901I handles demanding video processing tasks including 4K/8K encoding, decoding, and transcoding. Its 356,160 logic cells implement complex video codecs and processing pipelines. The 26,357,760 block RAM bits provide sufficient buffering for video frames. The device's high-speed transceivers support HDMI, DisplayPort, and SDI interfaces. With 300 I/O pins, it can interface with multiple video sources and sinks. The industrial temperature range ensures reliable operation in broadcast environments.
Recommended
Recommended Products Summary
Engineering reference data for XC7K355T-2FF901I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7K355T-2FFG901I | XC7K420T-2FF901I | XC7K480T-2FF901I |
|---|---|---|---|---|
| Package | 900-BBGA, FCBGA | 900-BBGA, FCBGA - same | 900-BBGA, FCBGA - same | 900-BBGA, FCBGA - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 356160 | 356160 | 416960 | 477760 |
| Block RAM | 26357760 bits | 26357760 bits | 30074400 bits | 38304000 bits |
| User I/O | 300 | 300 | 300 | 300 |
| Speed Grade | -2 | -2 | -2 | -2 |
| Temperature Grade | I (Industrial) | I (Industrial) | I (Industrial) | I (Industrial) |
| Lead-Free | No | Yes | No | No |
Key Differentiators
- Higher logic density than XC7K325T (vs XC7K325T-2FFG900I)
- Industrial temperature grade (vs XC7K355T-2FFG901I)
- Pin-compatible upgrade path (vs XC7K420T-2FF901I)
Design Notes
The XC7K355T-2FF901I requires three power supplies: 1.0V for VCCINT, 1.8V for VCCAUX, and 3.3V for VCCO. Use dedicated power planes for each supply and place decoupling capacitors (100nF and 10uF) close to the power pins. According to AMD's power design guidelines, use a low-impedance power distribution network to minimize voltage droop during high-speed switching.
The XC7K355T-2FF901I in the 900-ball FCBGA package can dissipate significant power under heavy utilization. Ensure adequate airflow or a heatsink is provided. The industrial temperature grade allows operation up to 100C junction temperature, but thermal management is essential for reliability. Use thermal vias under the package to improve heat transfer to the PCB.
For the 900-ball FCBGA package, use a high-layer-count PCB (12+ layers) with controlled impedance for high-speed signals. Follow AMD's PCB design guidelines in UG475 for via placement and routing. Ensure the BGA footprint matches the FF901 package exactly, and use X-ray inspection to verify solder joint quality after assembly.
Compliance Information
The -2FF901I variant may have lead-based solder balls. The -2FFG901I is the lead-free (RoHS-compliant) version.
