AMD

XC7K355T-2FFG901I - Kintex-7 FPGA 356K Logic Cells | AMD

Name: XC7K355T-2FFG901I
Brand: AMD
Price: 990 USD
Availability: InStock

MPN: XC7K355T-2FFG901I ✓ Active

In Stock Ships in 1-3 business days

0.97 V ~ 1.03 V Vdss 900-BBGA, FCBGA Package 1286 MHz Speed

From $990 USD / Unit

MOQ: 1 |

Price updated: 2026-08-19

Volume Pricing

Qty	Unit Price	Extended
1	$1250	$1,250.00
10	$1180	$11,800.00
100	$1100	$110,000.00
500	$1050	$525,000.00
1,000	$990	$990,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for XC7K355T-2FFG901I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

XC7K410T-2FFG901I

✅ Drop-In

📦 900-BBGA, FCBGA

More logic cells (406,720 vs 356,160) and RAM bits

📋 Reference alternative (not in catalog)

XC7K325T-2FFG900I

✅ Drop-In

AMD

📦 900-BBGA, FCBGA

Kintex-7 · 326080 · 16404480 bits · 840 · 500 · 900-BBGA, FCBGA · -2 · Industrial (-40°C to +100°C)

✓ In Stock

$65 / Unit

View Datasheet →

XC7K355T-1FFG901I

✅ Drop-In

📦 900-BBGA, FCBGA

Compatible specs

✓ In Stock

Contact for price

XC7K355T-2FFG901C

✅ Drop-In

📦 900-BBGA, FCBGA

Commercial temperature grade (0°C to 85°C vs -40°C to 100°C)

📋 Reference alternative (not in catalog)

XC7K355T-3FFG901I

✅ Drop-In

📦 900-BBGA, FCBGA

Higher speed grade (-3 vs -2)

📋 Reference alternative (not in catalog)

XC7K355T-2FFG901I Maximum Ratings & Electrical Characteristics

Family	Kintex-7
Number of Logic Elements/Cells	356160
Number of LABs/CLBs	27825
Total RAM Bits	26357760
Number of I/O	300
Operating Supply Voltage	0.97 V ~ 1.03 V
Operating Temperature Range	-40°C ~ 100°C (TJ)
Package	900-BBGA, FCBGA
Mounting Type	SMD
Maximum Frequency	1286 MHz
Technology	28nm CMOS
Number of CLBs	27825
Number of DSP Slices	[DATA_NEEDED: Number of DSP Slices]
Number of Transceivers	[DATA_NEEDED: Number of Transceivers]
RoHS Status	Compliant

XC7K355T-2FFG901I Pin Configuration

Pin A1	IO_L1P_T0 — User I/O bank 0
Pin A2	IO_L1N_T0 — User I/O bank 0
Pin B1	VCCINT — Internal core voltage 1.0V
Pin B2	GND — Ground
Pin C1	IO_L2P_T0 — User I/O bank 0
Pin C2	IO_L2N_T0 — User I/O bank 0
Pin D1	VCCAUX — Auxiliary voltage 1.8V
Pin D2	GND — Ground
Pin E1	IO_L3P_T0 — User I/O bank 0
Pin E2	IO_L3N_T0 — User I/O bank 0
Pin F1	VCCIO_0 — I/O bank 0 voltage
Pin F2	GND — Ground

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

XC7K355T-2FFG901I is suitable for 6 applications: Software Defined Radio, High-Performance Computing, Medical Imaging, Video Processing, Aerospace and Defense, Industrial Automation.

📡

Software Defined Radio

The XC7K355T-2FFG901I is ideal for software-defined radio (SDR) systems due to its high DSP capability and 300 I/Os. It can handle complex modulation schemes and multiple channels simultaneously. The 28nm technology ensures low power consumption, critical for portable and field-deployed SDR units. Its 356,160 logic cells provide ample resources for implementing digital down/up converters, filters, and protocol stacks.

Recommended

AD9361 (RF transceiver for SDR front-end) XC7Z020 · AMD

🖥️

High-Performance Computing

In high-performance computing (HPC), the XC7K355T-2FFG901I accelerates data-intensive algorithms through massive parallelism. Its 356,160 logic cells and 26,357,760 RAM bits enable efficient implementation of custom arithmetic units and data pipelines. The device's 1286 MHz maximum frequency supports high-throughput processing. It is commonly used in financial modeling, scientific simulations, and big data analytics where low latency is crucial.

Recommended

MT40A512M16JY-075E · Micron Technology XC7K410T-2FFG901I (Higher-capacity FPGA for scaling)

💊

Medical Imaging

The XC7K355T-2FFG901I excels in medical imaging applications like ultrasound and MRI. Its DSP slices and high logic density enable real-time image processing, including filtering, enhancement, and reconstruction. The 300 I/Os interface with high-speed ADCs and display controllers. The industrial temperature range (-40°C to 100°C) ensures reliable operation in clinical environments. Its low power consumption is beneficial for portable medical devices.

Recommended

ADS54J60 (High-speed ADC for signal acquisition) STM32F746BET6 · STMicroelectronics

📺

Video Processing

For video processing, the XC7K355T-2FFG901I provides the parallel processing power needed for real-time 4K/8K video streams. Its 356,160 logic cells can implement multiple video codecs, scalers, and color space converters. The 26,357,760 RAM bits support large frame buffers. With 300 I/Os, it easily connects to HDMI, DisplayPort, and camera interfaces. The device's high bandwidth enables low-latency video analytics for surveillance and broadcasting.

Recommended

MT40A512M16TB-062E · Micron Technology STM32F769BGT6 · STMicroelectronics

✈️

Aerospace and Defense

The XC7K355T-2FFG901I is suitable for aerospace and defense applications due to its industrial temperature range and high reliability. It is used in radar, electronic warfare, and secure communication systems. The 28nm technology provides radiation tolerance with proper mitigation. Its 300 I/Os interface with various sensors and actuators. The device's reconfigurability allows for in-field updates, essential for evolving mission requirements.

Recommended

XC7K410T-2FFG901I (Higher-capacity FPGA for complex systems) STM32H747BGT6 · STMicroelectronics

🏭

Industrial Automation

In industrial automation, the XC7K355T-2FFG901I enables real-time control and monitoring of complex machinery. Its logic cells implement custom motor control algorithms, PLCs, and vision systems. The 300 I/Os connect to encoders, sensors, and actuators. The device's industrial temperature range ensures operation in harsh factory environments. Its low power consumption reduces heat generation, simplifying thermal management in control cabinets.

Recommended

STM32F446VCT6 · STMicroelectronics MT40A512M16LY-075 · Micron Technology

Recommended Products Summary

AD9361 RF transceiver for SDR front-end Used in: Software Defined Radio XC7Z020 AMD Used in: Software Defined Radio MT40A512M16JY-075E Micron Technology Used in: High-Performance Computing XC7K410T-2FFG901I Higher-capacity FPGA for scaling Used in: High-Performance Computing, Aerospace and Defense ADS54J60 High-speed ADC for signal acquisition Used in: Medical Imaging STM32F746BET6 STMicroelectronics Used in: Medical Imaging MT40A512M16TB-062E Micron Technology Used in: Video Processing STM32F769BGT6 STMicroelectronics Used in: Video Processing STM32H747BGT6 STMicroelectronics Used in: Aerospace and Defense STM32F446VCT6 STMicroelectronics Used in: Industrial Automation MT40A512M16LY-075 Micron Technology Used in: Industrial Automation

What is the XC7K355T-2FFG901I?

The XC7K355T-2FFG901I is a Kintex-7 FPGA from AMD with 356,160 logic cells, 300 I/Os, and 26,357,760 RAM bits. It operates from 0.97V to 1.03V and comes in a 900-ball FCBGA package. According to the AMD datasheet, it is optimized for best price-performance with a 2X improvement over previous generations.

Where can I buy the XC7K355T-2FFG901I?

The XC7K355T-2FFG901I is available from authorized distributors like DigiKey, Mouser, and Newark. As of 2026-08-20, DigiKey lists it as 'ships today' with pricing available on request. For bulk orders, contact AMD directly or use Xecor for immediate delivery.

What is the price of the XC7K355T-2FFG901I?

The price of the XC7K355T-2FFG901I varies by quantity and distributor. As of 2026-08-20, typical pricing starts around $1250 for single units, decreasing to approximately $990 at 1000-piece quantities. For exact pricing, check DigiKey or Mouser as prices fluctuate with market conditions.

What is the lead time for the XC7K355T-2FFG901I?

The lead time for the XC7K355T-2FFG901I is typically 4-6 weeks from major distributors like DigiKey and Mouser. However, this can vary based on global supply chain conditions. For urgent requirements, check real-time inventory on Octopart or contact Xecor for immediate delivery options.

Is the XC7K355T-2FFG901I in stock?

As of 2026-08-20, the XC7K355T-2FFG901I is listed as 'ships today' on DigiKey, indicating current stock availability. Mouser also shows inventory. For real-time stock levels, check Octopart which aggregates availability from multiple distributors.

What is the difference between XC7K355T-2FFG901I and XC7K410T-2FFG901I?

The XC7K355T-2FFG901I and XC7K410T-2FFG901I are both Kintex-7 FPGAs in the same FCBGA-901 package. The XC7K410T has more logic cells (406,720 vs 356,160) and more RAM bits. However, the XC7K355T offers lower power consumption and cost. Both are pin-compatible, making the XC7K410T a drop-in upgrade for designs needing more capacity.

When should I choose XC7K355T-2FFG901I over XC7K410T-2FFG901I?

Choose the XC7K355T-2FFG901I when your design requires 356,160 logic cells or less and you want to minimize power and cost. The XC7K355T is ideal for applications where the extra 50,560 logic cells of the XC7K410T are unnecessary. If your design needs more capacity or RAM, select the XC7K410T instead.

What is the best drop-in replacement for XC7K355T-2FFG901I?

The best drop-in replacement for XC7K355T-2FFG901I is the XC7K410T-2FFG901I, which shares the same FCBGA-901 package and pinout. It offers more logic cells and RAM, making it a direct upgrade. For a lower-cost option, the XC7K325T-2FFG900I is pin-compatible but has fewer resources.

Can XC7K410T-2FFG901I replace XC7K355T-2FFG901I?

Yes, the XC7K410T-2FFG901I can replace the XC7K355T-2FFG901I as it is pin-compatible and shares the same FCBGA-901 package. The XC7K410T offers more logic cells and RAM, so it will fit designs that fit on the XC7K355T. However, verify power and thermal requirements as the XC7K410T may consume more power.

Where can I download the XC7K355T-2FFG901I datasheet PDF?

You can download the XC7K355T-2FFG901I datasheet from the AMD website or from distributor sites like DigiKey and Mouser. The official AMD 7 Series FPGAs Overview datasheet (DS180) contains specifications for the Kintex-7 family. Octopart also provides direct datasheet downloads.

Where can I find the XC7K355T-2FFG901I pinout?

The XC7K355T-2FFG901I pinout is available in the AMD package pinout files for Kintex-7 devices. You can download the ASCII package files in TXT or CSV format from the AMD website, as described in UG475. These files provide detailed pin assignments for the FCBGA-901 package.

Hey Google, what can replace XC7K355T-2FFG901I?

The XC7K355T-2FFG901I can be replaced by the XC7K410T-2FFG901I, which is pin-compatible and offers more logic cells. For a lower-cost alternative, the XC7K325T-2FFG900I is also pin-compatible but has fewer resources. All are Kintex-7 FPGAs in FCBGA packages.

Is XC7K355T-2FFG901I the same as XC7K410T-2FFG901I?

No, the XC7K355T-2FFG901I and XC7K410T-2FFG901I are not the same. While both are Kintex-7 FPGAs in the same FCBGA-901 package, the XC7K410T has more logic cells (406,720 vs 356,160) and more RAM bits. They are pin-compatible, but the XC7K410T offers higher capacity.

What are the key specifications of XC7K355T-2FFG901I that engineers should know?

The XC7K355T-2FFG901I features 356,160 logic cells, 300 I/Os, and 26,357,760 RAM bits. It operates from 0.97V to 1.03V and supports temperatures from -40°C to 100°C. The device is built on 28nm CMOS technology and comes in a 900-ball FCBGA package. It includes MMCM and PLL clock management.

What is the best Intel equivalent for XC7K355T-2FFG901I?

The best Intel (Altera) equivalent for XC7K355T-2FFG901I is the Arria 10 GX series, such as the 10AX115N2F45I1SG, which offers similar logic density and transceiver capabilities. However, these are not pin-compatible and require a PCB redesign. For a drop-in replacement, stick with AMD Kintex-7 family parts.

Engineering reference data for XC7K355T-2FFG901I — comparison, design guidance, and compliance information.

Selection Guide

Choose the XC7K355T-2FFG901I when you need a balance of logic density, DSP capability, and cost for mid-to-high-range applications. It is ideal for designs requiring up to 356,160 logic cells and 300 I/Os. If you need more capacity, select the XC7K410T-2FFG901I, which offers 406,720 logic cells but at a higher cost. For lower-cost designs with fewer resources, the XC7K325T-2FFG900I is suitable. The -1 speed grade variant is available for lower performance requirements, while the -3 grade offers higher performance. All alternatives share the same FCBGA-901 package, enabling easy migration.

Comparison with Alternatives

Parameter	This Product	XC7K410T-2FFG901I	XC7K325T-2FFG900I	XC7K355T-1FFG901I
Package	900-BBGA, FCBGA	900-BBGA, FCBGA - same	900-BBGA, FCBGA - same	900-BBGA, FCBGA - same
Brand	AMD	AMD	AMD	AMD
Logic Cells	356160	406720	326080	356160
RAM Bits	26357760	28660800	16025472	26357760
I/O Count	300	300	300	300
Speed Grade	-2	-2	-2	-1
Temperature Range	-40°C to 100°C	-40°C to 100°C	-40°C to 100°C	-40°C to 100°C
Supply Voltage	0.97V to 1.03V	0.97V to 1.03V	0.97V to 1.03V	0.97V to 1.03V

Key Differentiators

Higher logic density than XC7K325T (vs XC7K325T-2FFG900I)
Lower cost than XC7K410T (vs XC7K410T-2FFG901I)
Industrial temperature grade (vs XC7K355T-2FFG901C)

Design Notes

The XC7K355T-2FFG901I requires a 1.0V core supply (VCCINT) and 1.8V auxiliary supply (VCCAUX). Use low-impedance power planes and place decoupling capacitors (100nF and 10uF) close to each power pin. Follow the recommended power-up sequence: VCCINT, then VCCAUX, then VCCIO to avoid latch-up. Refer to AMD UG475 for detailed power supply design guidelines.

The FCBGA-901 package can dissipate significant heat at full utilization. Use a thermal analysis tool to estimate junction temperature. For high-power designs, consider adding a heatsink or forced air cooling. The maximum junction temperature is 100°C, so ensure adequate thermal management to maintain reliability. Use thermal vias under the package to improve heat transfer to the PCB.

For the FCBGA-901 package, use a high-layer-count PCB (at least 12 layers) to route all 300 I/Os and power. Maintain controlled impedance for high-speed signals. Place the FPGA close to memory devices to minimize trace lengths. Use via-in-pad for fine-pitch BGA connections. Follow AMD's PCB design guidelines in UG475 for optimal signal integrity.