XC7Z045-2FBG676I - Zynq-7000 SoC, 350K Logic Cells | AMD
料号： XC7Z045-2FBG676I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $850 | $850.00 |
| 10 | $780 | $7,800.00 |
| 100 | $720 | $72,000.00 |
| 500 | $680 | $340,000.00 |
| 1,000 | $650 | $650,000.00 |
XC7Z045-2FBG676I 概述
A System-on-Chip (SoC) is an integrated circuit that consolidates all components of a computer or other electronic system into a single chip. It typically includes a processor core, memory, input/output ports, and secondary storage interfaces. In the context of the Zynq-7000 family, the SoC combines a hard processing system (PS) based on ARM Cortex-A9 cores with programmable logic (PL) based on FPGA fabric. This architecture allows designers to implement custom hardware accelerators in the PL while running operating systems like Linux on the PS, offering a balance of performance, flexibility, and power efficiency.
Key features of the XC7Z045-2FBG676I include 350K logic cells, 800MHz dual-core ARM Cortex-A9 processor, 16.25 Mb of block RAM, and 900 DSP slices. The device supports a wide range of I/O standards and includes high-speed transceivers for serial communication. The -2 speed grade indicates a high-performance variant, suitable for demanding applications. The industrial temperature grade (I suffix) allows operation from -40°C to +100°C, making it suitable for harsh environments.
The Zynq-7000 architecture provides a unique advantage by enabling tight coupling between the processing system and programmable logic through an AMBA AXI interconnect. This allows for high-bandwidth, low-latency communication between software running on the ARM cores and custom hardware logic. The device also includes a memory management unit, DDR3/DDR3L memory controller, and various peripheral interfaces such as USB, Gigabit Ethernet, and SDIO, enabling a complete embedded system on a single chip.
Typical applications for the XC7Z045-2FBG676I include software-defined radio, where the programmable logic handles baseband processing while the ARM cores run protocol stacks; industrial motor control, where custom PWM and encoder interfaces are implemented in logic; and high-performance video processing, where the PL accelerates image processing algorithms. The device is also used in aerospace and defense applications requiring high reliability and long-term availability.
When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The FCBGA package requires a well-designed PCB with adequate thermal vias and a heatsink for high-power applications. The device supports multiple power rails (VCCINT, VCCAUX, VCCO) that must be sequenced correctly during power-up to prevent damage.
直接替换替代料： XC7Z045-2FBG676I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC7Z045-2FBG676I （相同外形与封装尺寸） ——差异在于 Maximum Clock Frequency, Operating Temperature, Speed Grade.
快速对比工具——选择替代料号进行并排对比：
XC7Z045-1FBG676I
✅ 直接替换✓ 有现货
$520 / 个
查看数据手册 →XC7Z045-2FFG676I
✅ 直接替换📋 参考替代料（不在目录中）
XC7Z030-1FBG676I
✅ 直接替换📋 参考替代料（不在目录中）
XC7Z045-L2FFG676I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC7Z045-2FBG676I 最大额定值与电气特性
| Family | Zynq-7000 |
| Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Primary Attributes | Kintex-7 FPGA, 350K Logic Cells |
| Number of Logic Cells | 350000 |
| Number of DSP Slices | 900 |
| Block RAM | 16.25 Mb |
| 最大时钟频率 | 800 MHz |
| 封装 / 外壳 | 676-FCBGA (27x27) |
| Supplier Device Package | 676-FCBGA |
| 工作温度 | -40°C to +100°C (TJ) |
| Speed Grade | -2 |
| 安装类型 | Surface Mount |
| 电源电压 | 1.2V~3.3V |
| RoHS 状态 | Compliant |
XC7Z045-2FBG676I 引脚配置
| 引脚 A1 | GND — Ground |
| 引脚 A2 | VCCO_0 — I/O bank 0 supply voltage |
| 引脚 B1 | IO_L1P_T0_0 — I/O pin, bank 0 |
| 引脚 B2 | IO_L1N_T0_0 — I/O pin, bank 0 |
| 引脚 C1 | IO_L2P_T0_0 — I/O pin, bank 0 |
| 引脚 C2 | IO_L2N_T0_0 — I/O pin, bank 0 |
| 引脚 D1 | VCCINT — Internal core supply voltage |
| 引脚 D2 | GND — Ground |
| 引脚 E1 | IO_L3P_T0_0 — I/O pin, bank 0 |
| 引脚 E2 | IO_L3N_T0_0 — I/O pin, bank 0 |
| 引脚 F1 | IO_L4P_T0_0 — I/O pin, bank 0 |
| 引脚 F2 | IO_L4N_T0_0 — I/O pin, bank 0 |
典型应用
XC7Z045-2FBG676I 适用于 6 应用s: Software-Defined Radio, Industrial Motor Control, High-Performance Video Processing, Aerospace and Defense, Medical Imaging, Data Center Acceleration.
Software-Defined Radio
The XC7Z045-2FBG676I is ideal for software-defined radio (SDR) systems. Its 350K logic cells and 900 DSP slices enable complex baseband processing, such as FFT and channel filtering, in the programmable logic. The dual-core ARM Cortex-A9 at 800MHz runs protocol stacks and control software. The high-speed transceivers support data conversion interfaces. This SoC provides a flexible platform for multi-standard communication systems, allowing reconfiguration without hardware changes.
推荐
Industrial Motor Control
In industrial motor control, the XC7Z045-2FBG676I enables high-performance, real-time control. The programmable logic implements custom PWM generation, encoder interfaces, and safety logic with deterministic timing. The ARM cores handle communication protocols like EtherCAT and PROFINET. The device's industrial temperature grade (-40°C to +100°C) ensures reliable operation in harsh factory environments. The integration reduces system cost and board space compared to discrete FPGA and processor solutions.
推荐
High-Performance Video Processing
The XC7Z045-2FBG676I excels in video processing applications. Its 350K logic cells can implement multiple video processing pipelines, including scaling, color space conversion, and compression. The block RAM (16.25 Mb) supports line buffering and frame storage. The ARM cores run video analytics algorithms and manage system control. The device supports high-bandwidth DDR3 memory interfaces, enabling high-resolution video streams. This makes it suitable for medical imaging, surveillance, and broadcast equipment.
推荐
Aerospace and Defense
The XC7Z045-2FBG676I is used in aerospace and defense systems requiring high reliability and long-term availability. The industrial temperature grade and robust package make it suitable for avionics and military platforms. The programmable logic allows for custom encryption, signal processing, and sensor interfaces. The ARM cores run mission-critical software with real-time constraints. AMD's long product lifecycle support ensures availability for extended design cycles.
推荐
Medical Imaging
In medical imaging, the XC7Z045-2FBG676I provides the processing power for real-time image reconstruction and enhancement. The 900 DSP slices accelerate algorithms like FFT and filtering. The programmable logic can implement custom data acquisition interfaces for sensors like ultrasound transducers. The ARM cores run the user interface and communication protocols. The device's high performance enables advanced imaging modalities in a compact, low-power footprint.
推荐
Data Center Acceleration
The XC7Z045-2FBG676I can be used for data center acceleration, offloading tasks like network packet processing and storage virtualization. The programmable logic implements custom data paths with low latency. The ARM cores manage control plane functions. The high-speed transceivers support 10/25/40GbE interfaces. This SoC offers a balance of performance and flexibility for accelerating specific workloads in servers and network appliances.
推荐
推荐产品汇总
工程参考数据： XC7Z045-2FBG676I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC7Z045-1FBG676I | XC7Z045-2FFG676I | XC7Z030-1FBG676I |
|---|---|---|---|---|
| Package | 676-FCBGA (27x27) | 676-FCBGA (27x27) | 676-FCBGA (27x27) | 676-FCBGA (27x27) |
| Brand | AMD | AMD | AMD | AMD |
| Speed Grade | -2 | -1 | -2 | -1 |
| Logic Cells | 350K | 350K | 350K | 125K |
| Max Clock Frequency | 800 MHz | 766 MHz | 800 MHz | 766 MHz |
| Operating Temperature | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C |
| DSP Slices | 900 | 900 | 900 | 400 |
| Block RAM | 16.25 Mb | 16.25 Mb | 16.25 Mb | 3.75 Mb |
关键差异点
- Higher speed grade (-2) for maximum performance （对比 XC7Z045-1FBG676I)
- Larger logic density for complex designs （对比 XC7Z030-1FBG676I)
- Industrial temperature grade for harsh environments （对比 XC7Z045-2FFG676I)
设计说明
The XC7Z045-2FBG676I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (1.2V-3.3V depending on I/O bank). Proper power sequencing is critical to prevent damage. Use a power management IC like the UCD90120A to sequence the rails. Ensure adequate decoupling capacitors (100nF and 10uF) are placed close to each power pin.
The XC7Z045-2FBG676I can dissipate significant power, especially when using high-speed transceivers and large logic designs. The FCBGA package requires a thermal solution. Use a heatsink with thermal interface material and ensure adequate airflow. For high-power designs, consider a heat spreader. The junction temperature must not exceed 100°C for the industrial grade.
The 676-FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. Use at least 8 layers with dedicated power and ground planes. For the DDR3 interface, follow the layout guidelines in the AMD UG586 document. Place the FPGA close to the memory to minimize trace lengths. Use via-in-pad for the BGA to improve routing density.
合规信息
RoHS compliant per distributor data. AEC-Q100 not applicable for this SoC.
