XC7Z045-2FBG676I - Zynq-7000 SoC, 350K Logic Cells | AMD
MPN: XC7Z045-2FBG676I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $850 | $850.00 |
| 10 | $780 | $7,800.00 |
| 100 | $720 | $72,000.00 |
| 500 | $680 | $340,000.00 |
| 1,000 | $650 | $650,000.00 |
Drop-in alternatives for XC7Z045-2FBG676I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7Z045-1FBG676I
β Drop-Inβ In Stock
$520 / Unit
View Datasheet βXC7Z045-2FFG676I
β Drop-Inπ Reference alternative (not in catalog)
XC7Z030-1FBG676I
β Drop-Inπ Reference alternative (not in catalog)
XC7Z045-L2FFG676I
β Drop-Inπ Reference alternative (not in catalog)
XC7Z045-2FBG676I Maximum Ratings & Electrical Characteristics
| Family | Zynq-7000 |
| Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Primary Attributes | Kintex-7 FPGA, 350K Logic Cells |
| Number of Logic Cells | 350000 |
| Number of DSP Slices | 900 |
| Block RAM | 16.25 Mb |
| Maximum Clock Frequency | 800 MHz |
| Number of I/O | [DATA_NEEDED: Number of I/O] |
| Package / Case | 676-FCBGA (27x27) |
| Supplier Device Package | 676-FCBGA |
| Operating Temperature | -40Β°C to +100Β°C (TJ) |
| Speed Grade | -2 |
| Mounting Type | Surface Mount |
| Supply Voltage | 1.2V~3.3V |
| RoHS Status | Compliant |
XC7Z045-2FBG676I Pin Configuration
| Pin A1 | GND β Ground |
| Pin A2 | VCCO_0 β I/O bank 0 supply voltage |
| Pin B1 | IO_L1P_T0_0 β I/O pin, bank 0 |
| Pin B2 | IO_L1N_T0_0 β I/O pin, bank 0 |
| Pin C1 | IO_L2P_T0_0 β I/O pin, bank 0 |
| Pin C2 | IO_L2N_T0_0 β I/O pin, bank 0 |
| Pin D1 | VCCINT β Internal core supply voltage |
| Pin D2 | GND β Ground |
| Pin E1 | IO_L3P_T0_0 β I/O pin, bank 0 |
| Pin E2 | IO_L3N_T0_0 β I/O pin, bank 0 |
| Pin F1 | IO_L4P_T0_0 β I/O pin, bank 0 |
| Pin F2 | IO_L4N_T0_0 β I/O pin, bank 0 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7Z045-2FBG676I is suitable for 6 applications: Software-Defined Radio, Industrial Motor Control, High-Performance Video Processing, Aerospace and Defense, Medical Imaging, Data Center Acceleration.
Software-Defined Radio
The XC7Z045-2FBG676I is ideal for software-defined radio (SDR) systems. Its 350K logic cells and 900 DSP slices enable complex baseband processing, such as FFT and channel filtering, in the programmable logic. The dual-core ARM Cortex-A9 at 800MHz runs protocol stacks and control software. The high-speed transceivers support data conversion interfaces. This SoC provides a flexible platform for multi-standard communication systems, allowing reconfiguration without hardware changes.
Recommended
Industrial Motor Control
In industrial motor control, the XC7Z045-2FBG676I enables high-performance, real-time control. The programmable logic implements custom PWM generation, encoder interfaces, and safety logic with deterministic timing. The ARM cores handle communication protocols like EtherCAT and PROFINET. The device's industrial temperature grade (-40Β°C to +100Β°C) ensures reliable operation in harsh factory environments. The integration reduces system cost and board space compared to discrete FPGA and processor solutions.
Recommended
High-Performance Video Processing
The XC7Z045-2FBG676I excels in video processing applications. Its 350K logic cells can implement multiple video processing pipelines, including scaling, color space conversion, and compression. The block RAM (16.25 Mb) supports line buffering and frame storage. The ARM cores run video analytics algorithms and manage system control. The device supports high-bandwidth DDR3 memory interfaces, enabling high-resolution video streams. This makes it suitable for medical imaging, surveillance, and broadcast equipment.
Recommended
Aerospace and Defense
The XC7Z045-2FBG676I is used in aerospace and defense systems requiring high reliability and long-term availability. The industrial temperature grade and robust package make it suitable for avionics and military platforms. The programmable logic allows for custom encryption, signal processing, and sensor interfaces. The ARM cores run mission-critical software with real-time constraints. AMD's long product lifecycle support ensures availability for extended design cycles.
Recommended
Medical Imaging
In medical imaging, the XC7Z045-2FBG676I provides the processing power for real-time image reconstruction and enhancement. The 900 DSP slices accelerate algorithms like FFT and filtering. The programmable logic can implement custom data acquisition interfaces for sensors like ultrasound transducers. The ARM cores run the user interface and communication protocols. The device's high performance enables advanced imaging modalities in a compact, low-power footprint.
Recommended
Data Center Acceleration
The XC7Z045-2FBG676I can be used for data center acceleration, offloading tasks like network packet processing and storage virtualization. The programmable logic implements custom data paths with low latency. The ARM cores manage control plane functions. The high-speed transceivers support 10/25/40GbE interfaces. This SoC offers a balance of performance and flexibility for accelerating specific workloads in servers and network appliances.
Recommended
Recommended Products Summary
Engineering reference data for XC7Z045-2FBG676I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7Z045-1FBG676I | XC7Z045-2FFG676I | XC7Z030-1FBG676I |
|---|---|---|---|---|
| Package | 676-FCBGA (27x27) | 676-FCBGA (27x27) | 676-FCBGA (27x27) | 676-FCBGA (27x27) |
| Brand | AMD | AMD | AMD | AMD |
| Speed Grade | -2 | -1 | -2 | -1 |
| Logic Cells | 350K | 350K | 350K | 125K |
| Max Clock Frequency | 800 MHz | 766 MHz | 800 MHz | 766 MHz |
| Operating Temperature | -40Β°C to +100Β°C | -40Β°C to +100Β°C | -40Β°C to +100Β°C | -40Β°C to +100Β°C |
| DSP Slices | 900 | 900 | 900 | 400 |
| Block RAM | 16.25 Mb | 16.25 Mb | 16.25 Mb | 3.75 Mb |
Key Differentiators
- Higher speed grade (-2) for maximum performance (vs XC7Z045-1FBG676I)
- Larger logic density for complex designs (vs XC7Z030-1FBG676I)
- Industrial temperature grade for harsh environments (vs XC7Z045-2FFG676I)
Design Notes
The XC7Z045-2FBG676I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (1.2V-3.3V depending on I/O bank). Proper power sequencing is critical to prevent damage. Use a power management IC like the UCD90120A to sequence the rails. Ensure adequate decoupling capacitors (100nF and 10uF) are placed close to each power pin.
The XC7Z045-2FBG676I can dissipate significant power, especially when using high-speed transceivers and large logic designs. The FCBGA package requires a thermal solution. Use a heatsink with thermal interface material and ensure adequate airflow. For high-power designs, consider a heat spreader. The junction temperature must not exceed 100Β°C for the industrial grade.
The 676-FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. Use at least 8 layers with dedicated power and ground planes. For the DDR3 interface, follow the layout guidelines in the AMD UG586 document. Place the FPGA close to the memory to minimize trace lengths. Use via-in-pad for the BGA to improve routing density.
Compliance Information
RoHS compliant per distributor data. AEC-Q100 not applicable for this SoC.
