XCZU47DR-1FFVE1156E - RFSoC, 930K Logic Cells | AMD
料号： XCZU47DR-1FFVE1156E ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $21409.06 | $21,409.06 |
| 10 | $20500 | $205,000.00 |
| 100 | $19500 | $1,950,000.00 |
| 500 | $18500 | $9,250,000.00 |
| 1,000 | $17500 | $17,500,000.00 |
XCZU47DR-1FFVE1156E 概述
A Zynq UltraScale+ RFSoC is a class of adaptive SoC that combines a multi-core ARM processing system (PS) with programmable logic (PL) and, in this 'DR' variant, integrated RF data converters. This integration eliminates the need for separate discrete data converters, reducing board space, power, and latency in RF systems. The architecture allows for a single-chip solution that can handle digital signal processing, control, and RF front-end tasks.
Key features of the XCZU47DR-1FFVE1156E include 930K+ logic cells, a 500MHz maximum frequency for the FPGA fabric, and a 1.2GHz maximum frequency for the ARM Cortex-A53 processor. The device supports a wide range of I/O standards and includes features such as DMA and WDT. The operating temperature range is 0°C to 100°C (Tj), making it suitable for commercial and industrial environments.
The RFSoC architecture integrates high-speed analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) directly into the device, enabling direct RF sampling and synthesis. This reduces the complexity of the analog front-end and improves system performance by eliminating the need for multiple intermediate frequency (IF) stages. The device also includes a comprehensive set of peripherals and interfaces for system integration.
Typical applications for the XCZU47DR-1FFVE1156E include 5G wireless base stations, phased array radar, test and measurement equipment, and software-defined radio (SDR) systems. Its high logic density and integrated RF converters make it ideal for applications requiring high bandwidth and low latency.
When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The 1156-FCBGA package requires a robust PCB layout with adequate ground planes and thermal vias to ensure reliable operation at high power levels.
直接替换替代料： XCZU47DR-1FFVE1156E ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
XCZU47DR-1FFVE1156I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XCZU48DR-1FFVE1156E
✅ 直接替换📋 参考替代料（不在目录中）
XCZU48DR-1FFVE1156I
✅ 直接替换📋 参考替代料（不在目录中）
XCZU47DR-2FFVE1156E
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XCZU47DR-1FFVE1156I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XCZU47DR-1FFVE1156E 最大额定值与电气特性
| Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Logic Cells | 930K+ |
| Max FPGA Frequency | 500 MHz |
| Max Processor Frequency | 1.2 GHz |
| 封装 | 1156-FCBGA (35x35) |
| 工作温度 | 0°C to 100°C (Tj) |
| Series | Zynq UltraScale+ RFSoC |
| Type | DMA, WDT |
| 安装类型 | Surface Mount |
| AEC-Q100 | not_applicable |
XCZU47DR-1FFVE1156E 引脚配置
| 引脚 A1 | GND — Ground |
| 引脚 A2 | VCCINT — Internal core voltage |
| 引脚 A3 | VCCAUX — Auxiliary voltage |
| 引脚 A4 | VCCO_0 — I/O bank 0 voltage |
| 引脚 A5 | IO_L1P_T0 — User I/O |
| 引脚 A6 | IO_L1N_T0 — User I/O |
| 引脚 A7 | IO_L2P_T0 — User I/O |
| 引脚 A8 | IO_L2N_T0 — User I/O |
| 引脚 A9 | GND — Ground |
| 引脚 A10 | VCCINT — Internal core voltage |
| 引脚 A11 | VCCAUX — Auxiliary voltage |
| 引脚 A12 | VCCO_1 — I/O bank 1 voltage |
典型应用
XCZU47DR-1FFVE1156E 适用于 6 应用s: 5G Wireless Base Stations, Phased Array Radar, Test and Measurement Equipment, Software-Defined Radio (SDR), Medical Imaging Systems, Aerospace and Defense.
5G Wireless Base Stations
The XCZU47DR-1FFVE1156E is ideal for 5G base stations due to its integrated RF data converters, which enable direct RF sampling and synthesis. This reduces the need for external analog front-end components, lowering system cost and power. The 930K+ logic cells provide ample resources for beamforming, channel coding, and signal processing algorithms. The ARM Cortex-A53 processors handle the protocol stack and control plane, while the Cortex-R5 processors manage real-time tasks. The device's high-speed transceivers support CPRI/eCPRI interfaces for fronthaul connectivity.
推荐
Phased Array Radar
In phased array radar systems, the XCZU47DR-1FFVE1156E excels by integrating multiple ADC/DAC channels that directly sample RF signals. This eliminates the need for multiple down-conversion stages, simplifying the analog chain and improving signal fidelity. The FPGA fabric can implement digital beamforming algorithms, pulse compression, and Doppler processing. The ARM processors provide system control and data formatting. The device's high logic density and DSP slices enable real-time processing of multiple radar beams simultaneously, making it suitable for defense and weather radar applications.
推荐
Test and Measurement Equipment
The XCZU47DR-1FFVE1156E is well-suited for test and measurement equipment such as spectrum analyzers and signal generators. Its integrated RF data converters allow for direct RF signal capture and generation, enabling high-bandwidth analysis and synthesis. The FPGA fabric can implement FFTs, filters, and modulation/demodulation algorithms. The ARM processors run the user interface and control software. The device's high-speed transceivers support data streaming to host computers via PCIe or Ethernet. The 930K logic cells provide flexibility for various measurement functions.
推荐
Software-Defined Radio (SDR)
For SDR applications, the XCZU47DR-1FFVE1156E provides a complete single-chip solution. The integrated RF data converters enable direct sampling of a wide frequency range, from HF to C-band. The FPGA fabric can implement various modulation schemes, filters, and channelizers. The ARM processors handle the protocol stack and user interface. This integration reduces board space and power consumption compared to discrete solutions. The device's high logic density allows for multiple SDR channels to be processed simultaneously, making it ideal for cognitive radio and spectrum monitoring systems.
推荐
Medical Imaging Systems
The XCZU47DR-1FFVE1156E can be used in medical imaging systems such as ultrasound and MRI. Its high logic density and DSP capabilities enable real-time image processing, including beamforming, filtering, and image enhancement. The ARM processors can run the imaging algorithms and control the system. The integrated RF data converters can be used for ultrasound signal acquisition. The device's low latency and high throughput make it suitable for real-time imaging applications. The commercial temperature grade is suitable for controlled medical environments.
推荐
Aerospace and Defense
In aerospace and defense applications, the XCZU47DR-1FFVE1156E offers a high-performance, secure processing platform. Its integrated RF data converters are ideal for electronic warfare and signals intelligence systems. The FPGA fabric can implement encryption, decryption, and signal processing algorithms. The ARM processors provide secure boot and system management. The device's high-speed transceivers support various communication protocols. The commercial temperature grade is suitable for ground-based systems, while the industrial grade variant is available for airborne applications.
推荐
推荐产品汇总
工程参考数据： XCZU47DR-1FFVE1156E ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XCZU47DR-1FFVE1156I | XCZU48DR-1FFVE1156E | XCZU48DR-1FFVE1156I |
|---|---|---|---|---|
| Package | 1156-FCBGA (35x35) | 1156-FCBGA (35x35) - same | 1156-FCBGA (35x35) - same | 1156-FCBGA (35x35) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 930K+ | 930K+ | 930K+ | 930K+ |
| Max FPGA Frequency | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Max Processor Frequency | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz |
| Operating Temperature | 0°C to 100°C (Tj) | -40°C to 100°C (Tj) | 0°C to 100°C (Tj) | -40°C to 100°C (Tj) |
| Speed Grade | -1 | -1 | -1 | -1 |
| Peripherals | DMA, WDT | DMA, WDT | DMA, WDT | DMA, WDT |
关键差异点
- Integrated RF data converters （对比 XC7Z020)
- Higher logic density （对比 XCZU47DR-1FFVE1156I)
- Commercial temperature grade （对比 XCZU47DR-1FFVE1156I)
设计说明
The XCZU47DR-1FFVE1156E requires multiple power rails: VCCINT (core), VCCAUX (auxiliary), and VCCO (I/O banks). Use a dedicated power management IC (PMIC) to sequence these rails correctly. Refer to the Zynq UltraScale+ power management application note for recommended sequencing. Ensure adequate decoupling capacitors (100nF and 10uF) are placed close to each power pin to minimize noise and voltage droop during high-speed switching.
The 1156-FCBGA package can dissipate significant power, especially when the FPGA fabric is heavily utilized. The maximum junction temperature is 100°C. Use a heatsink and forced airflow for high-power designs. Ensure the PCB has adequate thermal vias under the package to conduct heat to the ground plane. Calculate the thermal budget using the device's power dissipation and thermal resistance (theta_JA) values from the datasheet.
For high-speed signals, use controlled impedance traces and maintain proper ground planes. The RF data converters require careful layout to minimize noise and crosstalk. Follow the Zynq UltraScale+ PCB design guide (UG583) for recommended stack-up and routing rules. Use high-quality, low-ESR capacitors for power supply filtering. Ensure all ground pins are connected to the ground plane with low inductance vias.
合规信息
Compliance data not provided in the verified web data. Please refer to the AMD datasheet or contact AMD for RoHS/REACH status.
