XCZU47DR-1FFVE1156E - RFSoC, 930K Logic Cells | AMD
MPN: XCZU47DR-1FFVE1156E β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $21409.06 | $21,409.06 |
| 10 | $20500 | $205,000.00 |
| 100 | $19500 | $1,950,000.00 |
| 500 | $18500 | $9,250,000.00 |
| 1,000 | $17500 | $17,500,000.00 |
Drop-in alternatives for XCZU47DR-1FFVE1156E β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XCZU47DR-1FFVE1156I
β Drop-Inπ Reference alternative (not in catalog)
XCZU48DR-1FFVE1156E
β Drop-Inπ Reference alternative (not in catalog)
XCZU48DR-1FFVE1156I
β Drop-Inπ Reference alternative (not in catalog)
XCZU47DR-2FFVE1156E
β Drop-Inπ Reference alternative (not in catalog)
XCZU47DR-1FFVE1156I
β Drop-Inπ Reference alternative (not in catalog)
XCZU47DR-1FFVE1156E Maximum Ratings & Electrical Characteristics
| Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Logic Cells | 930K+ |
| Max FPGA Frequency | 500 MHz |
| Max Processor Frequency | 1.2 GHz |
| Package | 1156-FCBGA (35x35) |
| Operating Temperature | 0Β°C to 100Β°C (Tj) |
| Series | Zynq UltraScale+ RFSoC |
| Type | DMA, WDT |
| Number of I/O | [DATA_NEEDED: Number of I/O] |
| Mounting Type | Surface Mount |
| RoHS Status | [DATA_NEEDED: RoHS Status] |
| REACH Status | [DATA_NEEDED: REACH Status] |
| AEC-Q100 | not_applicable |
| Lead-Free | [DATA_NEEDED: Lead-Free Status] |
| Halogen-Free | [DATA_NEEDED: Halogen-Free Status] |
XCZU47DR-1FFVE1156E Pin Configuration
| Pin A1 | GND β Ground |
| Pin A2 | VCCINT β Internal core voltage |
| Pin A3 | VCCAUX β Auxiliary voltage |
| Pin A4 | VCCO_0 β I/O bank 0 voltage |
| Pin A5 | IO_L1P_T0 β User I/O |
| Pin A6 | IO_L1N_T0 β User I/O |
| Pin A7 | IO_L2P_T0 β User I/O |
| Pin A8 | IO_L2N_T0 β User I/O |
| Pin A9 | GND β Ground |
| Pin A10 | VCCINT β Internal core voltage |
| Pin A11 | VCCAUX β Auxiliary voltage |
| Pin A12 | VCCO_1 β I/O bank 1 voltage |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCZU47DR-1FFVE1156E is suitable for 6 applications: 5G Wireless Base Stations, Phased Array Radar, Test and Measurement Equipment, Software-Defined Radio (SDR), Medical Imaging Systems, Aerospace and Defense.
5G Wireless Base Stations
The XCZU47DR-1FFVE1156E is ideal for 5G base stations due to its integrated RF data converters, which enable direct RF sampling and synthesis. This reduces the need for external analog front-end components, lowering system cost and power. The 930K+ logic cells provide ample resources for beamforming, channel coding, and signal processing algorithms. The ARM Cortex-A53 processors handle the protocol stack and control plane, while the Cortex-R5 processors manage real-time tasks. The device's high-speed transceivers support CPRI/eCPRI interfaces for fronthaul connectivity.
Recommended
Phased Array Radar
In phased array radar systems, the XCZU47DR-1FFVE1156E excels by integrating multiple ADC/DAC channels that directly sample RF signals. This eliminates the need for multiple down-conversion stages, simplifying the analog chain and improving signal fidelity. The FPGA fabric can implement digital beamforming algorithms, pulse compression, and Doppler processing. The ARM processors provide system control and data formatting. The device's high logic density and DSP slices enable real-time processing of multiple radar beams simultaneously, making it suitable for defense and weather radar applications.
Recommended
Test and Measurement Equipment
The XCZU47DR-1FFVE1156E is well-suited for test and measurement equipment such as spectrum analyzers and signal generators. Its integrated RF data converters allow for direct RF signal capture and generation, enabling high-bandwidth analysis and synthesis. The FPGA fabric can implement FFTs, filters, and modulation/demodulation algorithms. The ARM processors run the user interface and control software. The device's high-speed transceivers support data streaming to host computers via PCIe or Ethernet. The 930K logic cells provide flexibility for various measurement functions.
Recommended
Software-Defined Radio (SDR)
For SDR applications, the XCZU47DR-1FFVE1156E provides a complete single-chip solution. The integrated RF data converters enable direct sampling of a wide frequency range, from HF to C-band. The FPGA fabric can implement various modulation schemes, filters, and channelizers. The ARM processors handle the protocol stack and user interface. This integration reduces board space and power consumption compared to discrete solutions. The device's high logic density allows for multiple SDR channels to be processed simultaneously, making it ideal for cognitive radio and spectrum monitoring systems.
Recommended
Medical Imaging Systems
The XCZU47DR-1FFVE1156E can be used in medical imaging systems such as ultrasound and MRI. Its high logic density and DSP capabilities enable real-time image processing, including beamforming, filtering, and image enhancement. The ARM processors can run the imaging algorithms and control the system. The integrated RF data converters can be used for ultrasound signal acquisition. The device's low latency and high throughput make it suitable for real-time imaging applications. The commercial temperature grade is suitable for controlled medical environments.
Recommended
Aerospace and Defense
In aerospace and defense applications, the XCZU47DR-1FFVE1156E offers a high-performance, secure processing platform. Its integrated RF data converters are ideal for electronic warfare and signals intelligence systems. The FPGA fabric can implement encryption, decryption, and signal processing algorithms. The ARM processors provide secure boot and system management. The device's high-speed transceivers support various communication protocols. The commercial temperature grade is suitable for ground-based systems, while the industrial grade variant is available for airborne applications.
Recommended
Recommended Products Summary
Engineering reference data for XCZU47DR-1FFVE1156E β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCZU47DR-1FFVE1156I | XCZU48DR-1FFVE1156E | XCZU48DR-1FFVE1156I |
|---|---|---|---|---|
| Package | 1156-FCBGA (35x35) | 1156-FCBGA (35x35) - same | 1156-FCBGA (35x35) - same | 1156-FCBGA (35x35) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 930K+ | 930K+ | 930K+ | 930K+ |
| Max FPGA Frequency | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Max Processor Frequency | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz |
| Operating Temperature | 0Β°C to 100Β°C (Tj) | -40Β°C to 100Β°C (Tj) | 0Β°C to 100Β°C (Tj) | -40Β°C to 100Β°C (Tj) |
| Speed Grade | -1 | -1 | -1 | -1 |
| Peripherals | DMA, WDT | DMA, WDT | DMA, WDT | DMA, WDT |
Key Differentiators
- Integrated RF data converters (vs XC7Z020)
- Higher logic density (vs XCZU47DR-1FFVE1156I)
- Commercial temperature grade (vs XCZU47DR-1FFVE1156I)
Design Notes
The XCZU47DR-1FFVE1156E requires multiple power rails: VCCINT (core), VCCAUX (auxiliary), and VCCO (I/O banks). Use a dedicated power management IC (PMIC) to sequence these rails correctly. Refer to the Zynq UltraScale+ power management application note for recommended sequencing. Ensure adequate decoupling capacitors (100nF and 10uF) are placed close to each power pin to minimize noise and voltage droop during high-speed switching.
The 1156-FCBGA package can dissipate significant power, especially when the FPGA fabric is heavily utilized. The maximum junction temperature is 100Β°C. Use a heatsink and forced airflow for high-power designs. Ensure the PCB has adequate thermal vias under the package to conduct heat to the ground plane. Calculate the thermal budget using the device's power dissipation and thermal resistance (theta_JA) values from the datasheet.
For high-speed signals, use controlled impedance traces and maintain proper ground planes. The RF data converters require careful layout to minimize noise and crosstalk. Follow the Zynq UltraScale+ PCB design guide (UG583) for recommended stack-up and routing rules. Use high-quality, low-ESR capacitors for power supply filtering. Ensure all ground pins are connected to the ground plane with low inductance vias.
Compliance Information
Compliance data not provided in the verified web data. Please refer to the AMD datasheet or contact AMD for RoHS/REACH status.
