5CSEBA6U19I7NTS vs 5CSEBA6U19I7N مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ 5CSEBA6U19I7NTS بواسطة Intel و 5CSEBA6U19I7N بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Intel
5CSEBA6U19I7NTS - Cyclone V SE SoC FPGA, 110K LE, 925MHz, 484-UBGA | Intel
5CSEBA6U19I7NTS ✓ نشطIntel
5CSEBA6U19I7N - Cyclone V SE SoC FPGA, 110K LE, Dual ARM Cortex-A9 800MHz | Intel
5CSEBA6U19I7N ✓ نشطمقارنة المواصفات
| المعامل | 5CSEBA6U19I7NTS | 5CSEBA6U19I7N |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Product Type | System-on-Chip FPGA (SoC FPGA) | — |
| Series | Cyclone V SE | 5CSEBA6 |
| Logic Elements | 110K | 110,000 |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 925 MHz | 800 MHz |
| FPGA Architecture | Cyclone V SE, 28 nm low-power process | — |
| العلبة | 484-ball UBGA (19x19 mm) | 484-pin UBGAFBGA (UBGA-484, 19x19 mm) |
| درجة حرارة التشغيل | -40C to +100C (Industrial, 'I7' speed grade) | -40C to +100C (Industrial) |
| نوع التركيب | Surface Mount (BGA) | Surface Mount (BGA) |
| مستوى MSL | [DATA_NEEDED: MSL rating] | — |
| حالة RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Configuration Method | SRAM-based, via Quartus Prime | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 112 (18x18 multipliers) |
| نوع الذاكرة | DDR3/DDR3L with ECC support | — |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART | — |
| Device Family | Cyclone V | — |
| Family Variant | SE (SoC FPGA with HPS) | — |
| Family | — | Cyclone V SE SoC FPGA |
| Device Variant | — | 5CSEA6 (U19 package, 110K LE) |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore |
| Embedded Memory | — | 4.45 Mbits (M10K + MLAB) |
| Hard Memory Controller | — | DDR3, DDR3L, LPDDR2 |
| Transceivers | — | Up to 9 channels, 3.125 Gbps |
| PLLs | — | 6 (FPGA) + 3 (HPS) |
| User I/O Banks | — | 8 |
| Maximum User I/O | — | 288 (package-dependent) |
| Process Technology | — | TSMC 28 nm low-power |
| جهد التغذية | — | Multi-rail (1.1 V core, 1.5/1.8/2.5/3.0/3.3 V I/O) |
| Configuration Modes | — | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |