5CSEBA6U19I7NTS vs 5CSEBA6U19I7N Perbandingan
Perbandingan bersamaan detil 5CSEBA6U19I7NTS dari Intel dan 5CSEBA6U19I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
5CSEBA6U19I7NTS - Cyclone V SE SoC FPGA, 110K LE, 925MHz, 484-UBGA | Intel
5CSEBA6U19I7NTS ✓ AktifIntel
5CSEBA6U19I7N - Cyclone V SE SoC FPGA, 110K LE, Dual ARM Cortex-A9 800MHz | Intel
5CSEBA6U19I7N ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | 5CSEBA6U19I7NTS | 5CSEBA6U19I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Type | System-on-Chip FPGA (SoC FPGA) | — |
| Series | Cyclone V SE | 5CSEBA6 |
| Logic Elements | 110K | 110,000 |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 925 MHz | 800 MHz |
| FPGA Architecture | Cyclone V SE, 28 nm low-power process | — |
| Paket | 484-ball UBGA (19x19 mm) | 484-pin UBGAFBGA (UBGA-484, 19x19 mm) |
| Suhu Kerja | -40C to +100C (Industrial, 'I7' speed grade) | -40C to +100C (Industrial) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Level MSL | [DATA_NEEDED: MSL rating] | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Configuration Method | SRAM-based, via Quartus Prime | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 112 (18x18 multipliers) |
| Tipe Memori | DDR3/DDR3L with ECC support | — |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART | — |
| Device Family | Cyclone V | — |
| Family Variant | SE (SoC FPGA with HPS) | — |
| Family | — | Cyclone V SE SoC FPGA |
| Device Variant | — | 5CSEA6 (U19 package, 110K LE) |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore |
| Embedded Memory | — | 4.45 Mbits (M10K + MLAB) |
| Hard Memory Controller | — | DDR3, DDR3L, LPDDR2 |
| Transceivers | — | Up to 9 channels, 3.125 Gbps |
| PLLs | — | 6 (FPGA) + 3 (HPS) |
| User I/O Banks | — | 8 |
| Maximum User I/O | — | 288 (package-dependent) |
| Process Technology | — | TSMC 28 nm low-power |
| Tegangan Pemuat | — | Multi-rail (1.1 V core, 1.5/1.8/2.5/3.0/3.3 V I/O) |
| Configuration Modes | — | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |