5CSEBA6U19I7NTS vs 5CSEBA6U19I7N Karşılaştırma
Ayrıntılı yan yana karşılaştırma 5CSEBA6U19I7NTS tarafından Intel ve 5CSEBA6U19I7N tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Intel
5CSEBA6U19I7NTS - Cyclone V SE SoC FPGA, 110K LE, 925MHz, 484-UBGA | Intel
5CSEBA6U19I7NTS ✓ AktifIntel
5CSEBA6U19I7N - Cyclone V SE SoC FPGA, 110K LE, Dual ARM Cortex-A9 800MHz | Intel
5CSEBA6U19I7N ✓ AktifÖzellik Karşılaştırması
| Parametre | 5CSEBA6U19I7NTS | 5CSEBA6U19I7N |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Product Type | System-on-Chip FPGA (SoC FPGA) | — |
| Series | Cyclone V SE | 5CSEBA6 |
| Logic Elements | 110K | 110,000 |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 925 MHz | 800 MHz |
| FPGA Architecture | Cyclone V SE, 28 nm low-power process | — |
| Paket | 484-ball UBGA (19x19 mm) | 484-pin UBGAFBGA (UBGA-484, 19x19 mm) |
| İşletim Sıcaklığı | -40C to +100C (Industrial, 'I7' speed grade) | -40C to +100C (Industrial) |
| Montaj Türü | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL Seviyesi | [DATA_NEEDED: MSL rating] | — |
| RoHS Durumu | Compliant | Compliant |
| Lead-Free | Yes | — |
| Configuration Method | SRAM-based, via Quartus Prime | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 112 (18x18 multipliers) |
| Bellek Türü | DDR3/DDR3L with ECC support | — |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART | — |
| Device Family | Cyclone V | — |
| Family Variant | SE (SoC FPGA with HPS) | — |
| Family | — | Cyclone V SE SoC FPGA |
| Device Variant | — | 5CSEA6 (U19 package, 110K LE) |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore |
| Embedded Memory | — | 4.45 Mbits (M10K + MLAB) |
| Hard Memory Controller | — | DDR3, DDR3L, LPDDR2 |
| Transceivers | — | Up to 9 channels, 3.125 Gbps |
| PLLs | — | 6 (FPGA) + 3 (HPS) |
| User I/O Banks | — | 8 |
| Maximum User I/O | — | 288 (package-dependent) |
| Process Technology | — | TSMC 28 nm low-power |
| Besleme Gerilimi | — | Multi-rail (1.1 V core, 1.5/1.8/2.5/3.0/3.3 V I/O) |
| Configuration Modes | — | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |