CMUDM8004-TR-PBFREE vs NOPB مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ CMUDM8004-TR-PBFREE بواسطة Central Semiconductor و NOPB بواسطة Texas Instruments. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Central Semiconductor
CMUDM8004-TR-PBFREE - 30V 450mA P-Channel MOSFET | Central Semiconductor
CMUDM8004-TR-PBFREE ✓ نشطمقارنة المواصفات
| المعامل | CMUDM8004-TR-PBFREE | NOPB |
|---|---|---|
| العلامة التجارية | Central Semiconductor | Texas Instruments |
| الفئة | MOSFETs | Logic ICs |
| حالة دورة الحياة | نشط | نشط |
| نوع الترانزستور | P-Channel Enhancement Mode MOSFET | — |
| Drain-Source Voltage (Vdss) | 30 V | — |
| Continuous Drain Current (Id) at Ta | 450 mA | — |
| Power Dissipation (Pd) at Ta | 250 mW | — |
| نوع التركيب | Surface Mount | Surface Mount (packaging dependent on base MPN) |
| العلبة | SOT-523 | — |
| Configuration | Single FET | — |
| Gate Drive | Low threshold voltage, logic-compatible | — |
| Drain-Source On-Resistance (Rds on) | [DATA_NEEDED: Rds(on)] | — |
| Gate-Source Threshold Voltage (Vgs th) | [DATA_NEEDED: Vgs(th)] | — |
| Gate-Source Voltage (Vgs) Max | [DATA_NEEDED: Vgs max] | — |
| نطاق درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | — |
| Lead Free | Yes (PBFREE) | — |
| حالة RoHS | Compliant | — |
| Packaging | Tape and Reel (TR) | — |
| Typical Applications | Load/Power Switches, Power Supply Converter Circuits | — |
| Technology | Silicon MOSFET | — |
| Suffix Type | — | Part-number ordering suffix (not a standalone IC) |
| Meaning | — | No Lead / No Pb (lead-free packaging) |
| Origin | — | National Semiconductor ordering system (inherited by TI) |
| Lead Finish | — | Matte tin (Sn) or Sn-Ag-Cu (lead-free) |
| RoHS Compliance | — | Yes - compliant with EU Directive 2011/65/EU |
| REACH Compliance | — | Compliant (per TI declaration) |
| Peak Reflow Temperature | — | 260 C (JEDEC J-STD-020 lead-free profile) |
| MSL Classification | — | Per JEDEC J-STD-033 (device-dependent, typically MSL 2 or 3) |
| درجة حرارة التشغيل | — | Inherits base MPN specification |
| Equivalent Legacy Suffixes | — | /PBFREE, /LEADFREE, /LF (vendor-specific) |
| Functional Equivalence | — | Identical die and electrical specs to non-NOPB variant |
| Backwards Compatibility | — | Compatible with Sn-Pb and lead-free assembly lines when reflow profiled correctly |
| Document Reference | — | TI Packaging Terminology Guide (ti.com/design-development/packaging) |
| Country of Origin | — | Multiple (per base MPN country of assembly) |