CMUDM8004-TR-PBFREE vs NOPB Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci CMUDM8004-TR-PBFREE disebabkan oleh Central Semiconductor dan NOPB disebabkan oleh Texas Instruments. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Central Semiconductor
CMUDM8004-TR-PBFREE - 30V 450mA P-Channel MOSFET | Central Semiconductor
CMUDM8004-TR-PBFREE ✓ AktifPengandingan Spesifikasi
| Parametr | CMUDM8004-TR-PBFREE | NOPB |
|---|---|---|
| Merek | Central Semiconductor | Texas Instruments |
| Kategori | MOSFETs | Logic ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Transistor | P-Channel Enhancement Mode MOSFET | — |
| Drain-Source Voltage (Vdss) | 30 V | — |
| Continuous Drain Current (Id) at Ta | 450 mA | — |
| Power Dissipation (Pd) at Ta | 250 mW | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (packaging dependent on base MPN) |
| Kemasan | SOT-523 | — |
| Configuration | Single FET | — |
| Gate Drive | Low threshold voltage, logic-compatible | — |
| Drain-Source On-Resistance (Rds on) | [DATA_NEEDED: Rds(on)] | — |
| Gate-Source Threshold Voltage (Vgs th) | [DATA_NEEDED: Vgs(th)] | — |
| Gate-Source Voltage (Vgs) Max | [DATA_NEEDED: Vgs max] | — |
| Gambaran Suhu Operasi | [DATA_NEEDED: operating temperature range] | — |
| Lead Free | Yes (PBFREE) | — |
| Status RoHS | Compliant | — |
| Packaging | Tape and Reel (TR) | — |
| Typical Applications | Load/Power Switches, Power Supply Converter Circuits | — |
| Technology | Silicon MOSFET | — |
| Suffix Type | — | Part-number ordering suffix (not a standalone IC) |
| Meaning | — | No Lead / No Pb (lead-free packaging) |
| Origin | — | National Semiconductor ordering system (inherited by TI) |
| Lead Finish | — | Matte tin (Sn) or Sn-Ag-Cu (lead-free) |
| RoHS Compliance | — | Yes - compliant with EU Directive 2011/65/EU |
| REACH Compliance | — | Compliant (per TI declaration) |
| Peak Reflow Temperature | — | 260 C (JEDEC J-STD-020 lead-free profile) |
| MSL Classification | — | Per JEDEC J-STD-033 (device-dependent, typically MSL 2 or 3) |
| Suhu Operasi | — | Inherits base MPN specification |
| Equivalent Legacy Suffixes | — | /PBFREE, /LEADFREE, /LF (vendor-specific) |
| Functional Equivalence | — | Identical die and electrical specs to non-NOPB variant |
| Backwards Compatibility | — | Compatible with Sn-Pb and lead-free assembly lines when reflow profiled correctly |
| Document Reference | — | TI Packaging Terminology Guide (ti.com/design-development/packaging) |
| Country of Origin | — | Multiple (per base MPN country of assembly) |