EP1M350F780C6N vs EP1M350F780C7ES مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP1M350F780C6N بواسطة Intel و EP1M350F780C7ES بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Intel
EP1M350F780C6N - Mercury 350K FPGA, 486 I/O, 780-BGA | Intel (Altera)
EP1M350F780C6N ⚠ آخر فرصة للشراءمقارنة المواصفات
| المعامل | EP1M350F780C6N | EP1M350F780C7ES |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | آخر فرصة للشراء | نشط |
| Family | Mercury (EP1M350) | — |
| Device Type | Loadable Programmable Logic Device (PLD) / FPGA | — |
| Logic Family | CMOS, SRAM-based LUT | CMOS |
| System Gates | 350,000 | — |
| Logic Cells / Elements | 14,400 | — |
| User I/Os | 486 | — |
| Integrated Transceivers | Yes, with CDR up to 1.25 Gbps | — |
| Core Supply Voltage | 1.8 V | — |
| العلبة | 780-ball FC-FBGA (FINE LINE BGA-780) | — |
| Terminal Form | Ball | — |
| Package Code (JEDEC) | S-PBGA-B780 | — |
| درجة حرارة التشغيل | 0 C to 85 C | 0 C to 85 C |
| Configuration Interface | JTAG (IEEE 1149.1) / passive serial | — |
| حالة RoHS | [DATA_NEEDED: rohs_status] | unknown |
| مستوى MSL | [DATA_NEEDED: msl_level] | — |
| Lead-Free | [DATA_NEEDED: lead_free] | — |
| Architecture | Look-up table (LUT)-based, optimized for high-speed serial I/O | — |
| Total Package Pins / Balls | 780 | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| User I/O Count | — | 486 pins |
| Total Package Pins | — | 780 pins |
| Package Type | — | FINE LINE BGA-780 |
| Package Category | — | 780-BBGA |
| جهد التغذية | — | 1.8 V |
| Maximum Stated Transceiver Data Rate | — | 1.25 Gbps |
| Channels Supported at 1.25 Gbps | — | 8 channels |
| Remaining Channel Limit | — | 10 channels at 1.0 Gbps or less |
| Clock Data Recovery | — | Supported |
| High-Speed Transceivers | — | Integrated |
| نوع التركيب | — | Surface Mount |
| REACH Status | — | unknown |
| Logic Element Count | — | [DATA_NEEDED: logic element count] |
| Embedded Memory Capacity | — | [DATA_NEEDED: embedded memory capacity] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| المقاومة الحرارية | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |