EP1M350F780C6N vs EP1M350F780C7ES Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1M350F780C6N sa pamamagitan ng Intel at EP1M350F780C7ES sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP1M350F780C6N - Mercury 350K FPGA, 486 I/O, 780-BGA | Intel (Altera)
EP1M350F780C6N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP1M350F780C6N | EP1M350F780C7ES |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Family | Mercury (EP1M350) | — |
| Device Type | Loadable Programmable Logic Device (PLD) / FPGA | — |
| Logic Family | CMOS, SRAM-based LUT | CMOS |
| System Gates | 350,000 | — |
| Logic Cells / Elements | 14,400 | — |
| User I/Os | 486 | — |
| Integrated Transceivers | Yes, with CDR up to 1.25 Gbps | — |
| Core Supply Voltage | 1.8 V | — |
| Packhaging | 780-ball FC-FBGA (FINE LINE BGA-780) | — |
| Terminal Form | Ball | — |
| Package Code (JEDEC) | S-PBGA-B780 | — |
| Temperature na Operasyon | 0 C to 85 C | 0 C to 85 C |
| Configuration Interface | JTAG (IEEE 1149.1) / passive serial | — |
| Tindminan RoHS | [DATA_NEEDED: rohs_status] | unknown |
| Level ng MSL | [DATA_NEEDED: msl_level] | — |
| Lead-Free | [DATA_NEEDED: lead_free] | — |
| Architecture | Look-up table (LUT)-based, optimized for high-speed serial I/O | — |
| Total Package Pins / Balls | 780 | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| User I/O Count | — | 486 pins |
| Total Package Pins | — | 780 pins |
| Package Type | — | FINE LINE BGA-780 |
| Package Category | — | 780-BBGA |
| Volte ng Pagbibigay | — | 1.8 V |
| Maximum Stated Transceiver Data Rate | — | 1.25 Gbps |
| Channels Supported at 1.25 Gbps | — | 8 channels |
| Remaining Channel Limit | — | 10 channels at 1.0 Gbps or less |
| Clock Data Recovery | — | Supported |
| High-Speed Transceivers | — | Integrated |
| Uri ng Pagpapasok | — | Surface Mount |
| REACH Status | — | unknown |
| Logic Element Count | — | [DATA_NEEDED: logic element count] |
| Embedded Memory Capacity | — | [DATA_NEEDED: embedded memory capacity] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Thermal Resistance | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |