EP1M350F780C6N vs EP1M350F780C7ES Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1M350F780C6N disebabkan oleh Intel dan EP1M350F780C7ES disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP1M350F780C6N EP1M350F780C6N - Mercury 350K FPGA, 486 I/O, 780-BGA | Intel (Altera)

EP1M350F780C6N - Mercury 350K FPGA, 486 I/O, 780-BGA | Intel (Altera)

EP1M350F780C6N ⚠ Bahagian terakhir untuk beli
Intel
EP1M350F780C7ES EP1M350F780C7ES - 486-I/O Mercury FPGA | Intel

EP1M350F780C7ES - 486-I/O Mercury FPGA | Intel

EP1M350F780C7ES ✓ Aktif

Pengandingan Spesifikasi

Parametr EP1M350F780C6N EP1M350F780C7ES
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Aktif
Family Mercury (EP1M350) —
Device Type Loadable Programmable Logic Device (PLD) / FPGA —
Logic Family CMOS, SRAM-based LUT CMOS
System Gates 350,000 —
Logic Cells / Elements 14,400 —
User I/Os 486 —
Integrated Transceivers Yes, with CDR up to 1.25 Gbps —
Core Supply Voltage 1.8 V —
Kemasan 780-ball FC-FBGA (FINE LINE BGA-780) —
Terminal Form Ball —
Package Code (JEDEC) S-PBGA-B780 —
Suhu Operasi 0 C to 85 C 0 C to 85 C
Configuration Interface JTAG (IEEE 1149.1) / passive serial —
Status RoHS [DATA_NEEDED: rohs_status] unknown
Aras MSL [DATA_NEEDED: msl_level] —
Lead-Free [DATA_NEEDED: lead_free] —
Architecture Look-up table (LUT)-based, optimized for high-speed serial I/O —
Total Package Pins / Balls 780 —
Product Type — Field Programmable Gate Array (FPGA)
User I/O Count — 486 pins
Total Package Pins — 780 pins
Package Type — FINE LINE BGA-780
Package Category — 780-BBGA
Tegangan Pemberi Arus — 1.8 V
Maximum Stated Transceiver Data Rate — 1.25 Gbps
Channels Supported at 1.25 Gbps — 8 channels
Remaining Channel Limit — 10 channels at 1.0 Gbps or less
Clock Data Recovery — Supported
High-Speed Transceivers — Integrated
Jenis Pemasangan — Surface Mount
REACH Status — unknown
Logic Element Count — [DATA_NEEDED: logic element count]
Embedded Memory Capacity — [DATA_NEEDED: embedded memory capacity]
Transceiver Count — [DATA_NEEDED: transceiver count]
Package Dimensions — [DATA_NEEDED: package dimensions]
Tegangan Panas — [DATA_NEEDED: junction-to-ambient thermal resistance]

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