EP2A25F672C9 vs EP2A25F672I6 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2A25F672C9 بواسطة Altera و EP2A25F672I6 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP2A25F672C9 | EP2A25F672I6 |
|---|---|---|
| العلامة التجارية | Altera | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | NRND | NRND |
| Family | APEX II | APEX II |
| Logic Elements (LE) | Approximately 25,000 | — |
| Macro Cells | 2432 | — |
| User I/O | 492 | — |
| العلبة | 672-ball FCBGA (FineLine BGA) | 672-ball FineLine BGA (FBGA-672) |
| Package Dimensions | 27 mm x 27 mm | — |
| Ball Pitch | 1.0 mm | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | 0.18 µm CMOS |
| Logic Family | CMOS | — |
| Propagation Delay | 1.69 ns | — |
| درجة حرارة التشغيل | 0°C to 85°C (Commercial) | — |
| جهد التغذية | [DATA_NEEDED: core VCC voltage] | — |
| I/O Standards | LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) | — |
| Configuration | Passive Serial, Passive Parallel Synchronous, JTAG | — |
| Embedded Memory | ESBs for dual-port RAM, ROM, FIFO | Embedded System Blocks (ESB), dual-port RAM / CAM |
| نوع التركيب | Surface Mount | Surface Mount (BGA) |
| حالة RoHS | [DATA_NEEDED] | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements (typical gates) | — | 25,000 |
| Fabric Architecture | — | SRAM-based LUT |
| Core Voltage | — | 1.5 V |
| Configuration Method | — | External SRAM configuration device (EPC series) |
| Temperature Grade | — | Industrial (-40 °C to +100 °C ambient) |
| Speed Grade | — | 6 |
| DSP Blocks | — | MultiCore dedicated multipliers |
| Boundary Scan | — | JTAG (IEEE 1149.1) compliant |
| Clock Management | — | Dedicated PLL / clock tree circuitry |
| I/O Bank Count | — | [DATA_NEEDED: number of user I/O banks] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| مستوى MSL | — | [DATA_NEEDED: moisture sensitivity level] |