EP2A25F672C9 vs EP2A25F672I6 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A25F672C9 disebabkan oleh Altera dan EP2A25F672I6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2A25F672C9 EP2A25F672I6
Merek Altera Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Family APEX II APEX II
Logic Elements (LE) Approximately 25,000 —
Macro Cells 2432 —
User I/O 492 —
Kemasan 672-ball FCBGA (FineLine BGA) 672-ball FineLine BGA (FBGA-672)
Package Dimensions 27 mm x 27 mm —
Ball Pitch 1.0 mm —
Process Technology 0.15 µm all-layer copper, up to 8 metal layers 0.18 µm CMOS
Logic Family CMOS —
Propagation Delay 1.69 ns —
Suhu Operasi 0°C to 85°C (Commercial) —
Tegangan Pemberi Arus [DATA_NEEDED: core VCC voltage] —
I/O Standards LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) —
Configuration Passive Serial, Passive Parallel Synchronous, JTAG —
Embedded Memory ESBs for dual-port RAM, ROM, FIFO Embedded System Blocks (ESB), dual-port RAM / CAM
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Status RoHS [DATA_NEEDED] [DATA_NEEDED: RoHS compliance status]
Logic Elements (typical gates) — 25,000
Fabric Architecture — SRAM-based LUT
Core Voltage — 1.5 V
Configuration Method — External SRAM configuration device (EPC series)
Temperature Grade — Industrial (-40 °C to +100 °C ambient)
Speed Grade — 6
DSP Blocks — MultiCore dedicated multipliers
Boundary Scan — JTAG (IEEE 1149.1) compliant
Clock Management — Dedicated PLL / clock tree circuitry
I/O Bank Count — [DATA_NEEDED: number of user I/O banks]
Lead-Free — [DATA_NEEDED: lead-free status]
Aras MSL — [DATA_NEEDED: moisture sensitivity level]

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