EP2A25F672C9 vs EP2A25F672I6 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672C9 sa pamamagitan ng Altera at EP2A25F672I6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2A25F672C9 EP2A25F672I6
Brand Altera Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND NRND
Family APEX II APEX II
Logic Elements (LE) Approximately 25,000 —
Macro Cells 2432 —
User I/O 492 —
Packhaging 672-ball FCBGA (FineLine BGA) 672-ball FineLine BGA (FBGA-672)
Package Dimensions 27 mm x 27 mm —
Ball Pitch 1.0 mm —
Process Technology 0.15 µm all-layer copper, up to 8 metal layers 0.18 µm CMOS
Logic Family CMOS —
Propagation Delay 1.69 ns —
Temperature na Operasyon 0°C to 85°C (Commercial) —
Volte ng Pagbibigay [DATA_NEEDED: core VCC voltage] —
I/O Standards LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) —
Configuration Passive Serial, Passive Parallel Synchronous, JTAG —
Embedded Memory ESBs for dual-port RAM, ROM, FIFO Embedded System Blocks (ESB), dual-port RAM / CAM
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Tindminan RoHS [DATA_NEEDED] [DATA_NEEDED: RoHS compliance status]
Logic Elements (typical gates) — 25,000
Fabric Architecture — SRAM-based LUT
Core Voltage — 1.5 V
Configuration Method — External SRAM configuration device (EPC series)
Temperature Grade — Industrial (-40 °C to +100 °C ambient)
Speed Grade — 6
DSP Blocks — MultiCore dedicated multipliers
Boundary Scan — JTAG (IEEE 1149.1) compliant
Clock Management — Dedicated PLL / clock tree circuitry
I/O Bank Count — [DATA_NEEDED: number of user I/O banks]
Lead-Free — [DATA_NEEDED: lead-free status]
Level ng MSL — [DATA_NEEDED: moisture sensitivity level]

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