EP2A25F672C9 vs EP2A25F672I6 比較

詳細並排比較 EP2A25F672C9 由 Altera 與 EP2A25F672I6 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2A25F672C9 EP2A25F672I6
品牌 Altera Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family APEX II APEX II
Logic Elements (LE) Approximately 25,000 —
Macro Cells 2432 —
User I/O 492 —
封裝 672-ball FCBGA (FineLine BGA) 672-ball FineLine BGA (FBGA-672)
Package Dimensions 27 mm x 27 mm —
Ball Pitch 1.0 mm —
Process Technology 0.15 µm all-layer copper, up to 8 metal layers 0.18 µm CMOS
Logic Family CMOS —
Propagation Delay 1.69 ns —
工作溫度 0°C to 85°C (Commercial) —
供應電壓 [DATA_NEEDED: core VCC voltage] —
I/O Standards LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) —
Configuration Passive Serial, Passive Parallel Synchronous, JTAG —
Embedded Memory ESBs for dual-port RAM, ROM, FIFO Embedded System Blocks (ESB), dual-port RAM / CAM
安裝類型 Surface Mount Surface Mount (BGA)
RoHS 狀態 [DATA_NEEDED] [DATA_NEEDED: RoHS compliance status]
Logic Elements (typical gates) — 25,000
Fabric Architecture — SRAM-based LUT
Core Voltage — 1.5 V
Configuration Method — External SRAM configuration device (EPC series)
Temperature Grade — Industrial (-40 °C to +100 °C ambient)
Speed Grade — 6
DSP Blocks — MultiCore dedicated multipliers
Boundary Scan — JTAG (IEEE 1149.1) compliant
Clock Management — Dedicated PLL / clock tree circuitry
I/O Bank Count — [DATA_NEEDED: number of user I/O banks]
Lead-Free — [DATA_NEEDED: lead-free status]
MSL 等級 — [DATA_NEEDED: moisture sensitivity level]

資料表與資源

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